• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.8
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• pp.584-592
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• 2012

Room temperature powder spray in vacuum process, so called Aerosol deposition (AD) is a room temperature (RT) process to fabricate thick and dense ceramic films, based on collision of solid ceramic particles. This technique can provide crack-free dense thin and thick films with thicknesses ranging from sub micrometer to several hundred micrometers with very fast deposition rates at RT. In addition, this technique is using solid particles to form the ceramic films at RT, thus there is few limitation of the substrate and easy to control the compositions of the films. In this article, we review the progress made in synthesis of piezoelectric thin/thick films, multi-layer structures, NTC thermistor thin/thick films, oxide electrode thin films for actuators or sensor applications by AD at Korea Institute of Materials Science (KIMS) during the last 4 years.

• International Journal of Aeronautical and Space Sciences
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• v.1 no.1
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• pp.48-61
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• 2000

Korea Aerospace Research Institute (KARI) have gained experience with Helicopter Vibration Health Monitoring (VHM) System technology with the help of UK GKN-WHL. GKN-WHL have had many years of experience with the research and development of vibration analysis techniques to improve the health monitoring of helicopter transmissions. This activity was targeted at transmission rig testing at first, but the techniques have been progressively developed where they are now used as a part of integrated Health and Usage Monitoring (HUM) systems on many types of in-service and new helicopters. The technique development process has been considerably aided by an ever expanding database of transmission monitoring experience from both the rig testing and aircraft operations. This experience covers a wide range of failure types from naturally occurring faults to crack propagation studies and covering a wide range of transmission configurations. Primarily based on accelerometer signals GKN-WHL's vibration analysis methods have also been applied to a variety of other sensor types. The transition from an experimental environment to operational VHM systems has been a lengthy process, there being a need to demonstrate technique reliability as well as effectiveness to both regulatory (Airworthiness Authority) and commercial organizations. Another important feature of this process has been the development of close relationships with a number of VHM system hardware and software suppliers. Such an experienced GKN-WHL provides various raw vibration data which was acquired from transmission ground test rig and allow KARI to develop it's own analysis program. KARI made a program and then analyzed the data to coma pre with the results of GKN-WHL. The KARI's results both time domain signals and statistical values show comparable to GKN's.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Journal of Sensor Science and Technology
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• v.8 no.6
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• pp.440-447
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• 1999

Tensile stress loaded on smart composite structures and thermal stress occurred during the during process of the smart composite materials with embedded optical fiber sensors affect directly the mechanical behavior of the embedded optical fiber sensors within the smart composite structures. Stress distribution within the optical fiber sensors varies with respect to the stacking sequence of the composite laminate and the coating conditions of the optical fibers. The cracks occurred within the composite laminate affect not only the fracture of the composite laminate but also the fracture of the optical fiber sensors embedded within the composite laminate. In this study, firstly, stress distribution of the optical fiber sensors embedded within the composite laminate which is subjected to the tensile and thermal stresses was analyzed using Finite Element Method. And, secondly, the effect of the stacking sequence of the composite laminate and the coating conditions of the optical fiber sensors on the stress distribution of the optical fiber sensors was investigated. Finally, the effect of the crack occurred within the smart composite laminate on the fracture behavior of the optical fiber sensors was also observed through the tensile test.

• Spatial Information Research
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• v.16 no.2
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• pp.263-278
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• 2008

Nowaday, local governments have planned to manage intelligent underground facilities through the u-City project. But, the intelligent underground facilities are in need of the progressive approach because of the required huge financial resources. Therefore, the objectives of this research are (1) to prioritize the monitoring items of sensing technology developments, (2) to study technological feasibilities, and (3) to discover the killer application which expands ripple effects on economy. To achieve these objectives, final monitoring items were derived from the business analysis of the water supply, the local government survey, the hearing expert opinions and so on. The priority order of final monitoring items were technology developments of (1) the flowmeter flux, (2) the water leakage/crack, (3) the pressure of water supply pipes, and (4) the flux of filtration plants. The research significance is obtained from the derivation and the evaluation of the priority order and the actual demand for the water supply facility management. And, the research results will contribute to the strategic planning for the underground facility intelligence.

