• 한국자기학회지
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• 제16권6호
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• pp.283-286
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• 2006

고밀도 자기기록용 Ba-페라이트/$SiO_{2}$ 자성박막에서 계면확산 장벽으로써 ${\alpha}-Al_{2}O_{3}$ 버퍼층의 역할을 연구하였다. 열처리동안 $1900{\AA}$의 두께를 가진 비정질 Ba-페라이트/$SiO_{2}$ 박막에서 계면확산은 약 $700^{\circ}C$에서 일어나기 시작하였다. 열처리온도를 $800^{\circ}C$까지 증가시켰을 때, 계면확산은 자기특성을 저하시킬 정도로 급격히 진행되었다. 고온에서의 계면확산을 억제하기 위하여, $110{\AA}$ 두께의 ${\alpha}-Al_{2}O_{3}$ 버퍼층을 Ba-페라이트/$SiO_{2}$ 박막의 계면에 증착하여 사용하였다. Ba-페라이트/${\alpha}-Al_{2}O_{3}/SiO_{2}$ 박막에서는 $800^{\circ}C$의 고온까지 열처리하여도 계면확산이 심각하게 일어나지는 않았다. ${\alpha}-Al_{2}O_{3}$ 버퍼층에 의하여 계면확산이 억제되기 때문에 Ba-페라이트 자성박막의 포화자속밀도와 보자력이 향상되었다. 따라서 Ba-페라이트/$SiO_{2}$ 박막의 계면에서 ${\alpha}-Al_{2}O_{3}$ 버퍼층은 $SiO_{2}$ 기판 성분의 계면확산 장벽으로 사용될 수 있다.

• Journal of Magnetics
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• 제13권3호
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• pp.97-101
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• 2008

We investigated the exchange bias fields at the NiFe/FeMn and FeMn/CoFe interfaces in 18.9-nm NiFe/15.0-nm FeMn/17.6-nm CoFe trilayer thin films as the annealing temperature was varied from room temperature to $250^{\circ}C$ in a vacuum for 1 hour in a magnetic field of 150 Oe. Interestingly, magnetic hysteresis (M-H) measurements showed that NiFe/FeMn/CoFe trilayer thin films exhibited a completely contrasting variation of the exchange bias fields at both the NiFe/FeMn and FeMn/CoFe interfaces with annealing temperatures. High-angle X-ray diffraction (XRD) measurements indicated the absence of any discernible effect of thermal treatment on the NiFe(111) and FeMn(111) peaks. The compositional depth profile obtained from X-ray photoelectron spectroscopy (XPS) results presented the asymmetric compositional depth profiles of the Mn and Fe atoms throughout the FeMn layer. We contend that this asymmetric compositional depth profile and the preferential Mn diffusion into the NiFe layer, compared to that into the CoFe layer, are conclusive experimental evidence of the contrasting variation of the exchange bias fields at two interfaces having a common polycrystalline FeMn(111) layer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.289.2-289.2
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• 2016

In-Ga-Zn-O(IGZO) receive great attention as a channel material for thin film transistors(TFTs) as next-generation display panel backplanes due to its superior electrical and physical properties such as a high mobility, low off-current, high sub-threshold slope, flexibility, and optical transparency. For the purpose of fabricating high performance IGZO TFTs, a thermal recovery process above a temperature of $300^{\circ}C$ is required for recovery or rearrangement of the ionic bonding structure. However diffused metal atoms from source/drain(S/D) electrodes increase the channel conductivity through the oxidation of diffused atoms and reduction of $In_2O_3$ during the thermal recovery process. Threshold voltage ($V_{TH}$) shift, one of the electrical instability, restricts actual applications of IGZO TFTs. Therefore, additional investigation of the electrical stability of IGZO TFTs is required. In this paper, we demonstrate the effect of Ti diffusion and modulation of interface traps by carrying out an annealing process on IGZO. In order to investigate the effect of diffused Ti atoms from the S/D electrode, we use secondary ion mass spectroscopy (SIMS), X-ray photoelectron spectroscopy, HSC chemistry simulation, and electrical measurements. By thermal annealing process, we demonstrate VTH shift as a function of the channel length and the gate stress. Furthermore, we enhance the electrical stability of the IGZO TFTs through a second thermal annealing process performed at temperature $50^{\circ}C$ lower than the first annealing step to diffuse Ti atoms in the lateral direction with minimal effects on the channel conductivity.

• 한국결정성장학회지
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• 제29권2호
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• pp.50-53
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• 2019

박막 태양전지에 주로 적용되는 다결정 규소층을 AIC(Aluminum Induced Crystallization) 공정을 이용하여 제조하였다. 결정립의 확대를 위하여 selective diffusion barrier 사용하였다. 이 diffusion barrier는 $Al_2O_3$ 막을 사용하였다. 공정시간의 단축을 위하여 열처리는 RTA(Rapid Thermal Annealing) 공정으로 진행하였다. 비정질 실리콘의 결정화는 XRD 측정을 통해 분석했다. 그 결과 $500^{\circ}C$에서 결정화되었으며, 결정 크기는 $15.9{\mu}m$로 계산되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.562-565
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• 2001

In this paper, novel device structures in order to realize ultra fast and ultra small silicon devices are investigated using ultra-high vacuum chemical vapor deposition(UHVCVD) and Excimer Laser Annealing (ELA). Based on these fundamental technologies for the deep sub-micron device, high speed and low power devices can be fabricated. These junction formation technologies based on damage-free process for replacing of low energy ion implantation involve solid phase diffusion and vapor phase diffusion. As a result, ultra shallow junction depths by ELA are analyzed to 10~20nm for arsenic dosage(2${\times}$10$\_$14//$\textrm{cm}^2$), exciter laser source(λ=248nm) is KrF, and sheet resistances are measured to 1k$\Omega$/$\square$ at junction depth of 15nm and realized sub-50nm n-MOSFET.

