• Composites Research
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• v.28 no.5
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• pp.260-264
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• 2015

In this paper, molecular dynamics (MD) simulation was carried to predict thermo-mechanical behaviors for carbon nanotube (CNT) reinforced epoxy composites and to analyze the trends. Total of six models having the volume fractions of CNT from 0 to 25% in epoxy were constructed. To predict thermal behaviors, temperature was increased constantly from 300 to 600 K, and the glass transition temperature ($T_g$) and coefficient of thermal expansion (CTE) analyzed using the relationship between temperature and specific volume. The elastic moduli that represented to the mechanical behaviors were also predicted by constant strain. Additionally, the effects of functionalization of CNT on mechanical behaviors of composite were analyzed. Models were constructed to represent CNTs functionalized by nitrogen doping and COOH groops, and interfacial behaviors and elastic moduli were analyzed. Results showed that the agglomerations of CNTs in epoxy cause by perturbations of thermo-mechanical behaviors, and the functionalization of CNTs improved the interfacial response as well as mechanical properties.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.266-270
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• 2012

A series of polyimide was prepared by reacting 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) as the anhydride monomer and 2,2'-bis(trifluoromethyl)benzidine (TFB), 2,2'-bis(3-aminophenyl)hexafluoropropane (BAFP), 2,2'-bis(3- amino- 4-methylphenyl) hexafluoropropane (BAMF), bis(3-aminophenyl)sulfone (APS), p-xylyenediamine (p-XDA), or m-xylyenediamine (m-XDA) as the amine monomer in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the poly(amic acid)s (PAAs) solution at various heat treatment temperatures. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) and the mechanical properties were investigated using universal tensile machine (UTM), Their optical transparencies were also investigated using ultraviolet-visible (UV-vis.) spectrophotometry and colorimetry. The yellow index (YI) and coefficient of thermal expansion (CTE) values of all PIs were in the range 0.98~2.76 and 25.73~55.23 $ppm/^{\circ}C$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.61-67
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• 2020

In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.745-751
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• 2011

This study proposes finite element modeling of dislocation punching at cooling after consolidation in order to calculate the strength of particle-reinforced aluminum composites. The Taylor dislocation model combined with strain gradient plasticity around the reinforced particle is adopted to take into account the size-dependency of different volume fractions of the particle. The strain gradients were obtained from the equivalent plastic strain calculated during the cooling of the spherical unit cell, when the dislocation punching due to CTE (Coefficient of Thermal Expansion) mismatch is activated. The enhanced yield stress was observed by including the strain gradients, in an average sense, over the punched zone. The tensile strength of the SiCp/Al 356-T6 composite was predicted through the finite element analysis of an axisymmetric unit cell for various sizes and volume fractions of the particle. The predicted strengths were found to be in good agreement with the experimental data. Further, the particle-size dependency was clearly established.

• Journal of Powder Materials
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• v.27 no.3
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• pp.219-225
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• 2020

The directed energy deposition (DED) process of metal 3D printing technologies has been treated as an effective method for welding, repairing, and even 3-dimensional building of machinery parts. In this study, stainless steel 316L (STS316L) and Inconel 625 (IN625) alloy powders are additively manufactured using the DED process, and the microstructure of the fabricated STS316L/IN625 sample is investigated. In particular, there are no secondary phases in the interface between STS316L and the IN625 alloy. The EDS and Vickers hardness results clearly show compositionally and mechanically transient layers a few tens of micrometers in thickness. Interestingly, several cracks are only observed in the STS 316L rather than in the IN625 alloy near the interface. In addition, small-sized voids 200-400 nm in diameter that look like trapped pores are present in both materials. The cracks present near the interface are formed by tensile stress in STS316L caused by the difference in the CTE (coefficient of thermal expansion) between the two materials during the DED process. These results can provide fundamental information for the fabrication of machinery parts that require joining of two materials, such as valves.

