• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.421-424
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• 2007

Thermal behavior of $Li_{1-x}CoO_2$ has been investigated employing DSC (Differential Scanning calorimetry) and TGA (Thermogravimetry Analyzer), and the crystal parameters were calculated from XRD (X-ray diffraction).for the commercial rectangular pouch cell(1000 mAh).The cathode materials coated over aluminium foil current collector is made up of a blend consisting of active material $LiCoO_2$(size $20\;{\mu}m$, 94 wt%), conducting material super p black (SPB, 3 wt%) and binder polyvinylidene fluoride (PVDF, 3 wt%). The anode is a mix consisting of carbon (92 wt%) and PVDF(8 wt%) coated over copper foil. The cells for the experiments were first preconditioned by cycling three times and stabilized at OCV=3.0, 3.5, 4.2, 4.35 and 4.5 V. The stabilized cathode material was used for thermal and crystal parameter investigations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.53-57
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• 2009

Recovery of heavy-metallic component from a waste solution of factory was undertaken by the solar cell electricity. The solution was obtained from an electrolytic etching process of 316L stainless steel. The electrolysis of the solution for recovery of heavy metallic components was made with platinum plated titanium mesh anode and copper plate cathode. Analysis for the solution and electro-winned materials were made by EDS, XRD and SEM. Iron, chromium, and sulfur components were recovered on the cathode from the solution. Result of EDS analysis for the electro-winned materials revealed that some metal oxide were contained in the recovered material. The recovered materials were expected to have metallic form only by the electrolysis, but metal compounds were contained because of weak solar cell power. Nickel and manganese component in the solution doesn't recovered by this electrolysis process, but they made a sludge with phosphoric acid in the solution.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.9
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• pp.816-825
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• 2003

Current-voltage-luminance characteristics of organic light-emitting diodes (OLEDs) were measured in the temperature range of 10 K～300 K. Indium-tin-oxide (ITO) was used as an anode and aluminum as a cathode in the device. Organic of N,N'-diphenyl-N,N'-di(m-tolyl)-benzidine (TPD) was used for a hole transporting material, and tris (8-hydroxyquinolinato) aluminum (Alq$_3$) for an electron transporting material and emissive material. And copper phthalocyanine (CuPc), poly(3,4-ethylenedi oxythiophene);poly(styrenesulfonate) (PEDOT:PSS), and poly(N-vinylcarbazole) (PVK) were used for hole-injection buffer layers. From tile analysis of electroluminescence (EL) and photoluminesccnce (PL) spectra of the Alq$_3$, the EL spectrum is more greenish then that of PL. And the temperature-dependent current-voltage characteristics were analyzed in the double and multilayer structure of OLEDS. Electrical conduction mechanism was explained in the region of high-electric and low-electric field. Temperature-dependent luminous efficiency and operating voltage were analyzed from the current-voltage- luminance characteristics of the OLEDS.

• Carbon letters
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• v.27
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• pp.98-107
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• 2018

Free-standing electrodes of CuO nanorods in carbon nanotubes (CNTs) are developed by synthesizing porous CuO nanorods throughout CNT webs. The electrochemical performance of the free-standing electrodes is evaluated for their use in flexible lithium ion batteries (LIBs). The electrodes comprising CuO@CNT nanocomposites (NCs) were characterized by charge-discharge testing, cyclic voltammetry, and impedance measurement. These structures are capable of accommodating a high number of lithium ions as well as increasing stability; thus, an increase of capacity in long-term cycling and a good rate capability is achieved. We demonstrate a simple process of fabricating free-standing electrodes of CuO@CNT NCs that can be utilized in flexible LIBs with high performance in terms of capacity and cycling stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3307-3309
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• 1999

Electrochemical discharge machining (ECDM) is a very recent technique in the fabrication of the micro-electro-mechanical system ( MEMS ) devices. This paper presents the experimental results of the machining of micro-holes on pyrex glass substrates by use of ECDM. Electrolyte is used with a KOH aqueous solution, cathode with copper, anode with platinum, and tool feed system is applied with gravity feed system. Already established experimental results were taken under the condition of constant voltage frequency. However in this paper, the effect of variation of the voltage frequency and duty ratio is considered. In this experiment, it is measured the ECDM performances with variation of the voltage frequency and duty ratio under the conditions of constant other machining variables. ECDM performances are described by the hole depth, and the top hole diameter.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• Journal of Hydrogen and New Energy
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• v.9 no.4
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• pp.161-167
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• 1998

It has been investigated the effects of alloying elements and binders on the corrosion behavior of metal hydride electrodes for anode of Ni/MH secondary battery. The $AB_5$-type alloys, $(LM)Ni_{4.49}Co_{0.1}Mn_{0.205}Al_{0.205}$ and $(LM)Ni_{3.6}Co_{0.7}Mn_{0.3}Al_{0.4}$, were used for the experiments. The electrodes were prepared by mixing and cold-pressing of alloy powders with Si sealent or PTFE powders, or cold-pressing the electroless copper coated alloy powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.