• Macromolecular Research
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• v.10 no.5
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• pp.259-265
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• 2002

The cure kinetics of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer, poly(dimmer acid-co-alkyl polyamine), were studied using differential scanning calorimetry (DSC) under isothermal condition. On increasing the amount of polyamide copolymer in the blends, the reaction rate was increased and the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/(polyamide copolymer) blends indicate that polyamide hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m, for the initial autocatalytic reaction was not affected by blending polyamide copolymer with epoxy resin, and the value was approximately 1.3, whereas the reaction order, n, for the general n-th order of reaction was increased by increasing the amount of polyamide copolymer in the blends, and the value increased from 1.6 to 4.0. A diffusion-controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/(polyamide copolymer) blends. Complete miscibility was observed in the uncured blends of epoxy/(polyamide copolymer) up to 120 $^{\circ}C$, but phase separations occurred in the early stages of the curing process at higher temperatures than 120 "C. During the curing process, the cure reaction involving the functional group in polyamide copolymer was detected on a DSC thermogram.gram.

• 연구논문집
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• s.29
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• pp.151-162
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• 1999

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.214-217
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• 2004

The cure kinetics of blends of epoxy(tetraglycidyl-4,4'-diaminodiphenylmethane ; TGDDM)/curing agent(diaminodiphenyl sulfone ; DDS) resin with amine terminated polyetherimide-CTBN-amine terminated polyetherimide triblock copolymer(ABA) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of ABA in the blends, the final cure conversion was decreased. Lower values of the final cure conversions in the epoxy/ABA blends indicated that ABA hinders the cure reaction between the epoxy and curing agents. 1be value of the reaction order, m, for the initial autocatlytic reaction was not affected by blending ABA with epoxy resin, and the value was approximately 1.0. The value of n for the nth order component in the autocatalytic analysis was increased by increasing the amount of ABA in the blends, and the value increased from 2.0-3.4. A diffusion controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/DDS/ABA blends.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.32-36
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• 2001

Recently, reaction injection molding has been used broadly for rapid prototyping, because of its convenience and versatility. Since the properties of molded products are dependent on the process variables and the production is very short(less than 2minutes), the control of process variables is important. Generally, the two significant process variables are degree of cure and temperature of the reactants. In this paper, the relation between the degree of cure and the temperature of reactants was investigated to find the optimal curing condition of reaction injection molding for rapid prototyping. The degree of cure during reaction injection molding was measured by the Lacomtech sensor and dielectrometry equipment employing Wheatstone bridge type circuit.

• Elastomers and Composites
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• v.48 no.2
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• pp.161-166
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• 2013

Thermal degradation behavior of chlorine cure-site ACM and carboxylic cure-site ACM rubbers was studied by non-isothermal TGA thermal analysis. Carboxylic cure-site ACM rubber exhibited comparatively more thermally stable than chlorine cure-site ACM, showing higher peak temperature, at which maximum reaction rate occurred. Activation energies from Kissinger method were calculated as 118.6 kJ/mol for the chlorine cure-site ACM and 105.5 kJ/mol for the carboxylic cure-site ACM, showing similar values from Flynn-Wall-Ozawa analysis over the conversion range of 0.1~0.2. From the analysis of the reaction order change, both samples seemed thermally decomposed through the multiple reaction mechanism as is the common rubber materials.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

• Macromolecular Research
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• v.11 no.4
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• pp.267-272
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• 2003

The isothermal cure reactions of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer (poly(dimmer acid-co-alkyl polyamine)) or PEI were studied using differential scanning calorimetry (DSC). Rheological measurements have been made to investigate the viscosity and mechanical relaxation behavior of the blends. The reaction rate and the final cure conversion were decreased with increasing the amount of thermoplastics in the blends. Lower values of final cure conversions in the epoxy/thermoplastic blends indicate that thermoplastics hinder the cure reaction between the epoxy and the curing agent. Complete miscibility was observed in the uncured blends of epoxy/thermoplastics up to $120^{\circ}C$ but phase separations occurred in the early stages of the curing process at higher temperatures than $120^{\circ}C$. According to the rheological measurement results, a rise of G' and G" at the onset of phase separation is seen. A rise of G' and G" is not observed for neat epoxy system since no phase separation is seen during cure reaction. At the onset of phase separation the rheological behavior was influenced by the amount of thermoplastics in the epoxy/thermoplastic blends, and the onset of phase separation can be detected by rheological measurements.

• Polymer(Korea)
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• v.24 no.1
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• pp.65-71
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• 2000

The latent properties and cure kinetics of an acid anhydride-cured epoxy resin have been investigated by a near-infrared (NIR) reflection spectroscopy. The assignments of the latent properties and cure behaviors were performed by the measurements of the NIR reflectance for epoxide and hydroxyl groups at different temperatures. A comprehensive analysis of the origin, location, and shifts during reaction of all major NIR absorption peaks in the spectral range from 4000 to 7100 $cm^{-1}$ / was provided. The extent of reaction was determined from NIR absorption band at the 4530 $cm^{-1}$ / depending on epoxide concentration and cure temperature.

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.