• 제목/요약/키워드: drain Bias

검색결과 204건 처리시간 0.022초

전력 VDMOSFET의 온도변화 특성에 관한 연구 (A Study on the Temperature Variation Characteristics of Power VDMOSFET)

  • Lee, Woo-Sun
    • 대한전기학회논문지
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    • 제35권7호
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    • pp.278-284
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    • 1986
  • Double-diffused metal oxide power semiconductor field effect transistors are used extensively in recent years in various circuit applications. The temperature variation of the drain current at a fixed bias shows both positive and negative resistance characteristics depending on the gate threshold voltage and gate-to source bias votage. In this paper, the decision method of the gate crossover voltage by the temperature variation and a new method to determine the gate threshold voltage graphecally are presented.

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SOI(Silicon-on-Insulator) 소자에서 후면 Bias에 대한 전기적 특성의 의존성 (Dependence of Electrical Characteristics on Back Bias in SOI Device)

  • 강재경;박재홍;김철주
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 1993년도 춘계학술발표회
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    • pp.43-44
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    • 1993
  • In this study SOI MOSFET model of the structure with 4-terminals and 3-interfaces is proposed. An SOI MOSFET is modeled with the equivalent circuit considered the interface capacitances. Parameters of SOI MOSFET device are extracted, and the electrical characteristics due to back-bias change is simulated. In SOI-MOSFET model device we describe the characteristics of threshold voltage, subthreshold slope, maxium electrical field and drain currents in the front channel when the back channel condition move into accmulation, depletion, and inversion regions respectively.

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Avalanche Hot Source Method for Separated Extraction of Parasitic Source and Drain Resistances in Single Metal-Oxide-Semiconductor Field Effect Transistors

  • Baek, Seok-Cheon;Bae, Hag-Youl;Kim, Dae-Hwan;Kim, Dong-Myong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권1호
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    • pp.46-52
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    • 2012
  • Separate extraction of source ($R_S$) and drain ($R_D$) resistances caused by process, layout variations and long term degradation is very important in modeling and characterization of MOSFETs. In this work, we propose "Avalanche Hot-Source Method (AHSM)" for simple separated extraction of $R_S$ and $R_D$ in a single device. In AHSM, the high field region near the drain works as a new source for abundant carriers governing the current-voltage relationship in the MOSFET at high drain bias. We applied AHSM to n-channel MOSFETs as single-finger type with different channel width/length (W/L) combinations and verified its usefulness in the extraction of $R_S$ and $R_D$. We also confirmed that there is a negligible drift in the threshold voltage ($V_T$) and the subthreshold slope (SSW) even after application of the method to devices under practical conditions.

Electrical Characteristics of InAlAs/InGaAs/InAlAs Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation

  • Kim, H.T.;Kim, D.M.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제3권3호
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    • pp.145-152
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    • 2003
  • Electrical gate and drain characteristics of double heterostructure InAlAs/InGaAs pseudomorphic HEMTs have been investigated under sub-bandgap photonic excitation ($hv). Drain $(V_{DS})-,{\;}gate($V_{DS})-$, and optical power($P_{opt}$)-dependent variation of the abnormal gate leakage current and associated physical mechanisms in the PHEMTs have been characterized. Peak gate voltage ($V_{GS,P}$) and the onset voltage for the impact ionization ($V_{GS.II}$) have been extracted and empirical model for their dependence on the $V_{DS}$ and $P_{opt} have been proposed. Anomalous gate and drain current, both under dark and under sub-bandgap photonic excitation, have been modeled as a parallel connection of high performance PHEMT with a poor satellite FET as a parasitic channel. Sub-bandgap photonic characterization, as a function of the optical power with $h\nu=0.799eV$, has been comparatively combined with those under dark condition for characterizing the bell-shaped negative humps in the gate current and subthreshold drain leakage under a large drain bias.

A Low Distortion and Low Dissipation Power Amplifier with Gate Bias Control Circuit for Digital/Analog Dual-Mode Cellular Phones

  • Maeng, Sung-Jae;Lee, Chang-Seok;Youn, Kwang-Jun;Kim, Hae-Cheon;Mun, Jae-Kyung;Lee, Jae-Jin;Pyun, Kwang-Eui
    • ETRI Journal
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    • 제19권2호
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    • pp.35-47
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    • 1997
  • A power amplifier operating at 3.3 V has been developed for CDMA/AMPS dual-mode cellular phones. It consists of linear GaAs power MESFET's, a new gate bias control circuit, and an output matching circuit which prevents the drain terminal of the second MESF from generating the harmonics. The relationship between the intermodulation distortion and the spectral regrowth of the power amplifier has been investigated with gate bias by using the two-tone test method and the adjacent channel leakage power ratio (ACPR) method of CDMA signals. The dissipation power of the power amplifier with a gate bias control circuit is minimized to below 1000 mW in the range of the low power levels while satisfying the ACPR of less than -26 dBc for CDMA mode. The ACPR of the power amplifier is measured to be -33 dBc at a high output power of 26 dBm.

