Pressure Contact Interconnection for High Reliability Medium Power Integrated Power Electronic Modules |
Yang, Xu
(State Key Lab. of Electrical Insulation and Power Equipment, Xi'an Jiaotong University)
Chen, Wenjie (State Key Lab. of Electrical Insulation and Power Equipment, Xi'an Jiaotong University) He, Xiaoyu (State Key Lab. of Electrical Insulation and Power Equipment, Xi'an Jiaotong University) Zeng, Xiangjun (State Key Lab. of Electrical Insulation and Power Equipment, Xi'an Jiaotong University) Wang, Zhaoan (State Key Lab. of Electrical Insulation and Power Equipment, Xi'an Jiaotong University) |
1 | Karnezos M., Pendse R.D., et al. "Reliability of area array pressure contacts on the DTAB package," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol.17, pp.263 269, 1994 DOI ScienceOn |
2 | Woo-Jin, Lee, Seong-Wook, et aI "A New PWM-Controlled Quasi-Resonant Converter for a High Efficiency PDP Sustaining Power Module," Journal of Power Electronics, Vol. 7, No. 1, pp.28-37, 2007 |
3 | Z.X. Liang, F. C. Lee, G-Q. Lu, and D. Borojevic, "Embedded Power -a multilayer integration teclmology for packaging of IPEMs and PEBBs", in Proc. of Internatioal Worshop on Integrated Power Packaging, pp.41-45, 2000 |
4 | Fisher R., Fillion R., Burgess J., and Hennessy W., "High Frequency, Low Cost, Power Packaging Using Thin Film Power Overlay Technology," in Proc. of IEEE Applied Power Electronics Conference, pp. 12-17, 1995 |
5 | Soon Kurl Kwon, Khairy F. A. Sayed, "Boost-Half Bridge Single Power Stage PWM DC-DC Converters for PEM-Fuel Cell Stacks," Journal of Power Electronics, Vol. 8, No.3, pp.239-247, 2008 |
6 | Hang-Seok Choi, "Design Consideration of Half-Bridge LLC Resonant Converter," Journal of Power Electronics, Vol. 7, No.1, pp.13-20, 2007 |
7 | Xingsheng Liu, Xiukuan Jing, and Guo-Quan Lu, "Chip-scale Packaging of Power Devices and its Application in Intcgrated Power Electronics Module," in Proc. of iEEE Ecrc Conference, pp. 290-296, 2000 |
8 | Sung-Sae Lee, Sang-Kyoo Han, et aI., "A New High Efficiency Half Bridge Converter with Improved ZVS Performance," Journal of Power Electronics, Vol. 6, No.3, pp.187-194,2006 |
9 | Leferink, F.B.J., "Inductance calculations: methods and equations", in Proc. of IEEE International Symposium Electromagnetic Compatibility, USA, pp. 16-22, 1995 |
10 | Beale, J. and Pease R.F. "Limits of high-density, low-force pressure contacts," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol.14, pp.257 262, 1994 |
11 | Chow E.M., Chua C., et al. "Pressure Contact Micro-Springs in Small Pitch Flip-Chip Packages," IEEE Transactions on Components and Packaging Technologie, Vol. 29, pp.796 803,2006 DOI |
12 | Ruehli, A., Paul, C., Garrett, J., "Inductance calculations using partial inductances and macromodels," in Proc. of [EEE International Symposium Electromagnetic Compatibility, pp. 23-28, 1995 |
13 | S. Wen, et aI, "Dimple-Array Interconnect Technique for Packaging Power Semiconductor Devices and Modules," in Proc. of Intemational Symposium on Power Devices and ICs, pp. 69-74, 2001 |