• 한국해양환경ㆍ에너지학회지
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• 제12권3호
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• pp.209-216
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• 2009

선박평형수를 통한 수중생물의 이동을 막기 위해, IMO에서는 2004년 2월 선박 평형수와 침전물 관리 국제협약을 제정하였다. 이 협약을 위해, 각국은 협약 비준과 법제화를 준비하고 협약의 성능기준을 만족시킬 수 있는 처리장치 개발을 촉진시키고 있다. Electro-$Cleen^{TM}$ 처리장치는 2006년 3월 IMO 기본승인을 받았고, 2008년 10월 최종승인을 받았다. 형식승인은 한국 정부로부터 2008년 12월에 발급되었다. 본 논문은 Electro-$Cleen^{TM}$ 처리장치의 기본 원리, 구성 요소, 실선 설치 및 선상 시험 내용을 검토하였다. 선상 시험은 8300 GT M/V Yokohama와 27,000 DWT M/V Greenwing으로 수행하였다. 이들 선상 시험을 통해 Electro-$Cleen^{TM}$ 처리장치가 IMO 기준을 만족시키며 신조선 및 현존선에 설치하기가 적합함을 확인하였다.

• 한국세라믹학회지
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• 제46권2호
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• pp.175-180
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• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.108-108
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• 2007

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.

• 한방재활의학과학회지
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• 제32권2호
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• pp.105-121
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• 2022

Objectives This study was conducted to evaluate the effect of electro-acupuncture for sciatica. Methods We searched 13 online databases (Kmbase, Research Information Sharing Service [RISS], National Digital Science Library [NDSL], Oriental Medicine Advanced Searching Integrated System [OASIS], Koreanstudies, Koreantk, DBpia, PubMed, Cochrane, EMBASE, Medline, China National Knowledge Infrastructure [CNKI], J-stage) to find randomized-controlled clinical trials (RCTs) that used electro-acupuncture for sciatica. Efficacy rate and visual analogue scale (VAS) were mainly analyzed as a main evaluation criteria. Results Among 583 articles that were searched, 24 RCTs were finally selected and 18 RCTs were statistically analyzed. Electro-acupuncture was more effective than acupuncture in terms of efficacy rate (p<0.00001) and VAS (p<0.00001). Also, Electro-acupuncture was more effective than western medication in terms of efficacy rate (p=0.0005). However, the effectiveness of electro-acupuncture was not identified compared to physical therapy (p=0.42). Electro-acupuncture significantly improved efficacy rate when combined with physical therapy than physical therapy alone (p<0.0001). In addition, electro-acupuncture plus Chuna manual therapy compared to Chuna manual therapy alone showed positive results for efficacy rate (p=0.05) and VAS (p<0.0001). Conclusions Based on results, the effectiveness of electro-acupuncture for sciatica was identified. However, this study has limitations because the RCTs included in this study were small in number and published in a particular region. Although this study could be a groundwork for well designed research for sciatica.

• 대한기계학회논문집B
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• 제34권2호
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• pp.105-111
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• 2010

양극산화법과 DRIE 법으로 제작된 다공성 실리콘막을 이용하여 두 종류의 전기침투 펌프를 제작하였다. 펌프의 성능은 유기용매를 이용하여 유량과 단위전류당 유량으로 측정하였다. 두 종류 펌프 모두 기존의 다공성 유리막으로 제작된 전기침투 펌프보다 성능이 우월했다. 특히 DRIE 법으로 제작된 다공성 실리콘막은 유량과 단위전류당 유량이 모두 월등한 성능을 보였다. DRIE 법은 널리 알려진 방법이기에 이와 같이 제작된 펌프는 다양한 응용 분야에 비교적 쉽게 적용될 것으로 기대된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.24-24
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• 2009

ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.

• 한국재료학회지
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• 제19권9호
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• pp.499-503
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• 2009

Transparent ITO films were deposited on a polycarbonate substrate with RF magnetron sputtering in a pure argon (Ar) and oxygen ($O_2$) gas atmosphere, and then post deposition electro annealed for 20 minutes in a $4{\times}10^{-1}$ Pa vacuum. Electron bombardment with an accelerating voltage of 100 V increased the substrate temperature to $120^{\circ}C$. XRD analysis of the deposited ITO films did not show any diffraction peaks, while electro annealed films indicated the growth of crystallites on the (211), (222), and (400) planes. The sheet resistance of ITO films decreased from 103 to $82{\Omega}/\square$. The optical transmittance of ITO films in the visible wavelength region increased from 85 to 87%. Observation of the work function demonstrated that the electro-annealing increased the work function of ITO films from 4.4 to 4.6 eV. The electro annealed films demonstrated a larger figure of merit of $3.0{\times}10^{-3}{\Omega}^{-1}$ than that of as deposited films. Therefore, the electro annealed films had better optoelectrical performances than as deposited ITO films.

• 대한의용생체공학회:의공학회지
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• 제16권2호
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• pp.239-248
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• 1995

The method of increasing signal to noise ratio (SNR) in a Hadamard transform spectrometer (HTS) is multiplexing. The multiplexing is executed by a mask. Conventional masks are mechanical or electro-optical. A mechanical mask has disadvantages of jamming and misalignment. A stationary electro-optical mask has a disadvantage of information losses caused by spacers which partition mask elements. In this paper, a mixed-concept electro-optical mask (MCEOM) is developed by expanding the length of a spacer to that of lon-off mask element. An MCEOM is operated by stepping a movable mask. 2N measurements are required for N spectrum estimates. The average mean square error (AMSE) using MCEQM is equal to that using a stationary electro-optical mask without spacers for large N. The cost of manufacturing an MCEOM is lower than that of producing a conventional electro-optical mask because an MCEOM needs only (N + 1)/2 on-off mask elements whereas the con¬ventional electro-optical mask needs N on-off mask elements. There are no information losses in the spectrometers having an MCEOM.

• 한국정밀공학회지
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• 제33권6호
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• pp.485-490
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• 2016

This study focused on developing an electro-discharge truing method for the ELID grinding process using a metal-bonded grinding wheel. The truing process in grinding plays important roles in enhancing the quality of the ground surface. In this study, a reference current in the electro-discharge truing process was confirmed to be a viable solution for efficient truing through performance experiments. Current and voltage variation experiments were carried out and the variation output data were collected with a monitoring program to understand the electrodischarge phenomenon that occurs between metal-bonded grinding wheels and copper electrodes. The experimental results showed that as the reference current decreased, the average electro-discharge energy decreased. Therefore, the reference current can be used as an indicator to estimate the size of the gap between the truer and grinding wheel.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.