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Offset 구조 Poly-Si TFT의 Negative Bias Stress 효과 (Negative Bias Stress Effect with Offset Structure in Poly-Si TFT's)

  • 이제혁;변문기;임동규;조봉희;김영호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 추계학술대회 논문집
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    • pp.141-144
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    • 1998
  • The electrical characteristics of poly-Si TFT's with offset structure by negative bias stress are systematically investigated as a function of offset length. The changes of electrical characteristics, V$\_$th/, off-current, on/off ratio, in the offset structured poly-Si TFT's are smaller than that of the conventional structured poly-Si TFT's under the stress condition (V$\_$ds/=20V, V$\_$gs/=-20V). It is found that the hot carrier effect by negative bias stress is suppressed by the offset structured poly-Si TFT's because the local electric field near the drain region is decreased by offset region.

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a-Si Gate Driver with Alternating Gate Bias to Pull-Down TFTs

  • Kim, Byeong-Hoon;Pi, Jae-Eun;Oh, Min-Woo;Tao, Ren;Oh, Hwan-Sool;Park, Kee-Chan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1243-1246
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    • 2009
  • A novel a-Si TFT integrated gate driver circuit which suppresses the threshold voltage shift due to prolonged positive gate bias to pull-down TFTs, is reported. Negative gate-to-drain bias is applied alternately to the pull-down TFTs to recover the threshold voltage shift. Consequently, the stability of the circuit has been improved considerably.

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위성 DAB 수신을 위한 저잡음 증폭기의 설계 및 구현에 관한 연구 (A Study on Design and Implementation of Low Noise Amplifier for Satellite Digital Audio Broadcasting Receiver)

  • 전중성;유재환
    • 한국항해항만학회지
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    • 제28권3호
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    • pp.213-219
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    • 2004
  • 본 논문에서는 1,452∼l,492 MHz L-Band 대역의 위성 DAB 수신기를 위한 저잡음증폭기를 입ㆍ출력 반사계수와 전압정재파비를 개선하기 위하여 평형증폭기 형태로 설계 및 제작하였다. 저 잡음증폭기는 GaAs FET소자인 ATF-10136을 사용한 저 잡음증폭단과 MMIC 소자인 VNA-25을 사용한 이득증폭단을 하이브리드 방식으로 구성하였으며, 최적의 바이어스를 인가하기 위하여 능동 바이어스 회로를 사용하였다. 적용된 능동 바이어스 회로는 소자의 펀치오프전압($V_P$)과 포화드래인 전류($I_{DSS}$)의 변화에 따라 주어진 바이어스 조건을 만족시키기 위해 소스 저항과 드래인 저항의 조절이 필요없다. 즉, 능동 바이어스 회로는 요구된 드래인 전류와 전압을 공급하기 위해 게이트-소스 전압($V_{gs}$)을 자동적으로 조절한다. 저잡음증폭기는 바이어스 회로와 RF 회로를 FR-4기판 위에 제작하였고, 알류미늄 기구물에 장착하였다. 제작된 저잡음증폭기는 이득 32 dB, 이득평탄도 0.2 dB, 0,95 dB 이하의 잡음지수, 입ㆍ출력 전압정재파비는 각각 1.28, 1.43이고, $P_{1dB}$ 는 13 dBm으로 측정되었다.

Improvement on the Stability of Amorphous Indium Gallium Zinc Oxide Thin Film Transistors Using Amorphous Oxide Multilayer Source/Drain Electrodes

  • Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • 제17권3호
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    • pp.143-145
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    • 2016
  • In order to find suitable source and drain (S/D) electrodes for amorphous InGaZnO thin film transistors (a-IGZO TFTs), the specific contact resistance of interface between the channel layers and various S/D electrodes, such as Ti/Au, a-IZO and multilayer of a-IGZO/Ag/a-IGZO, was investigated using the transmission line model. The a-IGZO TFTs with a-IGZO/Ag/a-IGZO of S/D electrodes had good performance and low contact resistance due to the homo-junction with channel layer. The stability was measured with different electrodes by a positive bias stress test. The result shows the a-IGZO TFTs with a-IGZO/Ag/a-IGZO electrodes were more stable than other devices.

The gate delay time and the design of VCO using variable MOS capacitance

  • Ryeo, Ji-Hwan
    • 한국정보기술응용학회:학술대회논문집
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    • 한국정보기술응용학회 2005년도 6th 2005 International Conference on Computers, Communications and System
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    • pp.99-102
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    • 2005
  • In the paper, a proposed VCO based on bondwire inductances and nMOS varactors was implemented in a standard $0.25\;{\mu}m$ CMOS process. Using the new drain current model and a propagation delay time model equations, the operation speed of CMOS gate will predict the dependence on the load capacitance and the depth of oxide, threshold voltage, the supply voltage, the channel length. This paper describes the result of simulation which calculated a gate propagation delay time by using new drain current model and a propagation delay time model. At the result, When the reverse bias voltage on the substrate changes from 0 voltage to 3 voltage, the propagation delay time is appeared the delay from 0.8 nsec to 1 nsec. When the reverse voltage is biased on the substrate, for reducing the speed delay time, a supply voltage has to reduce. The $g_m$ value of MOSFET is calculated by using new drain current model.

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