• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.3 s.357
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• pp.1-6
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• 2007

A drain bias switching technique is presented to enhance power added efficiency for WiBro and wireless LAN dual band and dual mode transmitter. Some simulations have been done to predict the effect of drain and gate bias change, and bias switching is proposed to get the higher efficiency for dual mode transmitter which generates different output power for different applications. With drain bias switching and simulated optimum fixed gate bias, the amplifier shows dramatic PAE improvement compared to the amplifier without bias switching. The drain and gate bias switching technique will be useful for multi mode communication system with various functions.

• ETRI Journal
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• v.19 no.2
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• pp.35-47
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• 1997

A power amplifier operating at 3.3 V has been developed for CDMA/AMPS dual-mode cellular phones. It consists of linear GaAs power MESFET's, a new gate bias control circuit, and an output matching circuit which prevents the drain terminal of the second MESF from generating the harmonics. The relationship between the intermodulation distortion and the spectral regrowth of the power amplifier has been investigated with gate bias by using the two-tone test method and the adjacent channel leakage power ratio (ACPR) method of CDMA signals. The dissipation power of the power amplifier with a gate bias control circuit is minimized to below 1000 mW in the range of the low power levels while satisfying the ACPR of less than -26 dBc for CDMA mode. The ACPR of the power amplifier is measured to be -33 dBc at a high output power of 26 dBm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.7 no.2
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• pp.178-185
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• 1996

In this paper, a theoretical analysis of a wide band distributed mixer using a dual-gate GaAs MESFET's(DGFET) is introduced. Based on low noise mixer mode(LNM) region modeling of DGFET, variation of g/sub m/ and conversion gain are presented versus bias. The distributed mixer is composed of drain and gate transmission line, m-derived image impedance matching circuits at each input and output port, and DGFET's. Through computer simulation, wide-band characteristics of designed distributed mixer are confirmed. And, it is certificated that LO/RF isolation between gate 1 and gate 2 is obtained more than 15dB.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.1
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• pp.73-80
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• 2016

The preliminary test for the dual mode plasma torch system was carried out to explore the operation properties in advance. The dual mode plasma torch system that is able to operate in transferred, non-transferred, or dual mode is very adequate for melting the mixed wastes including nonconductive materials such as concrete, asbestos, etc. since it exploits both the high efficiency of heat transfer to the melt in transferred mode and stable operation in non-transferred mode. Also, system operation including restarting is reliable and very easy. A stationary melter with a refractory structure was designed and manufactured considering the melting behavior of slags to minimize the refractory erosion. The power supply for the dual mode plasma torch system built with high power insulated gate bipolar transistor (IGBT) modules has functions for both current control and voltage control and is sufficient to suppress the harmonics during the operation of the plasma torch. The power supply provides two different voltages for transferred operation and non-transferred. It is confirmed that the operation voltage in transferred is always higher than non-transferred. The dual mode plasma torch system was successfully developed and is under operation for a melting experiment to optimize operation data.

• Journal of the Semiconductor & Display Technology
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• v.14 no.2
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• pp.41-45
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• 2015

From 20nm technology node, the finFET has become standard device for ULSI's. However, the finFET process made stacking gate non-volatile memory obsolete. Some reported capacitor-less DRAM structure by utilizing the FBE. We present possible non-volatile memory device structure similar to the dual gate MOSFET. One of the gates is left floating. Since body of the finFET is only 40nm thick, control gate bias can make electron tunneling through the floating gate oxide which sits across the body. For programming, gate is biased to accumulation mode with few volts. Simulation results show that the programming electron current flows at the interface between floating gate oxide and the body. It also shows that the magnitude of the programming current can be easily controlled by the drain voltage. Injected electrons at the floating gate act similar to the body bias which changes the threshold voltage of the device.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.311-311
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• 2016

