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http://dx.doi.org/10.6117/kmeps.2014.21.4.051

Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler  

Kim, Gahae (Hojeonable, Inc.)
Jung, Kwang-Mo (Hojeonable, Inc.)
Moon, Jong-Tae (Hojeonable, Inc.)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.4, 2014 , pp. 51-56 More about this Journal
Abstract
After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.
Keywords
Ag-coated Cu flake; Conductive paste; Curing condition; Thermal conductivity; Electrical resistivity;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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