• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.6
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• pp.1203-1211
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• 2017

This paper proposes a robust controller for flexible joint robots to achieve tracking performance and to improve robustness against both matched and mismatched disturbances. The proposed controller consists of a disturbance observer(DOB), passivity-based controller, and integral sliding mode controller(ISMC) in a backstepping manner. The DOB compensates the mismatched disturbance in the link-side and formulates the reference input for the motor-side controller. Interconnection and damping assignment passivity-based controller (IDA-PBC) performs tracking control of motor-side, and it is integrated to nominal control of ISMC to guarantee the over-all stability of the nominal system, while, matched disturbances are decoupled by the discontinuous control of ISMC. In the design of the link-side controller, PD type impedance controller is designed with DOB and this leads the continuous control input which is suitable to the reference input for the motor-side.

• Journal of Sensor Science and Technology
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• v.29 no.5
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.8 s.111
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• pp.732-738
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• 2006

Divide-by-2 and divide-by-4 circuits which can operate up to 10 GHz are designed. A design method used in these circuits is the TSPC(True Single Phase Clocking) topology. The structure of the TSPC dividers is very simple because they need only a single clock and purely consist of smalt sized cmos devices. Through measurements, we find the fact that in proportion to the bias voltage, the free running frequency increases and the operation region also moves toward a higher frequency region. For operating conditions of bias voltage $3.0{\sim}4.0V$, input power 16dBm and dcoffset $1.5{\sim}2.0V$, 5 GHz and 2.5 GHz output signals divided by 2 and 4 are measured. The layout size of the divide-by-2 circuit is about $500{\times}500 um^2$($50{\times}40um^2$ except pad interconnection part).

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.83-93
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• 2014

It is a widespread concern that electrical interconnection based network-on-chip (NoC) will ultimately face the limitation in communication bandwidth, transmission latency and power consumption in the near future. With the development of silicon photonics technology, a hybrid optical network-on-chip (HONoC) which embraces both electrical- and optical interconnect, is emerging as a promising solution to overcome these problems. Today's leading edge systems-on-chips (SoCs) comprise heterogeneous many-cores for higher energy efficiency, therefore, extended study beyond regular topology based NoC is required. This paper proposes an energy and latency optimization topology design technique for HONoC taking into account the traffic characteristics of target applications. The proposed technique is implemented with genetic algorithm and simulation results show the reduction by 13.84% in power loss and 28.14% in average latency, respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.12
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• pp.1682-1688
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• 2017

In modern society, the number of industrial customers using equipment sensitive particularly to voltage sags is rapidly increasing. As voltage sags can cause loss of information as well as false operation of the control device, it results in the vast economic damage in industrial processes. One way to mitigate voltage sags in the sensitive loads is the installation of distributed generation (DGs) on the periphery of these loads. In addition, renewable energy sources are currently in the spot light as the potential solution for the energy crisis and environmental issues. In particular, wind power generation which is connected to a grid is rising rapidly because it is energy efficient and also economically feasible compared to other renewable energy sources. On the basis of the above information, in this paper, with Wind Turbine Generators (WTGs) installed nearby the sensitive load, the analysis of the mitigating effect comparison by types of WTGs is performed using voltage sag assessment on the IEEE-30 bus test system. That is, the areas of vulnerability according to types of WTGs are expected to be different by how much reactive power is produced or consumed as WTG reactive power capability is related to the types of WTGs. Using the concept of 'Vulnerable area' with the failure rate for buses and lines, the annual number of voltage sags at the sensitive load with the installation of WTGs per type is studied. This research will be anticipated to be useful data when determining the interconnection of wind power generation in the power system with the consideration of voltage sags.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.5 no.7
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• pp.1274-1292
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• 2011