최근 고성능 디스플레이 개발이 요구되면서 기존 비정질 실리콘(a-Si)을 대체할 산화물 반도체에 대한 연구 관심이 급증하고 있다. 여러 종류의 산화물 반도체 중 a-IGZO (amorphous indium-gallium-zinc oxide)가 높은 전계효과 이동도, 저온 공정, 넓은 밴드갭으로 인한 투명성 등의 장점을 가지며 가장 연구가 활발하게 보고되고 있다. 기존에는 SG(단일 게이트) TFT가 주로 제작 되었지만 본 연구에서는 DG(이중 게이트) 구조를 적용하여 고성능의 a-IGZO 기반 박막 트랜지스터(TFT)를 구현하였다. SG mode에서는 하나의 게이트가 채널 전체 영역을 제어하지만, double gate mode에서는 상, 하부 두 개의 게이트가 동시에 채널 영역을 제어하기 때문에 채널층의 형성이 빠르게 이루어지고, 이는 TFT 스위칭 속도를 향상시킨다. 또한, 상호 모듈레이션 효과로 인해 S.S(subthreshold swing)값이 낮아질 뿐만 아니라, 상(TG), 하부 게이트(BG) 절연막의 계면 산란 현상이 줄어들기 때문에 이동도가 향상되고 누설전류 감소 및 안정성이 향상되는 효과를 얻을 수 있다. Dual gate mode로 동작을 시키면, TG(BG)에는 일정한 positive(or negative)전압을 인가하면서 BG(TG)에 전압을 가해주게 된다. 이 때, 소자의 채널층은 depletion(or enhancement) mode로 동작하여 다른 전기적인 특성에는 영향을 미치지 않으면서 문턱 전압을 쉽게 조절 할 수 있는 장점도 있다. 제작된 소자는 p-type bulk silicon 위에 thermal SiO2 산화막이 100 nm 형성된 기판을 사용하였다. 표준 RCA 클리닝을 진행한 후 BG 형성을 위해 150 nm 두께의 ITO를 증착하고, BG 절연막으로 두께의 SiO2를 300 nm 증착하였다. 이 후, 채널층 형성을 위하여 50 nm 두께의 a-IGZO를 증착하였고, 소스/드레인(S/D) 전극은 BG와 동일한 조건으로 ITO 100 nm를 증착하였다. TG 절연막은 BG 절연막과 동일한 조건에서 SiO2를 50 nm 증착하였다. TG는 S/D 증착 조건과 동일한 조건에서, 150 nm 두께로 증착 하였다. 전극 물질과, 절연막 물질은 모두 RF magnetron sputter를 이용하여 증착되었고, 또한 모든 patterning 과정은 표준 photolithography, wet etching, lift-off 공정을 통하여 이루어졌다. 후속 열처리 공정으로 퍼니스에서 질소 가스 분위기, $300^{\circ}C$ 온도에서 30 분 동안 진행하였다. 결과적으로 $9.06cm2/V{\cdot}s$, 255.7 mV/dec, $1.8{\times}106$의 전계효과 이동도, S.S, on-off ratio값을 갖는 SG와 비교하여 double gate mode에서는 $51.3cm2/V{\cdot}s$, 110.7 mV/dec, $3.2{\times}108$의 값을 나타내며 훌륭한 전기적 특성을 보였고, dual gate mode에서는 약 5.22의 coupling ratio를 나타내었다. 따라서 산화물 반도체 a-IGZO TFT의 이중게이트 구조는 우수한 전기적 특성을 나타내며 차세대 디스플레이 시장에서 훌륭한 역할을 할 것으로 기대된다.

• Journal of Advanced Navigation Technology
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• v.10 no.2
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• pp.138-144
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• 2006

In this paper, dual mode FET mixer for WiBro and wireless LAN(WLAN) applications has been designed in the form of dual gate FET mixer by using the cascode structure of two single gate pHEMTs. The designed dual gate mixer has been optimized to have variable conversion gain for WiBro and WLAN applications in order to save dc power consumption. The LO to RF isolation of the designed mixer is more than 20dB from 2.3GHz to 2.5GHz band. With the LO power of 0dBm and RF power of -50dBm, the mixer shows 15dB conversion gain. When RF power increases from -50dBm to -20dBm, the conversion gain decreases to -2dB from 15dB with bias change. The variable conversion gain has several advantages. It can reduce the high dynamic range requirement of AGC burden at IF stage. Also, it can save the dc power dissipation of mixer up to 90%.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.292-300
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• 2015

This paper proposes a high-efficiency, dual-mode PWM / linear buck converter with a wide-input range. The proposed converter was designed with a mode selector that can change the operation between PWM / linear mode by sensing a load current. The proposed converter operates in a linear mode during a light load and in PWM mode during a heavy load condition in order to ensure high efficiency. In addition, the mode selector uses a bit counter and a transmission gate designed to protect from a malfunction due to noise or a time-delay. Also, in conditions between $-40^{\circ}C$ and $140^{\circ}C$, the converter has variations in temperature of $0.5mV/^{\circ}C$ in the PWM mode and of $0.24mV/^{\circ}C$ in the linear mode. Also, to prevent malfunction and breakdown of the IC due to static electricity, the reliability of IC was improved by embedding a self-produced 8 kV-class(Chip level) ESD protection circuit of a P-substrate Triggered SCR type with high robustness characteristics.

• Journal of Power Electronics
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• v.12 no.6
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• pp.886-894
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• 2012

This paper presents a secondary-side, dual-mode feedback LLC resonant controller IC with dynamic PWM dimming for LED backlight units. In order to reduce the cost, master and slave outputs can be generated simultaneously with a single LLC resonant core based on dual-mode feedback topologies. Pulse Frequency Modulation (PFM) and Pulse Width Modulation (PWM) schemes are used for the master stage and slave stage, respectively. In order to guarantee the correct dual feedback operation, Phased-Locked Loop (PLL)-based automatic duty control circuit is proposed in this paper. The chip is fabricated using $0.35{\mu}m$ Bipolar-CMOS-DMOS (BCD) technology, and the die size is $2.5mm{\times}2.5mm$. The frequency of the gate driver (GDA/GDB) in the clock generator ranges from 50 to 425 kHz. The current consumption of the LLC resonant controller IC is 40 mA for a 100 kHz operation frequency using a 15 V supply. The duty ratio of the slave stage can be controlled from 40% to 60% independent of the frequency of the master stage.

• ETRI Journal
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• v.27 no.1
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• pp.81-88
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• 2005

In this paper, interface circuits that are suitable for point-to-point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi-gigabits per-second between two chips with a point-to-point interconnection, the input receiver uses an on-chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode-connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 ${\mu}m$ dual gate oxide CMOS technology.