• 대한기계학회논문집
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• 제11권1호
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• pp.1-18
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• 1987

본 연구에서는 입자가 부상된 이상난류제트유동에 Einstein의 확산모형, Pes- kin모형, 3-방정식 모형, 4-방정식 모형, 대수응력모형 등을 적용하여 해석하고 각 모 형들의 결과를 비교 분석하였다. 이상난류유동의 수치해석에서 공기는 제1유체유동 으로 하고 첨가되는 고체분말의 흐름은 밀도(.rho.$_{p}$), 층류동점성계수(.nu.$_{p}$), 과점성계수(.nu.$_{pt}$ )를 갖는 제2유체유동의 흐름으로 간주하였다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2001년도 춘계학술대회논문집
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• pp.420-425
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• 2001

Theoretical analysis of noise reduction by a membrane-duct system is presented. When acorn waves propagate in the membrane-duct, the membrane is also excited and its motion is coup with interior medium. It has been shown that propagating waves with supersonic wave speed exist beyond a certain critical frequency that is determined from the mass ratio of the me and the fluid. Also found are subsonic waves which couple strongly wi th the membrane a provide a powerful mechanism of energy dissipation. Existence of an exterior medium alter dispersion characteristics. It provides additional mass loading and reduces the subsort speed further. The effect of mean flow speed on dispersion characteristics is also consider results show that the membrane-duct system can be applied to diminish and absorb 1 frequency noise in duct instead of passive muffler, such as a simple expansion chamber absorption material.

• 한국자동차공학회논문집
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• 제4권5호
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• pp.130-141
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• 1996

Numerical study of a confined, swirling, isothermal and spray-combusting flows has been presented. The pressure-velocity coupling in the Eulerian gas-phase equation is handled by the improved PISO algorithm. The droplet dispersion by turbulence is introduced by a Stochastic Separated Flow(SSF) model. The k-$\varepsilon$ turbulence model and the eddy dissipation model are employed to account for turbulence-combustion interaction. The detailed comparison with experimental data has been made for the isothermal jet swirling flows and the nearly monodisperse spray-combusting flow in the swirl combustor.

• 한국표면공학회지
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• 제53권4호
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• pp.160-168
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• 2020

A polymer-based carbon nanomaterial composite was fabricated and characterized for the application of a thermal conductive adhesive. Low-dimensional carbon nanomaterials with excellent thermal conductivity such as carbon nanotube (CNT) and graphene were selected as a filler in the composite. Thermal, electrical and adhesive properties of the composite were investigated with respect to the morphology and content of the low-dimensional carbon nanomaterials. As a result, the composite-based adhesive fabricated by the loading of surface-treated MWCNTs of 0.4 wt% showed uniform dispersion, moderate adhesion and effective heat dissipation properties. Finally, it was confirmed through the thermal image analysis of LED module that the temperature reduction of 10℃ was achieved using the fabricated composite adhesive with MWCNT-6A. Expecially, heat dissipation performance of the optimized composite adhesive was evident at the hot spot in the module compared to other samples mixed with graphene or different MWCNT loading ratios.

• Computers and Concrete
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• 제21권4호
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• pp.451-461
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• 2018

Present study is mainly concerned about the idea of innovative utilization of bamboo in modern construction. Owing to its compatible mechanical properties, a beneficial effect of its use in reinforced concrete (RC) frame infills has been observed. In this investigation, finite element analyses have been performed to examine the failure pattern and stress distribution pattern through the infills of a moment resisting RC frame. To validate the pragmatic use of bamboo reinforced components as infills, earthquake loading corresponding to Nepal earthquake had been considered. The analysis have revealed that introduction of bamboo in RC frames imparts more flexibility to the structure and hence may causes a ductile failure during high magnitude earthquakes like in Nepal. A more uniform stress distribution throughout the bamboo reinforced wall panels validates the practical feasibility of using bamboo reinforced concrete wall panels as a replacement of conventional brick masonry wall panels. A more detailed analysis of the results have shown the fact that stress concentration was more on the frame components in case of frame with brick masonry, contrary to the frame with bamboo reinforced concrete wall panels, in which, major stress dispersion was through wall panels leaving frame components subjected to smaller stresses. Thus an effective contribution of bamboo in dissipation of stresses generated during devastating seismic activity have been shown by these results which can be used to concrete the feasibility of using bamboo in modern construction.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.116-120
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• 2012

