• 한국의류산업학회지
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• 제14권6호
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• pp.1024-1031
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• 2012

The thermal bonding PET fabrics were produced through high temperature steaming (HTS) of low melting PET yarn as warp and composite fancy yarn containing low melting PET yarn as weft. The low melting PET yarn of sheath-core structure consisted of a regular PET in core portion and low melting PET in sheath portion. The composite fancy yarn consisted of regular PET yarn as inner part and effect part and low melting PET yarn as binding part. This study was carried out to investigate the melting behavior of thermal bonded PET fabric, the effect of HTS on the thermal bonding, mechanical properties, and dyeing properties. The melting peak of low melting PET yarn showed two melting peaks caused by sheath-core structure. Almost the entire thermal bonding of the fancy PET fabrics containing low melting PET yarn has formed at $200^{\circ}C{\times}3min$ of HTS. The tensile strength in warp and weft direction of the fancy PET fabrics slightly decreased as temperature of HTS increased. The total K/S value of the fancy PET fabrics decreased slightly to $180^{\circ}C{\times}3min$ of HTS, while increased slightly above $200^{\circ}C{\times}3min$ of HTS. The changes in the hue angle ($H^{\circ}$) of the thermal bonded fancy PET fabrics dyed with disperse dyes hardly ever happened.

• 한국도로학회논문집
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• 제15권2호
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• pp.65-71
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• 2013

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 펄프종이기술
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• 제40권4호
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• pp.34-42
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• 2008

Generally, paper multilayering was performed before wet pressing process. However, sheets whose characteristics are different could be put together at the dry state by adhesives for the specialty paper products. In this paper, potential adhesives such as PVAc, oxidised starch, latex, and PVA were chosen and multilayering of several sheets was performed in laboratory scale. The effects of base paper properties and the composition of adhesives on the physical properties of multilayering paper were investigated. Physical properties such as bonding strength and stiffness were measured. For the practical reasons, mill trial was also executed. According to the result of laboratory tests and mill trial test, the physical properties of multilayered paper were greatly affected by the composition of adhesives and it was found that PVAc showed the best performance in all its aspects among four adhesives. Oxidised starch had an advantage of high stiffness and PVA gave high bonding strength to the multilayered paper. And it was also found that the properties of base paper showed the great influences not only on multilayering process, but also on the physical properties of the multilayered paper.

• 대한기계학회논문집A
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• 제32권4호
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• pp.354-361
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• 2008

Cold rolled steel sheet for automotive was treated by Ar/$O_2$ atmospheric pressure plasma to improve the adhesive bonding strength. Through the contact angle test and calculation of surface free energy for cold rolled steel sheet, the changes of surface properties were investigated before and after plasma treatment. The contact angle was decreased and surface free energy was increased after plasma treatment. And the change of surface roughness and morphology were observed by AFM(Atomic Force Microscope). The surface roughness of steel sheet was slightly changed. Based on Taguchi method, single lap shear test was performed to investigate the effect of experimental parameter such as plasma power, treatment time and flow rate of $O_2$ gas. Results shows that the bonding strength of steel sheet treated in Ar/$O_2$ atmospheric pressure plasma was improved about 20% compared with untreated sheet.

• 한국재료학회지
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• 제15권4호
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• pp.240-245
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• 2005

An oxygen free copper was severely deformed by accumulative roll-bonding (ARB) process for improvement of its mechanical properties. Two copper sheets 1 m thick, 30 mm wide and 300 m long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about $50\%$ reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles $(\varepsilon-6.4)$. TEM observation revealed that ultrafine grains were developed after the third cycle, and their size was slightly increased at higher cycles. Tensile strength of the copper increased with the strain at low strain levels, but it hardly increased from 3 cycles $(\varepsilon>2.4)$ due to occurrence of dynamic recovery, even if the imposed strain increased.

• 한국세라믹학회지
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• 제33권5호
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• pp.536-546
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• 1996

The TiC-Ni/Al reaction-bonding composites were prepared by the infiltration of Ni/Al melt into the TiC preforms. The microstructure the reaction composition crystalline phase and the mechanical properties of the composites were investigated. During the reaction-bonding Ni/Al mixture had a good wettability and per-meability with TiC preform and pore-free and fully dense sintered bodies were produced. In the case of the Ni/Al atomic ratio of 0.3 and 0.5 TiC raw particle shape was changed to irregular particles because of the decomposition in the liquid matrix and its phenomena was more distinguished in the Al-rich liquid matrix. With increasing more than 1 of the Ni/Al atomic ratio the sample of TiC grain shape was changed from spherical to palatelet particles. Also with increasing the atomic ratio of Ni/Al bending strength and fracture spherical to palatelet particles. Also with increasing the atomic ratio of Ni/Al bending strength and fracture toughness were increased and its maximum value was 1073 MPa and 11 MPa.m1/2 respectively.

• 한국염색가공학회지
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• 제11권1호
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• pp.34-41
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• 1999

To examine the increase of paper strength by solvent-bonding using N-methylmorpholine N-oxide (NMMO), a paper was treated with aqueous solutions of NMMO, concentrated at $90^\circ{C}$ for selected periods of time, and pressed for 5 seconds followed by washing and drying. The effect of the increasing NMMO concentration on bonding state and some important properties of samples were mainly investigated. With increasing concentration of NMMO, the degree of bonding between fibers was increased, the fiber cross-sectional shape was changed from 'thin ribbonlike' to 'round rodlike' by swelling with solvent, and the longitudinal waves (crimp) were introduced to fibers, hence the shrinkage, weight per unit area, and thickness of paper were increased. Consequently, the tensile strength and elongation, under standard and wet conditions, and the stiffness were increased, and the water absorption was decreased generally with increasing concentration of NMMO. The moisture regain of treated samples was lower than that of the untreated sample, because of the reduction of space between fibers. But the moisture regain was increased a little with increasing concentration of NMMO due to the fiber swelling with NMMO followed by structural relaxation.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 한국자기공명학회논문지
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• 제22권4호
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• pp.139-143
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• 2018

Short antimicrobial peptide, A4W, have been studied by molecular dynamics (MD) simulation in an explicit dodecylphosphocholine (DPC) micelle. Peptide was aligned with DPC micelle and transferred new peptide-micelle coordinates within the same solvent box using specific micelle topology parameters. After initial energy minimization and equilibration, the conformation and orientation of the peptide were analyzed from trajectories obtained from the RMD (restrained molecular dynamics) or the subsequent free MD. Also, the information of solvation in the backbone and the side chain of the peptide, hydrogen bonding, and the properties of the dynamics were obtained. The results showed that the backbone residues of peptide are either solvated using water or in other case, they relate to hydrogen bonding. These properties could be a critical factor against the insertion mode of interaction. Most of the peptide-micelle interactions come from the hydrophobic interaction between the side chains of peptide and the structural interior of micelle system. The interaction of peptide-micelle, electrostatic potential and hydrogen bonding, between the terminal residues of peptide and the headgroups in micelle were observed. These interactions could be effect on the structure and flexibility of the peptide terminus.