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http://dx.doi.org/10.3740/MRSK.2005.15.4.240

Microstructure and Mechanical Properties of Oxygen Free Copper Severely Deformed by Accumulative Roll-Bonding Process  

Lee Seong-Hee (Department of Advanced Materials Science and Engineering, Mokpo National University)
Cho Jun (Department of Advanced Materials Science and Engineering, Mokpo National University)
Han Seung-Zun (Department of Materials Technology Korea Institute of Machinery and Materials)
Lim Cha-Yong (Department of Materials Technology Korea Institute of Machinery and Materials)
Publication Information
Korean Journal of Materials Research / v.15, no.4, 2005 , pp. 240-245 More about this Journal
Abstract
An oxygen free copper was severely deformed by accumulative roll-bonding (ARB) process for improvement of its mechanical properties. Two copper sheets 1 m thick, 30 mm wide and 300 m long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about $50\%$ reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles $(\varepsilon-6.4)$. TEM observation revealed that ultrafine grains were developed after the third cycle, and their size was slightly increased at higher cycles. Tensile strength of the copper increased with the strain at low strain levels, but it hardly increased from 3 cycles $(\varepsilon>2.4)$ due to occurrence of dynamic recovery, even if the imposed strain increased.
Keywords
accumulative roll-bonding; oxygen free copper; microstructure; mechanical property;
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