• Title/Summary/Keyword: electro thermal

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Thermal, electrical and mechanical buckling loads of sandwich nano-beams made of FG-CNTRC resting on Pasternak's foundation based on higher order shear deformation theory

  • Arani, Ali Ghorbanpour;Pourjamshidian, Mahmoud;Arefi, Mohammad;Arani, M.R. Ghorbanpour
    • Structural Engineering and Mechanics
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    • v.69 no.4
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    • pp.439-455
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    • 2019
  • This research deals with thermo-electro-mechanical buckling analysis of the sandwich nano-beams with face-sheets made of functionally graded carbon nano-tubes reinforcement composite (FG-CNTRC) based on the nonlocal strain gradient elasticity theory (NSGET) considering various higher-order shear deformation beam theories (HSDBT). The sandwich nano-beam with FG-CNTRC face-sheets is subjected to thermal and electrical loads while is resting on Pasternak's foundation. It is assumed that the material properties of the face-sheets change continuously along the thickness direction according to different patterns for CNTs distribution. In order to include coupling of strain and electrical field in equation of motion, the nonlocal non-classical nano-beam model contains piezoelectric effect. The governing equations of motion are derived using Hamilton principle based on HSDBTs and NSGET. The differential quadrature method (DQM) is used to calculate the mechanical buckling loads of sandwich nano-beam as well as critical voltage and temperature rising. After verification with validated reference, comprehensive numerical results are presented to investigate the influence of important parameters such as various HSDBTs, length scale parameter (strain gradient parameter), the nonlocal parameter, the CNTs volume fraction, Pasternak's foundation coefficients, various boundary conditions, the CNTs efficiency parameter and geometric dimensions on the buckling behaviors of FG sandwich nano-beam. The numerical results indicate that, the amounts of the mechanical critical load calculated by PSDBT and TSDBT approximately have same values as well as ESDBT and ASDBT. Also, it is worthy noted that buckling load calculated by aforementioned theories is nearly smaller than buckling load estimated by FSDBT. Also, similar aforementioned structure is used to building the nano/micro oscillators.

Buckling treatment of piezoelectric functionally graded graphene platelets micro plates

  • Abbaspour, Fatemeh;Arvin, Hadi
    • Steel and Composite Structures
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    • v.38 no.3
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    • pp.337-353
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    • 2021
  • Micro-electro-mechanical systems (MEMS) are widely employed in sensors, biomedical devices, optic sectors, and micro-accelerometers. New reinforcement materials such as carbon nanotubes as well as graphene platelets provide stiffer structures with controllable mechanical specifications by changing the graphene platelet features. This paper deals with buckling analyses of functionally graded graphene platelets micro plates with two piezoelectric layers subjected to external applied voltage. Governing equations are based on Kirchhoff plate theory assumptions beside the modified couple stress theory to incorporate the micro scale influences. A uniform temperature change and external electric field are regarded along the micro plate thickness. Moreover, an external in-plane mechanical load is uniformly distributed along the micro plate edges. The Hamilton's principle is employed to extract the governing equations. The material properties of each composite layer reinforced with graphene platelets of the considered micro plate are evaluated by the Halpin-Tsai micromechanical model. The governing equations are solved by the Navier's approach for the case of simply-supported boundary condition. The effects of the external applied voltage, the material length scale parameter, the thickness of the piezoelectric layers, the side, the length and the weight fraction of the graphene platelets as well as the graphene platelets distribution pattern on the critical buckling temperature change and on the critical buckling in-plane load are investigated. The outcomes illustrate the reduction of the thermal buckling strength independent of the graphene platelets distribution pattern while meanwhile the mechanical buckling strength is promoted. Furthermore, a negative voltage, -50 Volt, strengthens the micro plate stability against the thermal buckling occurrence about 9% while a positive voltage, 50 Volt, decreases the critical buckling load about 9% independent of the graphene platelet distribution pattern.

Study on the Thermal Stability of PEDOT/PSS Film Hybrided with Graphene Oxide (그래핀 옥사이드와 복합화한 PEDOT/PSS 필름의 열적 안정성에 관한 연구)

  • Choi, Jong Hyuk;Park, Wan-Su;Lee, Seong Min;Chung, Dae-won
    • Applied Chemistry for Engineering
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    • v.27 no.4
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    • pp.402-406
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    • 2016
  • In order to investigate the thermal stability of electro-conductive poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate) (PEDOT/PSS), we have prepared films by casting PEDOT/PSS aqueous solution without using a binding material and measured surface resistances of the films while annealing at $200^{\circ}C$. Electrical properties of films were improved by annealing, and the maximum conductivity ($540S{\cdot}m^{-1}$) after annealing for 2 hrs was found to be approximately 3 times higher than that ($180S{\cdot}m^{-1}$) of the original film. The conductivities, however, dramatically decreased with an increase in annealing time and dissipated after 24 hrs of annealing. On the other hand, PEDOT/PSS films hybridized with graphene oxide (GO) displayed a salient improvement in conductivity by annealing, which was measured to be around $600S{\cdot}m^{-1}$ even after 30 hrs of annealing at $200^{\circ}C$. We tentatively conclude that hybridization with GO enhances the thermal stability of PEDOT/PSS.