• Korean Journal of Materials Research
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• v.32 no.9
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• pp.379-383
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• 2022

In this study, Barium Germanium glasses were prepared with a composition of xBaO-(72-x)GeO₂-8La₂O₃-20ZnO where x = 16.0, 18.0, 20.0, 22.0 and 24.0 mol% respectively. Their physical and optical properties, such as refractiveness index, glass transition temperature (T_g), softening temperature (T_s), transmittance and Knoop hardness were studied. The results showed that refractive index, T_g, T_s and coefficient of thermal expansion (CTE) increased with increasing BaO concentration. The refractive index of all the prepared samples was observed between 1.7811 to 1.7881. The Abbe number was calculated by formula using n_d (589.3 nm), n_f (656.3 nm) and n_c (486.1 nm) and observed to be between 38 to 40. The Abbe number of the prepared sample was similar to that of BaO and GeO₂. The transmittance of the prepared glasses was observed to be between 80 ~ 82 % throughout the range from 200 nm to 800 nm. Knoop hardness divided into seven steps were measured 5 class (≥ 450 ~ < 550) of all prepared samples.

• Nuclear Engineering and Technology
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• v.54 no.5
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• pp.1549-1559
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• 2022

As an accident tolerant fuel (ATF) concept, oxide dispersion strengthened Zircaloy-4 (ODS Zry-4) cladding has been developed to enhance the mechanical properties of cladding using laser processing technology. In this study, a simulation technique was established to investigate the mechanical properties and effects of Y₂O₃ particles for the ODS Zry-4. A 3D representative volume element (RVE) model was developed considering the parameters of the size, shape, distribution and volume fraction (VF) of the Y₂O₃ particles. From the 3D RVE model, the Young's modulus, coefficient of thermal expansion (CTE) and creep strain rate of the ODS Zry-4 were effectively calculated. It was observed that the VF of Y₂O₃ particles had a significant effect on the aforementioned mechanical properties. In addition, the predicted properties of ODS Zry-4 were applied to a simulation model to investigate cladding deformation under a transient condition. The ODS Zry-4 cladding showed better performance, such as a delay in large deformation compared to Zry-4 cladding, which was also found experimentally. Accordingly, it is expected that the simulation approach developed here can be efficiently employed to predict more properties and to provide useful information with which to improve ODS Zry-4.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.5
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• pp.483-487
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• 2014

In this study, joining methods with SiC powder as the joining adhesives were studied in order to avoid the residual stresses coming from CTE (Coefficient of Thermal Expansion) mismatch between substrate and joining layer. The shear strength and microstructure of joined material between SiC substrates are investigated. The commercial Hexoloy-SA (Saint-Gobain Ceramics, USA) used in this work as substrate material. The fine ${\beta}$-SiC nano-powder which the average particle size is below 30 nm, $Al_2O_3$, $Y_2O_3$, and $SiO_2$ were used as joining adhesives. The specimens were joined with 20MPa and $1400-1900^{\circ}C$ by hot pressing in argon atmosphere. The shear test was performed to investigate the bonding strength. The cross-section of the joint was characterized by using an optical microscope and scanning electron microscopy (SEM).

• Composites Research
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• v.17 no.6
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• pp.52-57
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• 2004

In this study, mechanical tensile properties of carbon fiber reinforced polymeric (CFRP) composite cycled with thermo-mechanical loading under cryogenic temperature (CT) were measured using cryogenic environmental chamber. Thermo-mechanical tensile cyclic loading (up to 10 times) was applied to graphite/epoxy unidirectional laminate composites far room temperature (RT) to $-50^{\circ}C$, RT to $-100^{\circ}C$ and RT to $-150^{\circ}C$. Results showed that tensile stiffness obviously increased as temperature decreased while the thermo-mechanical cycling has little influence on it. Tensile strength, however, decreased as temperature down to CT while the reduction of strength showed little after CT-cycling. For the analysis of the test results, coefficient of thermal expansion (CTE) of laminate composite specimen at both RT and CT were measured and the interface between fiber and matrix was observed using SEM images.