• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.165-170
• /
• 2001

AIC$_3$:$^{t}$ BuNH$_2$단일 전구체를 이용하여 MOCVD방법에 의해 상압하에서 1$\mu\textrm{m}$의 두께로 증착하였다. 증착된 AIN 박막을 XRD, SEM, RBS 그리고 AES로 분석했으며 IDT전극을 형성하기 위해 1500＋ 의 두께로 증착했다. 중심주파수 1.5GHz를 갖고 입출력 개수가 각각 500개이며 IDT선폭이 l$\mu\textrm{m}$인 전송형의 SAW filter를 제작하고자 하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.3
• /
• pp.21-30
• /
• 2012

Technology trend and application of laser fuse, anti-fuse, and eFUSE as well as the structure, programming mechanism, and reliability of eFUSE have been reviewed. In order to ensure eFUSE reliability in the field, a sensing circuit trip point consistent with the fuse resistance distribution, process variation, and device degradation in the circuit such as hot carrier or NBTI, as well as fuse resistance reliability must be considered to optimize and define a reliable fuse programming window.

• ETRI Journal
• /
• v.24 no.4
• /
• pp.259-269
• /
• 2002

Polymers are emerging as new alternative materials for optical communication devices. We developed two types of polymer-based devices for optical communications. One type is for ultra high-speed signal processing that uses nonlinear optical (NLO) polymers in such devices as electro-optic (EO) Mach-Z${\ddot{e}} $ hnder (MZ) modulators and EO 2${\times}$2 switches. The other is for WDM optical communications that use low-loss optical polymers in such devices as 1${\times}$2, 2${\times}$2, 4-arrayed 2${\times}$2 digital optical switches (DOSs) and 16${\times}$16 arrayed waveguide grating (AWG) routers. For these devices, we synthesized a polyetherimide-disperse red 1 (PEI-DR1) side chain NLO polymer and a low-loss optical polymer known as fluorinated polyaryleneethers (FPAE). This paper presents the details of our development of these polymeric photonic devices considering all aspects from materials to packaging.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.11-18
• /
• 2016

This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which diameter and shape were $45{\sim}150{\mu}m$ and sphere type was prepared by gas atomization process. As we compared to commercial Fe-6.5Si powder, its diameter distribution and microstructure of recycled powder was a similar. To investigate the possibility of reusing the soft magnetic composite sheet for electronics, recycled powder was treated to have a high aspect ratio (AR), and we finally obtained the 65~66 AR and $2.3{\mu}m$ thickness powder. To release the residual stress of powder, heat treatment was conducted under $300{\sim}400^{\circ}C$, $N_2$ gas. And then, soft magnetic sheet was made by tape casting process using by those powders. After the density and permeability of tape was measured, and we confirmed that the recycled Fe-Si electric sheet scrap was possible to reuse the soft magnetic materials of electronics.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.31-35
• /
• 2020

This study demonstrates metal-oxide based memtransistor device and the gate tunable memristive characteristic using atomic layer deposition (ALD) and ZnO n-type oxide semiconductor. We fabricated a memtransistor device having channel width 70 ㎛, channel length 5 ㎛, back gate, using 40 nm thick ZnO thin film, and measured gate-tunable memristive characteristics at each gate voltage (50V, 30V, 10V, 0V, -10V, -30V, -50V) under humidity of 40%, 50%, 60%, and 70% respectively, in order to investigate the relation between a memristive characteristic and hydrogen doping effect on the ZnO memtransistor device. The electron mobility and gate controllability of memtransistor device decreased with an increase of humidity due to increased electron carrier concentration by hydrogen doping effect. The gate-tunable memristive characteristic was observed under humidity of 60% 70%. Resistive switching ratio increased with an increase of humidity while it loses gate controllability. Consequently, we could obtain both gate controllability and the large resistive switching ratio under humidity of 60%.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.51-54
• /
• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.1-8
• /
• 2017

