Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Laser Micro-Joining and Soldering

레이저 마이크로 접합 및 솔더링

  • Hwang, Seung Jun (Department of Materials Science and Engineering, University of Seoul) ;
  • Kang, Hye Jun (Department of Materials Science and Engineering, University of Seoul) ;
  • Kim, Jeng O (Korea Institute of Machinery & Materials) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
  • 황승준 (서울시립대학교 신소재공학과) ;
  • 강혜준 (서울시립대학교 신소재공학과) ;
  • 김정오 (한국기계연구원) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2019.08.20
  • Accepted : 2019.09.04
  • Published : 2019.09.30
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Abstract

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

Keywords

References

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