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http://dx.doi.org/10.3740/MRSK.2019.29.1.37

Fabrication and Characterization of Silver Copper(I) Oxide Nanoparticles for a Conductive Paste  

Park, Seung Woo (ChangSung Nanotech. Co., Ltd)
Son, Jae Hong (ChangSung Nanotech. Co., Ltd)
Sim, Sang Bo (ChangSung Nanotech. Co., Ltd)
Choi, Yeon Bin (School of Nano & Advanced Materials Engineering, Changwon National University)
Bae, Dong Sik (School of Nano & Advanced Materials Engineering, Changwon National University)
Publication Information
Korean Journal of Materials Research / v.29, no.1, 2019 , pp. 37-42 More about this Journal
Abstract
This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.
Keywords
paste; copper oxide; silver; nanoparticle; electrical properties;
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