Fe-9.8Si-6.0Al mother alloy was manufactured using by Fe-3.5Si recycled scrap and Si powder. And then, soft magnetic alloy powder of $D_{50}$ size and sphere type were prepared by gas atomization process. To obtain the soft magnetic powder of a high aspect ratio, in the first, we conducted the ball milling process for 8 hours. And heat treatment was performed under $650^{\circ}C$, 2 hours and $N_2$ atmosphere condition for reducing the residual stress of the powder. Based on these process, we made around $50{\mu}m$ diameter Fe-9.8Si-6.0Al powder, which morphology and shape was a similar to the commercial Fe-Si-Al powder. Finally, the soft magnetic sheets were prepared by tape casting process using by those powders. The permeability of the tape casting sheet was measured, and we confirmed the possibility of reusing to the soft magnetic materials of Fe-Si electric sheet scrap.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.3
• /
• pp.19-22
• /
• 2013

Recently, high speed transmission and large information demand have been increased. Also, researches of integrated optical device for large production and high-efficient planar lightwave circuit (PLC) have been increased. In this paper, integrated optical alignment is proposed which makes passive alignment between optical device and optical fiber possible. The integrated optical device consists of splitter structures which have one input and two outputs. The proposed integrated structure was fabricated by roll-to-roll (RTR) processing method. This method enables to manufacture continuously and the processing time can be shortened. Optical property of the fabricated optical device showed 3.9 dB insertion loss and 0.2 dB optical uniformity using the light source with 1550 nm wavelength.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.3
• /
• pp.25-32
• /
• 2021

In this paper, the Magneto-Electric(ME) dipole array antenna with dual-polarization in the X-Band is proposed and it is implemented and measured. The proposed array antenna is composed of 32 single ME dipole antenna and a Teflon PCB. 1 × 1 ME dipole antenna is implemented dual-polarization by radiating vertical polarization and horizontal polarization from two pairs of radiators. 2-port feeding structures are realized by lamination process using LTCC. And, each port independently feeds the radiator through a Γ-shaped feeding strip with isolation between ports. The Teflon PCB used in the antenna array has a 4-layer structure, and 2-port is fed through the top and bottom layers. The λ_g/4 transformer is applied to the transmission line of the Teflon PCB for impedance matching of the arrayed antenna and the Teflon PCB, and the optimal parameters are obtained through simulation. The measured maximum antenna gains of port 1 was 18.2 dBi, Cross-pol was 1.0 dBi. And the measured maximum antenna gains of port 1 was 18.1 dBi, Cross-pol was 3.2 dBi.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.2
• /
• pp.39-44
• /
• 2021

In this paper, two types of BPF(Band Pass Filter) which are hair-pin and interdigital have been designed for millimeter-wave application using two types of material which are LCP(Liquid Crystal Polymer) and PTFE(Polytetrafluoroethylene) and also, their performances such as bandwidth, insertion loss, and in-band flatness are compared. The proposed BPF are designed as third-order filters, and their pass band is from 26.5 GHz to 27.3 GHz. Interdigital BPF using PTFE substrate has most wide -3 dB S21 bandwidth of 7.8 GHz and hair-pin BPF using LCP substrate has most narrow -3 dB S21 bandwidth among the proposed four BPF. For in-band insertion loss, hair-pin BPF using PTFE substrate achieves low insertion loss better than -0.667 dB, and hair-pin BPF using LCP substrate exhibits relatively high insertion loss among the proposed four BPF better than -0.937 dB. However, the maximum difference in insertion loss performance among the proposed four BPF is 0.27 dB, which is too small to negligible. For in-band flatness, interdigital BPF using PTFE substrate shows greatest performance of 0.017 dB, and hair-pin BPF using LCP substrate exhibits the lowest performance of 0.07 dB. There are tiny difference in in-band flatness performance of 0.053 dB. As a results, it is considered that the BPF using LCP substrate can derive the performances similar to that of the BPF using PTFE substrate in Millimeter-wave band.