Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09b
- /
- Pages.1076-1077
- /
- 2006
Surface Modification of Ag Coated Cu Conductive Metal Powder for Conductive Silicone Sealant Gasket Paste
- Park, Seong-Yong (Department of ceramic engineering, Yonsei University) ;
- Yoon, Tae-Won (R&D center, Changsung corporation) ;
- Lee, Chung-Ho (R&D center, Changsung corporation) ;
- Jeong, In-Bum (R&D center, Changsung corporation) ;
- Hyun, Sang-Hoon (Department of ceramic engineering, Yonsei University)
- Published : 2006.09.24
Abstract
Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.