• Journal of the Korean Ceramic Society
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• v.54 no.3
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• pp.243-248
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• 2017

Pd-doped $SnO_2$ thick film with a pure tetragonal phase was prepared on patterned Pt electrodes by an ink dropping method. Nanostructured $SnO_2$ powder with a diameter of 10 nm was obtained by a modified hydrazine method. Then the ink solution was fabricated by mixing water, glycerol, bicine and the Pd-doped $SnO_2$ powder. When the Pd doping concentration was increased, the grain size of the Pd-doped $SnO_2$ thick film became smaller. However, an agglomerated and extruded surface morphology was observed for the films with Pd addition over 4 wt%. The orthorhombic phase disappeared even at a low Pd doping concentration and a PdO peak was obtained for a high Pd doping concentration. The crack-free Pd-doped $SnO_2$ thick films were able to successfully fill the $30{\mu}m$ gap of the patterned Pt electrodes by the optimized ink dropping method. The prepared 3 wt% Pd-doped $SnO_2$ thick films showed monoxide gas responses ($R_{air}/R_{CO}$) of 4.0 and 35.6 for 100 and 5000 ppm, respectively.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.96-100
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• 2005

The planar Schottky diodes were fabricated and modeled to probe the device applicability of the cracked GaN epitaxial layer on a (111) silicon substrate. On the unintentionally n-doped GaN grown on silicon, we deposited Ti/Al/Ni/Au as the ohmic metal and Pt as the Schottky metal. The ohmic contact achieved a minimum contact resistivity of $5.51{\times}10.5{\Omega}{\cdot}cm^{2}$ after annealing in an $N_{2}$ ambient at $700^{\circ}C$ for 30 sec. The fabricated Schottky diode exhibited the barrier height of 0.7 eV and the ideality factor was 2.4, which are significantly lower than those parameters of crack free one. But in photoresponse measurement, the diode showed the peak responsivity of 0.097 A/W at 300 nm, the cutoff at 360 nm, and UV/visible rejection ratio of about $10^{2}$. The SPICE(Simulation Program with Integrated Circuit Emphasis) simulation with a proposed model, which was composed with one Pt/GaN diode and three parasitic diodes, showed good agreement with the experiment.

• Journal of Sensor Science and Technology
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• v.17 no.6
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• pp.418-424
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• 2008

The PZT based piezoelectric thick films prepared by screen printing method have been mainly used as a functional material for MEMS applications due to their compatibility of MEMS process. However the screen printed thick films generally reveal poor electrical and mechanical properties because of their porous microstructure. To improve microstructure we mixed attrition milled powder with ball milled powder of 0.01Pb$(Mg_{1/2}W_{1/2})O_3$-0.41Pb$(Ni_{1/3}Nb_{2/3})O_3$-$0.35PbTiO_3$-$0.23PbZrO_3$+0.1 wt% ${Y_2}{O_3}$+1.5 wt% ZnO composition. By mixing 25 % of attrition milled powder and 75 % of ball milled powder, the broadest particle size distribution was obtained, leading to a dense thick film with crack-free microstructure and improved dielectric properties. The X-ray diffraction analysis revealed that the film was in wellcrystallized perovskite phase. The remanent polarization was increased from $13.7{\mu}C/cm^2$ to $23.3{\mu}C/cm^2$ at the addition of 25 % attrition milled powder.

• Journal of the Korea institute for structural maintenance and inspection
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• v.24 no.3
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• pp.70-79
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• 2020

The main objective of this research to develop an IoT based wireless contactless ultrasonic system (ICUS) and its application to concrete structure. The developed system consists of 16 mems, 2Mhz digitizer, amplifying circuit, FPGA, and wifi module, enabling to measure leaky surface waves from concrete specimens without physical coupling process and wires. Multi-channel analysis is performed to improve the accuracy of data analysis, and the velocity of leaky surface waves and acoustics are derived. Field inspection of railroad concrete sleepers is conducted to evaluate the performance of the system and to compare the results with conventional ultrasonic pulse velocity (UPV). As a result of the field inspection, UPV was limited to evaluate damages. This is because crack pattern of railroad sleepers is parallel to ultrasonic ray path and accessibility of the railroad at the field is disadvantageous to contact-based UPV. On the other hand, ICUS possibly detect the damages as reduction of dynamic modulus by up to 59% compared to non-damaged specimen.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.