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http://dx.doi.org/10.5228/KSTP.2012.21.2.101

A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin  

Song, M.J. (한국생산기술연구원 금형.성형연구그룹, 고려대학교 대학원)
Kim, H.K. (한국생산기술연구원 금형.성형연구그룹)
Yoon, G.S. (한국생산기술연구원 금형.성형연구그룹)
Kim, K.H. (고려대학교 기계공학부)
Publication Information
Transactions of Materials Processing / v.21, no.2, 2012 , pp. 101-106 More about this Journal
Abstract
Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.
Keywords
LED; Encapsulation; Silicone Resin; Step Cure Process; Bubbles;
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