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V-Band filter using Multilayer MCM-D Technology  

Yoo Chan-Sei (The school of electrical engineering & computer science, Seoul National University)
Song Sang-Sub (The school of electrical engineering & computer science, Seoul National University)
Part Jong-Chul (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
Kang Nam-Kee (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
Cha Jong-Bum (Electronic Materials & Packaging Research Center, Korea Electronics Technology Institute)
Seo Kwang-Seok (The school of electrical engineering & computer science, Seoul National University)
Publication Information
Abstract
Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.
Keywords
SOP-D; V-band filter; resonator; edge coupled;
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  • Reference
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