• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• Current Photovoltaic Research
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• 제4권4호
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• Journal of Industrial and Engineering Chemistry
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• 제68권
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• pp.387-392
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• 2018

Various technical approaches and concepts have been proposed to develop conductive super-hydrophobic (SH) surfaces. However, most of these approaches are not usable in practical applications because of insufficient adhesion and cost issues. Additionally, durability and uniformity issues are still in need of improvement. The goal of this research is to produce a large-area conductive SH surface with improved adhesion performance and uniformity. To this end, carbon nanotubes (CNT) with a high aspect ratio and elastomeric polymer were utilized as a conductive filler and matrix, respectively, to form a coating layer. Additionally, nanoscale silica particles were utilized for stable implementation of the conductive SH surface. To improve the adhesion properties between the SH coating layer and substrate, pretreatment of the substrate was conducted by utilizing both wet and dry etching processes to create specific organic functional groups on the substrate. Following pretreatment of the surface, a zirco-aluminate coupling agent was utilized to enhance adhesion properties between the substrate and the SH coating layer. Raman spectroscopy revealed that adhesion was greatly improved by the formation of a chemical bond between the substrate and the SH coating layer at an optimal coupling agent concentration. The developed conductive SH coating attained a high electromagnetic interference (EMI) shielding effectiveness, which is advantageous in self-cleaning EMI shielding applications.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1119-1121
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• 2006

Using a chemical radical we modified the surface property of PET substrates. The chemically treated substrate surface improved dispersion of CNTs on substrate and provides suitable adhesion of CNTs to substrate. In addition, an ink-jet printed patterning technique effectively improved the transparency of transparent conductive CNT composite films.

• Transactions on Electrical and Electronic Materials
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• 제5권6호
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• pp.241-243
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• 2004

The phase transition between amorphous and crystalline states in chalcogenide semiconductor films can be controlled by electrical or pulsed laser beam; hence some chalcogenide semiconductor films can be applied to electrically write/erase nonvolatile memory devices, where the low conductive amorphous state and the high conductive crystalline state are assigned to binary states. In this letter, the characteristics of phase transition in differential chalcogenide thin film are investigated. Al was used for the electrode as the thickness of 100, 300, 500 nm, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.340-343
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• 2004

The phase transition between amorphous and crystalline states in chalcogenide semiconductor films can controlled by electric pulses or pulsed laser hem: hence some chalcogenide semiconductor films can be applied to electrically write/erase nonvolatile memory devices, where the low conductive amorphous state and the high conductive crystalline state are assigned to binary states. This letters researched into the characteristic of phase change transition in differential Chalcogenide thin films materials. The electrode used Al and experimented on 100nm, 300nm, 500nm respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.377-380
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• 2004

The phase transition between amorphous and crystalline states in chalcogenide semiconductor films can controlled by electric pulses or pulsed laser beam; hence some chalcogenide semiconductor films can be applied to electrically write/erase nonvolatile memory devices, where the low conductive amorphous state and the high conductive crystalline state are assigned to binary states. GeSbTe(GST), AsSbTe(AST), SeSbTe(SST) used to phase change materials by appling electrical pulses. Thickness of ternary chalcogenide thin films have about 100nm. Upper and lower electrode were made of Al. It is compared with I-V characteristics after impress the variable pulses.

• 한국표면공학회지
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• 제51권6호
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• pp.365-371
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• 2018

1D core-shell nanostructures have attracted great attention due to their enhanced physical and chemical properties. Specifically, oriented single-crystalline $TiO_2$ nanorods or nanowires on a transparent conductive substrate would be more desirable as the building core backbone. However, a facile approach to produce such structure-based hybrids is highly demanded. In this study, a three-step hydrothermal method was developed to grow NiMn-layered double hydroxide-decorated $TiO_2$/carbon core-shell nanorod arrays on transparent conductive fluorine-doped tin oxide (FTO) substrates. XRD, SEM, TEM, XPS and Raman were used to analyze the obtained samples. The in-situ fabricated hybrid nanostructured materials are expected to be applicable for photoelectrode working in water splitting.

• 한국지반환경공학회 논문집
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• 제21권12호
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• pp.35-41
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• 2020

도심지의 건축구조물 밀집 및 아파트 재건축 등으로 인하여 지하공간 개발이 다양하게 이루어지고 있으나, 차수 및 지반보강작업에 있어 부등침하와 같은 다양한 문제들이 발생하고 있다. 지반 보강에 있어 빈번히 사용되고 있는 그라우팅 공법에서는 시공단계에서 투입된 그라우트 재의 주입량 측정 또는 지반 보링 후 일축압축강도시험을 통해 품질관리를 수행하고 있으나, 시공단계에서 지반 보강이 제대로 이루어졌는지는 판단하기 어려운 실정이다. 이러한 문제를 해결하기 위해 전도성 재료가 혼합된 그라우트 재를 사용하여 그라우팅을 수행한 후 전기비저항 측정을 통해 품질관리를 수행하기 위한 연구가 필요한 실정이다. 본 연구는 이에 대한 기초연구로 전도성 재료인 탄소섬유가 혼합된 그라우트 재의 성능을 평가하기 위해 탄소섬유가 0%, 3%, 5%, 7%로 혼합된 시멘트 공시체를 제작하였으며. 제작한 공시체에 대하여 7일, 14일, 28일 수중양생 시킨 후 1%/min의 변형속도로 일축압축시험을 수행하였다. 일축압축시험 결과 탄소섬유의 배합비 증가에 따라 일축압축강도가 증가하는 경향을 보였으며, 혼합된 탄소섬유가 그라우트재의 조기강도 발현에 영향을 미치는 것을 확인하였다.

• Elastomers and Composites
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• 제52권1호
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• pp.22-26
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• 2017

The thermal conductivity and the adhesive properties were measured, after synthesis of thermal conductive composite which was obtained as a result of mixing alumina or graphite with acrylic adhesive synthesized by UV polymerization. The adhesive properties of the composite were evaluated measuring the peel strength at 180 degrees, the retention, and the initial tack;the thermal conductivity was estimated using laser flash analysis. As the filler contents increased, a decrease in peel strength and initial tack and an increase in retention and thermal conductivity were observed. When compared to alumina, the adhesion of graphite showed a dramatic decrease, whereas the thermal conductivity was further enhanced. It was found out that the small size of graphite increased the mechanical interlocking between the polymer and the filler, and it was easier for graphite to come into contact with other graphite in the matrix.