• 한국표면공학회지
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• 제38권2호
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• pp.83-87
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• 2005

We enhanced the color of blue sapphires and rubies successfully by using a oxygen-propane torch flame annealing, which had not been employed so far. We confirmed that about 1 mm-thick de-coloring of the corundum samples were available with 60 minutes flame annealing through eye evaluation, color coordination characterization, and methylene iodide immersion observation. We also suggest that the color centers such as $[Fe_{Al}^{\cdot}]$ may transform into transparent $[Fe_{Al}^{x}],\;[Cr_{A1}^{x}]$ sites with $[V_o^']$ generation at the elevated temperature in oxygen-rich atmosphere by diffusion mechanism. Our results implied that the longer diffusion time and the higher oxygen partial pressure might lead to the better de-coloring enhancement in corundum gem stones.

• 한국진공학회지
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• 제4권S2호
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• pp.90-94
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• 1995

Defects introduced by Si, Ge preamorphization and their effects on the dopant diffusion and electrical characteristics. Good crystalline quality are obtained after the annealing of Ge ion double implanted samples. The defect clusters under the a/c interface are expected to extend up to the deep in the Si ion implanted samples. The dislocation loops near the junction absorb the interstitial Si atoms resolving from the defect cluster and result in the prevention of enhanced boron diffusion near the tail region of boron profile and show good reverse current charactristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.395-397
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• 2002

Dielectric thin films of Pb$\_$0.72/La$\_$0.28/Ti$\_$0.93/O$_3$(PLT(28)) have been deposited on Pt(111)/Ti/SiO$_2$/Si(100) substrates in-situ by pulsed laser deposition using different annealing and deposition processes. We have investigated the effect of hydrogen annealing on the ferroelectric properties of PLT thin films and found that the annealing process causes the diffusion of hydrogen into the ferroelectric film resulting in the destruction of polarization. Two-step process to grow PLT films was adopted and verified to be useful to enlarge the grain size of the film. Structural properties including dielectric constant, and ferroelectric characteristics of PLT thin films were shown to be strongly influenced by grain size. The film deposited by using two-step process including pre-annealing treatment has a strong (111) orientation. However, the films deposited by using single-step process with hydrogen annealing process shows the smallest grain size.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.232-232
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• 2012

The doping of semiconducting elements is essential for the development of silicon quantum dot (QD) solar cells. Especially the doping elements should be activated by substitution at the crystalline sites in the crystalline silicon QDs. However, no analysis technique has been developed for the analysis of the activated dopants in silicon QDs in $SiO_2$ matrix. Secondary ion mass spectrometry (SIMS) is a powerful technique for the in-depth analysis of solid materials and the impurities analysis of boron and phosphorus in semiconductor materials. For the study of diffusion behaviour of B and P by SIMS, Si/$SiO_2$ multilayer films doped by B or P were fabricated and annealed at high temperatures for the activated doping of B and P. The distributions of doping elements were analyzed by SIMS. Boron found to be preferentially distributed in Si layer rather than the $SiO_2$ layer. Especially the B in the Si layers was separated to two components of an interfacial component and a central one. The central component was understood as the activated elements. On the other hand, phosphorus did not show any preferred diffusion.

• 전자공학회논문지D
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• 제35D권6호
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• pp.37-45
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• 1998

본 논문에서는 본 연구진이 개발 중인 INPROS 3차원 반도체 공정 시뮬레이터 시스템에 이온주입된 불순물의 과도 확산(TED, transient enhanced diffusion) 기능을 첨가하여 수행한 계산 결과를 발표한다. 실리콘 내부에 이온주입된 불순물의 재분포를 시뮬레이션하기 위하여, 먼저 몬테카를로 방법으로 이온주입 공정을 수행하였고, 유한요소법을 이용하여 확산 공정을 수행하였다. 저온 열처리 공정에서의 붕소의 과도 확산을 확인하기 위하여, 에피 성장된 붕소 에피층에 비소와 인을 이온 주입시킨 후, 750℃의 저온에서 2시간 동안 열처리 공정을 수행하였다. 3차원 INPROS 시뮬레이터의 결과와 실험적으로 측정한 SIMS 데이터와 그 결과가 일치함을 확인하였다. INPROS의 점결함 의존성 과도 증속 확산 모델과 소자 시뮬레이터인 PISCES를 이용하여 역 단채널 길이 효과(RSCE, reverse short channel effect)를 시뮬레이션하였다.