Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste |
Eom, Yong-Sung
(Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute)
Son, Ji-Hye (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) Lee, Hak-Sun (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) Choi, Kwang-Seong (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) Bae, Hyun-Cheol (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) Choi, Jeong-Yeol (Department of Materials Science and Engineering, Hongik University) Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University) Moon, Jong-Tae (CEO of Hojeonable Ltd.) |
1 | A. Mette, "New Concepts for Front Side Metallization of Industrial Silicon Solar Cells", Ph.D Thesis, Fraunhofer-Institute for Solar Energy System, Freiburg im Breisgau, Germany (2007). |
2 | A. Nguyen, A. Fioramonti, D. Morrissey, H. Efstathiadis, Z. Zhouying and P. Haldar, "Feasibility of Improving Front Metallization Lines for Photovoltaic Devices", Proc. 34th Photovoltaic Specialists Conference (PVSC), Philadelphia, PA, 000312, IEEE (2009). |
3 | Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam and J. M. Kim, "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film", Microelectron. Eng., 85(2), 327 (2008). DOI |
4 | Y. S. Eom, K. S. Jang, J. T. Moon, J. D. Nam and J. M. Kim, "Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder", Microelectron. Eng., 85(11), 2202 (2008). DOI |
5 | Y. S. Eom, K. S. Jang, J. T. Moon and J. D. Nam, "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder", ETRI J., 32(3), 414 (2010). DOI |
6 | J. W. Baek, K. S. Jang, Y. S. Eom, J. T. Moon, J. M. Kim and J. D. Nam, "Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder", Microelectron. Eng., 87(10), 1968 (2010). DOI |
7 | K. S. Jang, Y. S. Eom, J. T. Moon, Y. S. Oh and J. D. Nam, "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing", J. Nanosci. Nanotechnol., 9(12), 7461 (2009). |
8 | K. S. Choi, K. J. Sung, B. O. Lim, H. C. Bae, S. H. Jung, J. T. Moon and Y. S. Eom, "Novel Maskless Bumping for 3D integration", ETRI J., 32(2), 342 (2010). DOI |
9 | Y. S. Eom, K. S. Choi, S. H. Moon, J. H. Park, J. H. Lee and J. T. Moon, "Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive", ETRI J., 33(6), 864 (2011). DOI |
10 | G. H. Kim, K. M. Jung, J. T. Moon and J. H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014). DOI |
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