• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

• 대한전기학회논문지
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• 제37권2호
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• pp.122-129
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• 1988

A design method of decentralized state observer for large scale interconnected systems is proposed by the use of interconnection rejection approach and interconnection modelling technique. The proposed design method is developed based on the interconnection partitioning. Therefore partitioning conditions are suggested. And the conditions for observer pole assignment and observer parameter determination procedures are described for possible interconnection patterns. The decentralized state observer gives good estimates without any information on the interconnection variables and estimations. In addition, a numerical example is given to explain the design procedures and to show the estimation performance of the decentralized observer.

• 대한기계학회논문집A
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• 제30권4호
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• pp.373-378
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• 2006

We present the design, fabrication, and characterization of a multi-chip microelectrofluidic bench, achieving both electrical and fluidic interconnections with a simple, low-loss and low-temperature electrofluidic interconnection method. We design 4-chip microelectrofluidic bench, having three electrical pads and two fluidic I/O ports. Each device chip, having three electrical interconnections and a pair of two fluidic I/O interconnections, can be assembled to the microelectofluidic bench with electrical and fluidic interconnections. In the fluidic and electrical characterization, we measure the average pressure drop of $13.6{\sim}125.4$ Pa/mm with the nonlinearity of 3.1 % for the flow-rates of $10{\sim}100{\mu}l/min$ in the fluidic line. The pressure drop per fluidic interconnection is measured as 0.19kPa. Experimentally, there are no significant differences in pressure drops between straight channels and elbow channels. The measured average electrical resistance is $0.26{\Omega}/mm$ in the electrical line. The electrical resistance per each electrical interconnection is measured as $0.64{\Omega}$. Mechanically, the maximum pressure, where the microelectrofluidic bench endures, reaches up to $115{\pm}11kPa$.

• 대한전기학회논문지:전력기술부문A
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• 제48권9호
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• pp.1096-1102
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• 1999

This paper discusses the evaluation of interconnection capacity of small cogeneration(SCOGN) systems to the power distribution systems from the viewpoint of voltage regulation. Power utilities are required to keep the customers' voltage profile over a feeder close to the rated value under all load conditions. However, it is expected that the interconnection of SCOGNs to the power distribution systems impacts on the existing voltage regulation method and customers' voltage variations. Therefore, SCOGNs should be integrated to the automated power distribution systems to prevent interconnection problems and supply high quality electricity to the customers. For these reasons, we should proceed with the evaluation of interconnection capacity of SCOGNs to the power distribution systems. However, it is generally impossible to perform actual testing on the power distribution systems, and standardized methodologies and guidelines are not developed to evaluate it. The criterion indexes for voltage regulation and variations are presented in order to evaluate the interconnection capacity of SCOGNs to the power distribution systems. In addition, the evaluation methodology of interconnection capacity of SCOGNs for power distribution systems is presented. It is expected that the resulted of this paper are useful for power system planners to determine the interconnection capacity of SCOGNs and dispersed storage and generation (DSG) systems to the power distribution systems.

• Journal of Power Electronics
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• 제10권1호
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• pp.97-105
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• 2010

This paper presents the modeling, control and simulation of an interconnection system (ICS) of cascaded distributed generation (DG) modules for both grid-tied and stand-alone operations. The overall configuration of the interconnection system is given. The interconnection system consists of a cascaded DC/DC boost converters and a DC/AC inverter. Detailed modeling of the interconnection system incorporating a cascaded architecture has not been considered in previous research. In this paper, suitable control systems for the cascaded architecture of power electronic converters in an interconnection system have been studied and modeled in detail. A novel control system for DC/DC boost converters is presented based on a droop voltage controller. Also, a novel control strategy for DC/AC inverters based on the average large signal model to control the aggregated DG modules under both grid-tied and stand-alone modes is demonstrated. Simulation results indicate the effectiveness of the proposed control systems.

• 전기학회논문지
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• 제57권4호
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• pp.629-634
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• 2008

In this paper, we propose a simple numerical formula which can estimate the additional delay time due to interconnection branches in general source-termination scheme. We show that interconnection branches have influence on both signal quality and time delay. Using the proposed numerical formula, time delay can be easily predicted by system designers.

• 조명전기설비학회논문지
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• 제28권9호
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• pp.83-88
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• 2014

When DG interconnection into network is examined, details of the review are overvoltage, protective device malfunction, etc. In the case of protective device malfunction, replacing protective device into bi-directional protective device and installation NGR are the solution. Overvoltage at interconnection point occurs because the load is relatively less than DG output. When overvoltage at interconnection point occurs, DG interconnection is not permitted because this overvoltage affect other customers. Interconnection by installation new distribution line is one solution but it costs much money. Without installation new investment, change of NOP(Normal Open Point) position is a possible solution about DG interconnection into network.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.793-796
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• 2005

In this paper, we propose a method which can improve uniformity of a miniaturized electron beam array for inspection of very small pattern with high speed using vertical interconnection. This method enables the individual control of columns so that it can reduce the deviation of beam current, beam size, scan range and so on. The test device that used vertical interconnection method was fabricated by multiple wafer bonding and metal reflow. Two silicon and one glass wafers were bonded and metal interconnection by melting of electroplated AuSn was performed. The contact resistance was under $10{\Omega}$.

• Journal of Power Electronics
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• 제9권4호
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• pp.544-552
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• 2009

This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.216-217
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• 2007

In this study, we analyzed the electrical loss characteristics between ribbon and output terminal of constituent material according to electrical resistance during interconnection process of PV module. From this result, the electrical output power reduction rate caused by interaction between ribbon and cell's interconnection was 2.88%. There was 1W electrical output power reduction through the 16 solar cells. So it is expected that the wider size of PV module gives the higher loss in electricity production. Also, the average output power of PV module passed lamination process was increased by 0.081W per one solar cell and the increase rate was 3.7%.PV module's electrical loss before and after lamination process according to constituent material's terminal was 0.49W and 0.50W, respectively.