• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.21-27
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• 2022

Flexible pressure sensor was developed using low-cost conductive graphite as printed electronics. Flexible pressure sensors are attracting attention as materials to be used in future industries such as medical, games, and AI. As a result of evaluating various electromechanical properties of the printed electrode for flexible pressure sensors, it showed a constant resistance change rate in a maximum tensile rate of 20%, 30° tension/bending, and a simple pulse test. A more appropriate matrix pattern was designed by simulating the electrodes for which this verification was completed. Utilizing the Serpentine pattern, we utilized a process that allows simultaneous fabrication and encapsulation of the matrix pattern. One side of the printed graphite electrode was O₂ plasma surface treated to increase adhesive strength, rotated 90 times, and two electrodes were made into one through a lamination process. As a result of pasting the matrix pattern prepared in this way to the wrist pulse position of the human body and proceeding with the actual measurement, a constant rate of resistance change was shown regardless of gender.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.63-69
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• 2012

Adhesion and mechanical reliability of silicon/epoxy/polyimide interfaces are critical issues for flexible electronics. Bonds between these interfaces are mainly hydrogen bonds, so their adhesion is weaker than cohesive fracture toughness and vulnerable to moisture. In order to enhance adhesion and suppress moisture-assisted debonding, UV/Ozone treatment and innovative sol-gel derived hybrid layers were applied to silicon/epoxy/polyimide interfaces. The fracture energy and subcritical crack growth rate were measured by using a double cantilever beam (DCB) fracture mechanics test. Results showed that UV/Ozone treatment increased the adhesion, but was not effective for improving reliability against humidity. However, by applying sol-gel derived hybrid layers, adhesion increase as well as suppresion of moisture-assisted cracking were achieved.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.230-233
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• 2003

In this paper, the wideband microstrip patch antennas for the Personal communications Service $(PCS\;:\;1750\~1870\;MHz)$ and International Mobile Telecommunications-2000 $(IMT-2000\;:\;1920\~2170\;MHz)$ dual band are studied. Experimental and simulation results on the dual band antenna are presented. Simulation results are in good agreement with measurements. The experimental and simulation results confirm the wideband characteristics of the antenna. The studied antenna satisfied the wideband characteristics that are required characteristics for above 420 MHz impedance bandwidth for the PCS and IMT-2000 dual band antenna. In this paper, through the designing of a dual band antenna, we have presented the availability for PCS & IMT-2000 base station antenna. An impedance bandwidth of $31\%(VSWR<1.5,\;615\;MHz)$ and a maximum gain of 7dBi can be achieved. The radiation pattern is stable across the passband.

• Journal of Information Display
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• v.10 no.2
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.264-269
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• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.43-47
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• 2004

A coupler or divider is a microwave passive component used for power coupling or dividing. Regarding the trend of current telecommunication systems monolithic integration of passive components is highly desirable. In this study by the LTCC(Low temperature co-fired ceramics) technology a 2012 size type dual band coupler with multi-layer structure was fabricated. To achieve the desired coupling values for both DCS and EGSM bands, broad side coupled patterns were used with multi-layer structure. Its characteristics such as coupling, insertion loss, isolation and directivity values were measured and compared with simulation results.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.1-12
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• 2021

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.