• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.175-180
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• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.50-50
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• 1999

마이크로 공정을 이용한 초소형 정밀 기계는 공정 기술과 재료 기술의 발전에 의하여 더욱 소형화되고 있으며 특히 기능을 갖는 부분과 이 부분을 제어하는 주변회로의 on-chip화의 요구가 증가되기 시작하였다. 이와 같은 추세에 있어서의 문제점은 초소형 정밀기계 부품 소자의 구동을 위한 에너지원의 개발이다. 즉, 소자의 크기가 작아진 것에 부합되는 초소형의 전지가 필요하게 된 것이다. 따라서 보다 완전한 초소형 정밀 기계 및 마이크로 소자의 구현을 위하여 마이크로 소자와 혼성 (Hybrid) 되어 이용될 수 있는 고성능 및 초소형의 전지의 개발이 필수적이다. 초소형 전지의 구현을 위하여 Li계의 2차 전지를 선택하여 이를 박막화하고 반도체 공정을 도입할 수 있다. 이러한 전지를 박막형 2차 전지 또는 박막형 마이크로 전지(thin film Secondary Battery : TFSB or Thin Film Micro-Battery : TFMB)라 하며 이러한 2차 전지는 일반적인 벌크 전지와 동일하게 cathode/Electolyte/Anode의 구조를 갖는다. 박막의 특성상 전해질은 고상의 물질을 사용하는 것이 벌크형 2차 전지와 다른 점이다. TFSB의 성능은 주로 cathode에 의하여 결정되며 지금까지 많은 cathode 물질에 대한 연구 보고가 발표되고 있다. 반도체 공정을 이용한 TFMB의 제작시 무엇보다 중요한 점은 우수한 고상 전해질 및 anode 물질의 선택에 있다. 최근에 2차 전지를 위한 carbon계 anode를 대체할 수 있는 SnO에 대한 보고가 있는데 이는 한 개의 Sn 원자당 2개 이사의 Li가 반응하여 높은 용량을 갖는 전지의 제작이 가능하기 때문이다. Sno2의 anode는 매우 높은 충전용량을 갖는데 첫 번째 방전시에 Li2O를 생성하여 비가역적 반응을 나타내고 계속되는 충방전 동안 Li-Sn 합금이 생성되어 2차전지의 가역적 반응을 가능하게 한다. SnO2 는 대기중에서 Li 금속보다 안정하기 때문에 전지의 제작 공정 및 사용 면에서 매우 우수한 물질이지만 아직까지 SnO2 구조적 특성과 전지의 충, 방전 특성에 대한 관계의 규명을 위한 정확한 정설은 제시되고 있지 못하다. 본 연구에서는 TFSB anode 물질로써 SnOx박막을 상온에서 여러 전도성 콜렉터 위에 증착하여 그 충, 방전 특성을 보고하였다. 증착된 SnOx박막의 표면은 SEM, AFM으로 분석하였으며 구조의 분석은 XR와 Auger electron spectroscope로 하였다. 충, 방전 특성을 분석하기 위하여 리늄 foil을 대극과 참조 전극으로 하여 EC:DMC=1:1, 1M LiPF6 액체 전해질을 사용한 Half-Cell를 구성하여 100회 이상의 정전류 충, 방전 시험을 행하였다. Half-Cell test 결과 박막의 구조, 콜렉터의 종류 및 Sn/O비에 따라 서로 다른 충, 방전 거동을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Progress in Medical Physics
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• v.10 no.1
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• pp.41-46
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• 1999