In this paper, ZnO-Epoxy nanocomposites (NEP) were prepared and epoxy composites that contain 5 wt% micro ZnO (MEP) and deliberately not well dispersed nano ZnO (NDNEP) were also prepared for purpose of comparison. The effects of the particle size and dispersion of ZnO on dielectric properties of epoxy resin were chiefly studied. Test results showed that: at a loading of 5 wt%, the three epoxy composites seem to have no significant difference on resistivity compared to epoxy resin; Dielectric constants of all the epoxy composites are also basically the same but they are bigger compared to that of the pure epoxy resin (unfilled); Dielectric dissipation factors ($tan{\delta}$) of NDNEP is greater than that of NEP and MEP. NEP has the minimum dielectric loss factor, whereas dielectric loss factors of the three epoxy composites are larger than that of the pure epoxy resin. The decreasing order of electrical breakdown strength for the three epoxy composites and for the pure epoxy resin is as follows: NEP>MEP>NDNEP>EP. Finally, in order to explain the experimental results the aggregation interface phase was proposed. Furthermore, addition of well dispersed nano filler has proved to have a positive effect on the improvement of the dielectric properties of epoxy resin.

• 물과 미래
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• 제28권4호
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• pp.125-136
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• 1995

특정곡선을 고려한 ELM을 이송-확산방정식에 적용하여 그 결과를 Eulerian 기법(Stone-Brian, QUICKEST)과 비교하였다. 이송항의 계산을 위해서는 Lagrangian 보간법과 Cubic spline 보간법을 이용하였고 확산항의 계산에 있어서는 Crank-Nicholson 방법을 이용하였다. 수치모형의 적용결과는 다음과 같다. (1) Gaussian hill에의 적용:Lagrangian 보간법을 사용하여 계산한 경우가 가장 정확한 결과를 보였다. Cubic spline 보간법을 사용한 경우와 QUICKEST 방법의 경우에는 Peclet수가 50인 경우에 감쇠현상을 보였다. Stone-Brian방법은 Peclet수 10,50에서 위상오차가 발생하였다. (2) Advanced front에의 적용: 모든 방법이 Peclet수 1,4에서 정확한 결과를 얻었다. Peclet수가 50인 경우에 Lagrangian 보간법을 사용하여 계산한 경우와 Stone-Brian 방법은 증폭오차가 발생하였고 Cubic spline 보간법을 사용한 경우와 QUICKEST 방법의 경우는 수치진동 현상을 보였다.

• 대한기계학회논문집B
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• 제40권2호
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• pp.111-117
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• 2016

본 연구의 목적은 실리콘 열전달 조절을 위한 포논의 평균자유행로(Mean free path, MFP) 스펙트럼 열전달 기여도 예측이다. 열전달의 크기 효과는 포논의 MFP 와 재료의 특성길이가 비슷할 때 나타나는데, 나노시스템 응용을 위한 재료의 열전달 증감을 위해 포논 MFP 스펙트럼에 대한 열전달 기여도 예측이 중요하다. 이를 위해 포논의 주파수 의존성이 고려된 볼츠만 수송방정식(Boltzmann transport equation) 근간의 full phonon dispersion 모델을 통해 실리콘 박막(Silicon-on-Insulator) 트랜지스터의 실리콘 박막 두께 변화(41-177 nm)에 따른 포논 MFP 스펙트럼 열전달 특성 및 비등방성을 해석함으로써, 본 연구 결과는 향후 박막 트랜지스터에 대한 고효율 열소산(heat dissipation) 설계전략에 활용될 수 있다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1661-1663
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• 2001

This paper describes the dielectric characteristics of composite dielectric film for pulsed power capacitors. The relative electric permittivity(${\varepsilon}'$) and the dielectric dissipation factor(tan$\delta$) were measured for polypropylene (PP) membranes, kraft paper for capacitors(CP) and composite dielectric films(PP+CP), respectively, in a frequency range of $1{\sim}10^4$[Hz], and in temperatures ranging from -50[$^{\circ}C$] to 110[$^{\circ}C$]. As a result, the variation of the electric permittivity was observed similarly for PP and CP. Dielectric dispersion was observed in frequency domain in PP, CP and composite dielectric films.

• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.