Electrochemical properties of heat-treated multi-walled carbon nanotubes (열처리된 탄소나노튜브 상대전극의 전기화학적 특성 연구)

  • Lee, S.K.;Moon, J.H.;Hwang, S.H.;Kim, G.C.;Lee, D.Y.;Kim, D.H.;Jeon, M.H.
    • Journal of the Korean Vacuum Society
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    • v.17 no.1
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    • pp.67-72
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    • 2008
  • We have studied the effect of heat treatment of multi-walled carbon nanotubes (MWNTs) as a counter electrode on the electro-chemical properties of dye-snsitized solar cells. MWNTs on the p-type Si substrate were synthesized by thermal chemical vapor deposition (CVD) using Fe catalysts. We prepared the two types of MWNTs samples with the different diameters. The rapid thermal annealing (RTA) treatment for the MWNTs was carried out at the growth temperature ($900^{\circ}C$) for 1 minute with $N_2$ gas atmosphere. The structural, electrical and electrochemical properties of MWNTs were investigated by field-emission scanning electron microscopy (FE-SEM), Raman spectroscopy, 2-point probe station and electrochemical impedance spectroscopy (EIS). The I(D)/I(G) ratio of heat-treated MWNTs in Raman spectra was considerably decreased. It was also found that the heat-treated MWNTs showed better redox reaction of iodide at the interface between MWNTs surface and electrolyte than that of as-grown MWNTs. The redox resistance value of heat-treated electrodes was measured to be much lower than that of as-grown electrode at the interface. As a result, the counter electrode using the heat-treated MWNTs showed better electrochemical properties.

Thermal and Electrical Behaviors of Polyethylene Oxide/Polyaniline Fibers Prepared by Electrospinning Method (전기방사법에 의해 제조된 폴리에틸렌옥사이드/폴리아닐린 섬유의 열적 및 전기적 거동)

  • Kim, Seok;Cho, Mi-Hwa;Park, Soo-Jin
    • Applied Chemistry for Engineering
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    • v.17 no.1
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    • pp.16-21
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    • 2006
  • In this study, PEO blend fibers mixed with polyaniline (PANI)/10-camphor sulfonic acid (CSA) and PANI/dodecylbenzene sulfonic acid (DBSA) were electro spun to investigate the influence of PANI content. CSA and DBSA were used as a functionalized doping acid having a bulky volume. PANI/PEO blend solution was prepared by dissolving PEO and PANI doped with CSA or DBSA. The thermal properties were measured by thermogravimetric analyzer (TGA). As a result, with increasing of the PANI content in PANI/CSA and PANI/DBSA, although initial decomposition temperature (IDT) was decreased, thermal stability was increased due to the increase of $A^*{\cdot}K^*$ and integral procedural decomposition temperature (IPDT). The electrical conductivities measured by the 4-probe method. The electric conductivity was increased with increasing of PANI content in PANI/CSA and PANI/DBSA. However, electrical conductivity did not change significantly beyond 30% content of PANI. From CV results, PANI/CSA showed the better defined peak shpae and higher peak current density compared to PANI/DBSA. This was probably related to the slightly higher electrical conductivity or better morphology for easy charge transfer in the case of PANI/CSA.

A Study on the Thermo-Mechanical Stress of MEMS Device Packages (마이크로 머신(MEMS) 소자 패키지의 열응력에 대한 연구)

  • Jeon, U-Seok;Baek, Gyeong-Uk
    • Korean Journal of Materials Research
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    • v.8 no.8
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    • pp.744-750
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    • 1998
  • Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

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Surface Characteristics of Silicon Substrates Coated with Self-assembled Mono-layers (자체조립 단일막으로 코팅된 실리콘 기판의 표면특성)

  • 최성훈;강호종
    • Polymer(Korea)
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    • v.28 no.1
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    • pp.3-9
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    • 2004
  • Silane modified perfluoropolyethers (SPFPE) was synthesized as a self-assembled mono-layers (SAMs) thin film for micro-electro mechanical system (MEMS). SPFPE was compared to the Perfluoropolyethers (PFPE) as well as octadecyltrichlorosilane (OTS) and perfluorooctyltrichlorosilane (FOTS) with respect to the development of hydrophobicity in the SAMs surface. SPFPE shows less hydrophobicity than those of OTS and FOTS. Thermal annealing of SPFPE SAMs resulted in the enhancement of hydrophobicity as much as those of OTS and FOTS. The SAMs formed from SPFPE were found to be similar as OTS and FOTS SAMs with smooth R$\sub$a/ values of 0.3 nm. However, the flexible chain mobility of SPFPE resulted in 50% reduction as much as the fiction force in OTS.

