• 한국재료학회지
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• 제29권1호
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• 한국인쇄학회지
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• 제29권2호
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• 한국인쇄학회지
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• 제29권2호
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• pp.71-82
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• 2011

Electronic display markets has been developed. The cathode ray tube of brown form recently celebrated their 100th by first display. Also LCD of flat form recently celebrated their 25th by second display and it has advantage of small volume, lower consumption power. But FPD has problem that is property of brittle and noncarrying by glass substrate. Therefore the arrival of portable electronics devices has put an increasing premium on durable, lightweight and inexpensive display components. It is flexible display by third display. Also electronics field such as printed wiring board, RFID, membrane switch prefer flexible display. The conductive pattern can be used mostly in field of electronic displays and electronics. This manufacture of conductive pattern in present used is screen printing. The the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity. screen printing has problem that is low productivity and use not flexible substrate because of high fire temperature. This study was developed novel method to form the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.51-56
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• 2014

가격적 경쟁력을 가지는 Ag 코팅 Cu 플레이크 함유 도전성 페이스트를 제조하여 경화조건에 따른 열전도도 및 전기전도도 값의 변화를 측정하였다. 대기 중에서 경화시킨 시편의 경우 경화시간이 30분에서 60분으로 증가됨에 따라 열전도도가 증가하는 경향이 관찰되었다. 60분의 동일한 경화시간 조건에서는 질소 중 경화 시편이 대기 중 경화 시편보다 향상된 열전도도 값을 나타내었다. 그 결과 질소 중에서 60분간 경화시킨 Ag 코팅 Cu 플레이크 페이스트는 순수 Ag 플레이크가 함유된 페이스트가 나타내는 열전도도에 근접하는 열특성을 나타내었다. 한편 대기 중 경화 시편의 경우 경화시간이 30분에서 60분으로 증가됨에 따라 비저항 값이 더욱 증가하는 경향이 관찰되었나, 60분의 동일한 경화시간 조건에서 질소 중 경화 시편은 대기 중 경화 시편에 비할 수 없을 만큼 개선된 비저항 값($7.59{\times}10^{-5}{\Omega}{\cdot}cm$)을 나타내었다.

• 공업화학
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• 제32권1호
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• pp.28-34
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• 2021

SiO2/Ag 코어-쉘 나노입자를 수정된 Stöber 공정법과 물/dodecylbenzenesulfonic acid (DDBA)/cyclohexane의 역 미셀에서 acetoxime을 환원제로 사용하는 역 미셀 방법을 상호 조합하여 합성하였다. SiO2/Ag 코어-쉘은 UV-visible spectroscopy, XRD, SEM 및 TEM을 사용하여 구조, 형태 및 크기를 조사하였다. SiO2/Ag 코어-쉘의 나노입자 크기는 [물]/[DDBA]의 몰비(WR)의 값을 조절하여 제어할 수 있었다. SiO2/Ag 코어-쉘의 크기와 다분산성은 WR 값이 증가함에 따라 증가하였다. 비정질 SiO2 나노입자 위에 생성된 Ag 나노입자는 430 nm에서 강한 표면 플라즈몬 공명 (SPR) 피크를 나타내었다. SPR 피크는 나노입자 크기의 증가에 따라 장파장으로의 적색 이동을 나타내었다. 합성된 SiO2/Ag 코어-쉘을 분산시켜 70 wt% 조성의 전도성 페이스트를 제조하고, 스크린 인쇄법으로 PET 필름에 코팅하여 전도성을 조사하였다. SiO2/Ag 코어-쉘 페이스트로 코팅된 필름은 상용 Ag 페이스트에 비하여 높은 460~750 µΩ/sq 영역의 표면저항을 나타내었다.

• 공업화학
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• 제34권1호
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• pp.36-44
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• 2023

코어-쉘 TiO₂/Ag 나노입자를 수정된 졸-겔 공정과 함께 acetoxime을 환원제로 사용한 물/dodecylbenzenesulfonic acid (DDBA)/cyclohexane의 역 미셀 방법으로 합성하였다. 합성된 TiO₂/Ag 나노입자의 구조, 형태 및 크기를 XRD, UV-visible spectroscopy, SEM, TEM 및 TGA를 이용하여 조사하였다. TiO₂/Ag 나노입자의 크기는 [물]/[DDBA]의 몰비를 조절하여 제어할 수 있었다. TiO₂/Ag 나노입자의 크기와 다분산성은 [물]/[DDBA]의 몰비가 증가함에 따라 증가하였다. 아나타제 결정상의 TiO₂ 나노입자 위에 생성된 Ag 나노입자는 430 nm 주변에서 강한 표면 플라즈몬 공명(SPR) 흡수 특성을 나타내었다. SPR 피크는 나노입자 크기의 증가에 따라 장파장으로의 적색 이동이 나타났다. 70 wt% 조성으로 TiO₂/Ag 나노입자를 분산시켜 전도성 페이스트를 제조하고, 스크린 인쇄법으로 PET 필름에 코팅하여 전도성을 조사하였다. TiO₂/Ag 나노입자 페이스트로 코팅된 필름은 상용 Ag 페이스트의 경우보다 높은 405~630 μΩ/sq 영역의 표면저항을 나타내었다.

• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.267-271
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• 2019

A shingled PV module is manufactured by dividing and bonding. In this method, the solar cell is divided by lasers and bonded using electrically conductive adhesives (ECAs). Consequently, the manufacturing cost increases because a process step is added. Therefore, we aim to reduce the production cost by reducing the amount of Ag paste used in the solar cell front. Various electrode structures were designed and simulated. The number of fingers was optimized by designing thinner fingers, and the number of fingers with the maximum power conversion efficiency was confirmed. The simulation confirmed the maximum efficiency in the 4-divided electrode pattern. The amount of Ag paste used for each electrode pattern was calculated and analyzed. The number of fingers was optimized by decreasing the width of the finger; this will not only reduce the amount of Ag paste required but also the increase the efficiency.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1076-1077
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• 2006

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.384-385
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• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.