• Journal of the Optical Society of Korea
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• 제13권4호
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• pp.434-438
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• 2009

In this paper, a 12.5-Gb/s optical transmitter is implemented using 0.13-${\mu}m$ CMOS technology. The optical transmitter that we constructed compensates temperature effects of VCSEL (Vertical cavity surface emitting laser) using auto-power control (APC) and auto-modulation control (AMC). An external monitoring photodiode (MPD) detects optical power and modulation. The proposed APC and AMC demonstrate 5$\sim$20-mA of bias-current control and 5$\sim$20-mA of modulation-current control, respectively. To enhance the bandwidth of the optical transmitter, an active feedback amplifier with negative capacitance compensation is exploited. The whole chip consumes only 140.4-mW of DC power at a single 1.8-V supply under the maximum modulation and bias currents, and occupies the area of 1280-${\mu}m$ by 330-${\mu}m$ excluding bonding pads.

• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.25-34
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• 2018

In this paper, we review the latest technical progress and commercialization of stretchable interconnectors, stretchable strain sensors, and stretchable substrates for stretchable electronics. The development of stretchable electronics can pave a way for new applications such as wearable devices, bio-integrated devices, healthcare and monitoring, and soft robotics. The essential components of stretchable electronic devices are stretchable interconnector and stretchable substrate. Stretchable interconnector should have high stretchability and high electrical conductivity as well as stability under severe mechanical deformation. Therefore several nanocomposite-based materials using CNT, graphene, nanowire, and metal flake have been developed. Geometric engineering such as wavy, serpentine, buckled and mesh structure has been well developed. Stretchable substrate should also pose high stretchability and compatibility with stretchable sensing or interconnecting material. We summarize the recent research results of new materials for stretchable interconnector and substrate as well as strain sensors. The Important challenges in development of the stretchable interconnector and substrate are also briefly discussed.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.1-8
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• 2020

In this paper, the principles, characteristics and recent studies of the laser micro soldering are reviewed. The factors which influence laser micro welding and soldering are also included. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled laser beam. In recent electronics industry, the demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro-joint. In laser soldering, there are several important factors like laser absorption, laser power, laser scanning speed, and etc, which affect laser solderability. The laser absorption ratio depends on materials, and each material has different absorption or reflectivity for the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance, and these are also reviewed.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.7-13
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• 2019

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

• 센서학회지
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• 제15권4호
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• pp.277-283
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• 2006

We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.157-172
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• 2005

기존 단말기에 Fine Pitch (0.3mm) WLCSP를 개발/적용해 봄으로써 SMT 조립 한계로 인식되고 있는 Pitch인 0.4mm이하의 접속 기술을 검증함. Set Maker 입장에서 Fine Pitch를 가진 Customized Package를 적용할 경우, Design 단계에서부터 부품, 기판, 조립공법, Infrastructure등을 동시에 검토해야 함. 이동단말의 소형화/박형화 경쟁이 가속화 되는 가운데 Package Pitch만을 고려해 볼 때, 2006년에는 0.4mm Pitch를 가진 BGA의 적용이 확대 될 것으로 예상되며 일부 제품에서 0.3mm Pitch Package의 적용도 예상됨.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.183-199
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• 2002

Reliability.The reliability strongly depended on the CTE of underfill resin..The fractured portion was identical with the maximum plastic equivalent strain..1 % or less value of the maximum plastic equivalent strain certified more than 1000 cycle of TCT life. UFB.Bonding accuracy was confirmed within2$2{\mu}{\textrm}{m}$..The fundamental bondability of UFB was confirmed with no damage around aluminum pads. Some dislocations and vacancies were observed at the interface, however, the atomic level bonding was confirmed. CBB.Dry process was applied to UBM removal.