Due to the variety of household electric devices and different power consumption habits of consumers at present, general home energy management (HEM) systems suffer from the lack of dynamic identification of various household appliances and a unidirectional information display. This study presented a set of intelligent interconnection network systems for electric appliances, which can measure the power consumption of household appliances through a current sensing device based on OSGi platform. The system establishes the characteristics and categories of related electric appliances, and searches the corresponding cluster data and eliminates noise for recognition functionality and error detection mechanism of electric appliances by applying the clustering algorithm. The system also integrates household appliance control network services so as to control them according to users' power consumption plans or through mobile devices, thus realizing a bidirectional monitoring service. When the system detects an abnormal operating state, it can automatically shut off electric appliances to avoid accidents. In practical tests, the system reached a recognition rate of 95%, and could successfully control general household appliances through the ZigBee network.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.911_912
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• 2009

최근 화석에너지원의 고갈과 고유가 및 지구 온난화 방지를 위해 국가별로 이산화탄소 배출량을 규제하기 시작하면서 신재생 에너지의 계통연계 시스템에 대한 관심이 높아지고 있다. 그 중 연료전지가 한 부분을 차지하고 있으며, 연료전지는 친환경적이고 효율적인 에너지원으로서 근 미래의 새로운 대체 에너지로서 각광 받으며 여러 분야의 전기장치로 사용될 수 있다. 연료전지는 낮은 출력전압과 높은 출력전류를 갖는 특징이 있으며 부하에 따라 출력전압이 변화하는 특성이 있기 때문에 연료전지의 계통연계를 위해서는 다양한 부하조건에서 연료전지와 연동된 승압형 컨버터의 제작이 반드시 필요하다. 본 논문에서는 연료전지의 계통연계를 위한 고효율 DC-DC컨버터를 제안하였고, 1.2kW용량의 연료전지 스택(Stack)과 연계한 실험을 통하여 그 유용성을 입증하였다.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.5 s.122
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• pp.448-455
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• 2007

As Decentralized Generation(DG) becomes more reliable and economically feasible, it is expected that a higher application of DG units would be interconnected to the existing grids. This new market penetration of DG technologies is linked to a large number of factors like technologies costs and performances, interconnection issues, safety, market regulations, environmental issues or grid connection constrains. This paper describes the procedures and results for the mechanical, electrical, and environmental tests of MGT on actual grid-connection under Korean regulations. As one of the achievements, the simulation model of MGT was developed, so that it will be able to analyze or propose new distributed generation system using MGT. The field test was conducted in order to respond to a wide variety of needs for noise reduction and utilization and its performance was evaluated in consideration of its operational problems. The MGT is successfully supplying electricity to Korean grids with satisfying various regulations. The suggested strategy and experience for the evaluation of the distributed generation will be used for the introduction of other distributed generation technologies into the grid in the future.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.349-350
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• 2006

정부의 배전분할 유보결정에 따라 전력거래소에서는 현행 발전경쟁시장의 효율성 향상을 위한 많은 사업을 추진하고 있다. 그중 우선적으로 추진하였던 사업이 도매전력시장을 대비해 구축한 시장운영시스템(MOS; Market Operation System)을 현행 계통운영을 담당하고 있는 급전 자동화시스템(EMS; Energy Management System)과의 연계활동이다. 이는 시장운영시스템(MOS)에 내재되어 있는 최첨단 기능중에서 일부를 현행 전력시장에 적용함으로써 계통운영의 효율성 향상뿐만 아니라 계통운영기술을 선진화하는 것이다. 특히, 기존 급전시스템에 비해 가장 두드러지는 점은 발전기들에 대한 에너지 및 예비력 급전계획을 사전적으로 5분단위로 최적화하여 수립하고 이를 발전기들에게 송신함으로써 경제적이며 안정적인 전력계통운영을 가능하게 해 줄 수 있는 것이다. 이를 가능하게 하기 위해서는 바로 정확한 미래 수요수준의 결정이 필수불가결한 요소이다. 따라서 본 논문에서는 MOS-EMS 연계활용에서의 실시간 수요예측의 중요성과 기존 제작사의 알고리즘과 국내 전력수요특성간의 불일치점 그리고 이를 해결하고자 모색했던 방안들에 대하여 설명하고자 한다.