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http://dx.doi.org/10.5369/JSST.2006.15.4.277

Development of silicon based flexible tactile sensor array mounted on flexible PCB  

Kim, K.N. (Nano Mechatronics Research Center, Korea Electronics Technology Institute)
Kim, Y.K. (Dept. of Electronics and Computer Engineering, Korea University)
Lee, K.R. (Nano Mechatronics Research Center, Korea Electronics Technology Institute)
Cho, W.S. (Dept. of Electronics and Computer Engineering, Korea University)
Lee, D.S. (Nano Mechatronics Research Center, Korea Electronics Technology Institute)
Cho, N.K. (Nano Mechatronics Research Center, Korea Electronics Technology Institute)
Kim, W.H. (Nano Mechatronics Research Center, Korea Electronics Technology Institute)
Park, J.H. (School of Electrical Engineering, Korea University)
Kim, S.W. (Dept. of Electronics and Computer Engineering, Korea University)
Ju, B.K. (School of Electrical Engineering, Korea University)
Publication Information
Journal of Sensor Science and Technology / v.15, no.4, 2006 , pp. 277-283 More about this Journal
Abstract
We presented that fabrication process and characteristics of 3 axes flexible tactile sensor available for normal and shear force fabricated using Si micromachining and packaging technologies. The fabrication processes for 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1 %/N and 0.5 %/N in applying normal and shear force, respectively. The flexibility of fabricated 3 axes flexible tactile sensor array was good enough to place on the finger-tip.
Keywords
flexible tactile sensor; FPCB; normal and shear force; package;
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