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http://dx.doi.org/10.6111/JKCGCT.2019.29.2.050

Application of rapid thermal annealing process to the aluminum induced crystallization of amorphous silicon thin film  

Hwang, Ji-Hyun (Department of Physics, University of Incheon)
Yang, Su-Won (Department of Materials Science and Engineering, University of Incheon)
Kim, Young-Kwan (Department of Materials Science and Engineering, University of Incheon)
Abstract
In this study, polycrystalline silicon thin film useful for the solar cells was fabricated by AIC(Aluminum Induced Crystallization) process. A diffusing barrier for this process is prepared with $Al_2O_3$. For the maximization of the grain size of the polycrystalline silicon, a selective blasting of the $Al_2O_3$ diffusing barrier was conducted before annealing treatment. The heat treatment for the activation of the amorphous-Si (a-Si) layer was carried out with Rapid Thermal Annealing (RTA) process. Crystallization of the a-Si layer was analyzed with XRD. It was confirmed that a-Si was crystallized at $500^{\circ}C$ and the silicon crystal is observed to be formed and the grain size of the polycrystalline silicon was observed to be $15.9{\mu}m$.
Keywords
RTA (Rapid Thermal Annealing); AIC (Aluminum Induced Crystallization); Alumina blasting; Silicon thin film crystallization;
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