A Study on Structures and Properties of Liquid Crystal-UV Curable Resin Composite Materials (액정-UV경화 이크릴레이트 수지 복합재료의 구조와 물성에 관한 연구)

  • 김종원
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.1
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    • pp.59-69
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    • 2000
  • The characteristics of liquid crystal polymer composite(LCPC) films are possessed of large-area and flexible display, polarizer free, high contrast, wide angle of visual filed and high responsiveness. It is well known that the LCPC films consisting of a continuous LC phase embeded in a three-dimentional network of polymer matrix are formed by photopolymerization-induced phase separation. In this study, we have investigated the point that both liquid crystals and polymer having different properties have to coexiste as composed films. The purpose of this study has been the development of new application with liquid crystals and UV-curable monomers. In the results abtained on the miscibility of nematic liquid crystal and UV-curable resins, difunctional monomer HX-620 turned out to shows the best. From the results abtained on structures, electro-optical properties and dynamic visocoelasticity for LCPC films, the best mixing ratio of monomer to LC mixture were 3/7(photoinitiator; 4wt%) by weight, and this ratio has been provided the most thermal stability for LCPC films. In the results abtained on structure and discoloration properties of LCPC films, it has been demonstrated that consiste of a 8:2 mixture of chiral nematic liquid crystal and HX-620 has the greatest domain and it was the best discoloration.

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Structural and Morphological Changes of Co Nanoparticles and Au-10at.%Pd Thin Film Studied by in Situ Heating in a Transmission Electron Microscope

  • Ji, Yoon-Beom;Park, Hyun Soon
    • Applied Microscopy
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    • v.47 no.3
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    • pp.208-213
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    • 2017
  • The microstructural changes in Co nanoparticles and an Au-10at.%Pd thin film have been investigated using an in situ heating holder with a micro-electro-mechanical system (MEMS). In Co nanoparticles, two phases (face-centered cubic and hexagonal close-packed crystal structures) were found to coexist at room temperature and microstructures at temperatures, higher than $1,000^{\circ}C$, were observed with a quick response time and significant stability. The actual temperature of each specimen was directly estimated from the changes in the lattice spacing (Bragg-peak separation). For the Au-10at.%Pd thin film, at a set temperature of $680^{\circ}C$, the actual temperature of the sample was estimated to be $1,020^{\circ}C{\pm}123^{\circ}C$. Note that the specimen temperature should be carefully evaluated because of the undesired effects, i.e., the temperature non-uniformity due to the sample design of the MEMS chip, and distortion due to thermal expansion.

Fibromyalgia Syndrome Combined with Insomnia and Depression Disorder Managed with Korean Medical Treatment: A Case Report (한의학적 치료로 호전된 불면과 우울을 동반한 섬유근통 증후군 환자 치험 1례)

  • Kim, Eui-su;Shin, Min-koo;Kim, Tae-ryun;Oh, Jae-seon;Ma, Young-hun;Le, Young-su
    • The Journal of Internal Korean Medicine
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    • v.36 no.3
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    • pp.400-409
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    • 2015
  • Objectives The study aimed to evaluate the therapeutic effect of Hyungtonghaeul-tang along with Korean medicine treatment for fibromyalgia syndrome. Methods A patient with fibromyalgia syndrome was treated with Hyungtonghaeul-tang as well as Korean medical treatment including acupuncture, electro-acupuncture, bee venom therapy, chuna, aromatherapy, and physical therapy. The counts of tenderness points, widespread pain index (WPI), symptom severity scale score (SS scale score), digital infrared thermal imaging (DITI), Ryodoraku diagnosis, visual analogue scale (VAS), fibromyalgia impact questionnaire (FIQ), and beck depression inventory (BDI) were measured. Results After treatment, the counts of tenderness point, WPI, SS scale score, VAS, FIQ, and BDI were decreased. The DITI and the Ryodoraku pattern recovered normally. Conclusions Hyungtonghaeul-tang along with Korean medicine treatment can be used in the treatment of fibromyalgia syndrome.