There is necessity for making a smaller and more sensitive detector in small field sizes. This report assesses the suitability of metal-loaded thermoluminescent dosimeters for this purpose. Measurements were performed in the 6 MV photon and 6 MeV electron beams of a medical linear accelerator with LiF thermoluminescence dosimeters (TLD-100) embedded in solid water phantom. TLD-100 chips(surface area 3.2 $\times$ 3.2 $\textrm{mm}^2$) loaded with a metal plate(Tin or gold respectively) were used to enhance dose readings to TLD-100. Surface dose was measured for field size 10 $\times$ 10 $\textrm{cm}^2$ and 100 em SSD. Measurements have been made of the enhanced signal intensity and good linearity for absorbed dose with each metal. Using a 1 mm each metal on TLD-l00 in the beam increased the surface dose to 14% and 56% respectively for 6MV photon. In the case of 6 MeV electron, gold plate enhanced the TL response to 13%, but there is no difference for tin plate. The specific dose response of TLD-100 with thin metal plate increases with electron concentration of metal film, this is most likely due to increased electron scattered from the additional material with electron density higher than TLD-100. This emphasizes the role of TL dosimeters with metal as amplified dosimeters for therapeutic high energy x-ray beams. Due to the enhanced dose reading of TLD-100 with metal plate, it could be possible to develop smaller TL dosimeter with high sensitivity.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• Journal of the Korean Magnetics Society
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• v.22 no.5
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• pp.173-177
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• 2012

The multilayer structure of glass/Ta(5.8 nm)/NiFe(5 nm)/Cu(t nm)/NiFe(3 nm)/FeMn(12 nm)/Ta(5.8 nm) as typical GMR-SV (giant magnetoresistance-spin valve) films is prepared by ion beam sputtering deposition (IBD). The coercivity and magnetoresiatance ratio are increased and decreased for the decrease of Cu thickness when the thickness of nonmagnetic Cu layer from is varied 2.2 nm to 3.0 nm. It means that the decrease of non-magntic layer is effected to the interlayer exchange coupling of pinned layer and the spin configuration array of free layer. For experiment of detecting and dropping of magnetic beads we used the GMR-SV sensor with glass/Ta/NiFe/Cu/NiFe/FeMn/Ta structure. From the comparison of before and after for the dropping status of magnetic bead, the variations of MR ratio, $H_{ex}$, and $H_c$ are showed 0.9 %, 3 Oe, and 2 Oe, respectively. The fabrication of GMR-SV sensor was included in the process of film deposition, photo-lithography, ion milling, and MR measurement. Further, GMR-SV device can be easily integrated so that detecting biosensor on a single chip becomes possible.

• KSBB Journal
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• v.22 no.6
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• pp.371-377
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• 2007

Polyhydroxyalkanoates (PHAs) are a family of microbial polyesters that can be produced by fermentation from renewable resources. PHAs can be used as completely biodegradable plastics or elastomers. In this paper, novel applications of PHAs in biosensor are described. A general platform technology was developed by using the substrate binding domain (SBD) of PHA depolymerase as a fusion partner to immobilize proteins of interest on PHA surface. It could be shown that the proteins fused to the SBD of PHA depolymerase could be specifically immobilized onto PHA film, PHA microbead, and microcontact printed PHA surface. We review the results obtained for monitoring the specific interaction between the SBO and PHA by using enhanced green fluorescent protein, red fluorescent protein, single chain antibody against hepatitis B virus preS2 surface protein and severe acute respiratory syndrome coronavirus surface antigen as model proteins. Thus, this system can be efficiently used for studying protein-protein and possibly protein-biomolecule interactions for various biotechnological applications.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.12B
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• pp.1452-1458
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• 2009

In this paper, Our proposed Multipurpose Complex Card UHF band RFID small-size Tag antenna. Multi purpose Complex Card UHF band RFID small-size Tag antenna that is to minimize the low efficiency of RFID Tag Read Range that generates space limitation and a conductor surrounded by inducing fingerpring system with dual(HF, UHF) Card is presented. Our proposed UHF band RFID small-size Tag antenna is for the Multipurpose Complex Card that is mounted on the fingerpring system as well as the HF Tag. It also enables to minimize and facilitates Tag chip matching by adjusting Tapered, Meander line and Loop structure. Given the card substance properties and periphery circuit, the proposed small-size Tag antenna, in this report, is designed with PET film with size of $50{\times}15mm^2$. The RFID small-size Tag method for measurements is used by EPCglobal Static Test instrument in Anechoic Chamber, which is tested with dual Card, within the car and in wallet. It is found that Read Range is 3.8m from the EPCglobal Static Test, Maximum Read Range within the car from the field test results in 7.6m. Proposed Tag antenna is will be used in the parking control security system.