Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique
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Yang, Chung Mo
(National Nano Fab Center)
Kim, Hee Yeoun (National Nano Fab Center) Park, Jong Cheol (National Nano Fab Center) Na, Ye Eun (National Nano Fab Center) Kim, Tae Hyun (National Nano Fab Center) Noh, Kil Son (National Nano Fab Center) Sim, Gap Seop (National Nano Fab Center) Kim, Ki Hoon (Ubitronics) |
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