• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.263-272
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• 2013

Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.05a
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• pp.757-759
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• 2013

Until just a few years ago, digital circuit design techniques in register transfer level using Verilog or VHDL have been recognized as the up-to-date way compared with the traditional schematic design, and truly they have been used as the most popular skill for most chip designs. However, with the advent of era in which the complexity of semiconductor chip counts over billion transistors with advanced manufacturing technology, designing in register transfer level became too complex to meet the requirements of the needs, so the design paradigm has to change so that both design and synthesis can be done in higher level of abstraction. Bluespec SystemVerilog (BSV) is the only HDL which enables both circuit design and generating synthesizable code in the system level developed so far. In this contribution, I survey and analyze the features which supports the new paradigm in the BSV HDL, not very familiar to industry yet.

• Journal of Practical Engineering Education
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• v.6 no.1
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• pp.37-42
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• 2014

The automated visual inspection system (machine vision system) for quality assurance is important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. There is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we present the implementation of line scan camera based equipment for technical training of the automated visual inspection system. The training system consists of the X-Y stage which is widely used in machine vision industries and its variable image resolution are set to $10-30{\mu}m$. Additionally, this training system can attach the industrial illumination, either the direct illuminator or coaxial illuminator, for verifying the effect of illuminations. This means that the trainee can have a practical training in various equipment conditions and the training system is similar to the automated visual inspection system in industries.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.8
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• pp.38-45
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• 2016

The objective of this research is to develop a method of improving MEP facility management based on 3D reverse engineering. Recently, 3D image scanning-based reverse engineering has been implemented in the fields of architecture, construction and (manufacturing). In the case where there are many objects and the MEP system is complicated, 3D reverse engineering is applied in semiconductor factories, because facility maintenance works cause the 2D drawing to be different from the original one. The 3D point cloud data obtained from 3D image scanning contains accurate data and can increase the efficiency of complicated MEP facility maintenance works. For this purpose, the present research studied the technology trends and analyzed the process of 3D reverse engineering. Based on the results, a method of improving MEP facility management is established and its effects described.

• Resources Recycling
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• v.26 no.6
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• pp.45-49
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• 2017

Most Waste slurry is produced in the process of silicon manufacturing for semiconductor industry, containing silicon (Si) and silicon carbide (SiC). Waste slurry is simply stored with solidifying by cement or buried. On the other hand, it was suggested in this study that the waste slurry should be used for heating source as supplementary material in steel making process. The waste slurry was refined and pulverized, which was recycled into SiC-based sludge briquette. Chemical composition for SiC-based sludge briquette was analyzed and the feature of heating source was observed in accordance with the injection time and input amount. As a result, SiC-based sludge briquette in terms of low cost and high efficiency had an effect on increasing liquid steel temperature in steel making plants.

• The Transactions of the Korean Institute of Power Electronics
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• v.14 no.1
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• pp.8-14
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• 2009

A lamp which is currently employed to LCD(Liquid Crystal Display) Backlight is almost CCFL(Cold Cathod Fluorescent Lamp) and EEFL(External Electrode Fluorescent Lamp). However, the use of these lamps is being restricted as RoHS(the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) regulation is gradually reinforced. According to this situation, the manufacturing of a lamp which doesn't use mercury is unescapable. Moreover, LCD TV has a defect which take place Motion Blur phenomenon due to response time of LC(Liquid Crystal), and Hold-type characteristic which only exists in LCD differently to CRT, PDP. In this paper, an inverter is proposed to drive a plane light source lamp which is not containing mercury. Driving circuit of proposed inverter is simple because the number of semiconductor device and magnetic device is reduced by using forward topology. Also, Motion Blur phenomenon is decreased by dividing the plane light source lamp to six block along vertical direction, and scanning. Finally, we proved usefulness of proposed inverter through experiment.

• Journal of IKEEE
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• v.25 no.3
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• pp.473-478
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• 2021

Although CNTFETs have attracted great attention due to their ability to increase semiconductor device performance by about 13 times, the commercialization of CNTFETs has been challenging because of the immature deposition process of CNTs. To overcome these difficulties, circuit design method considering the known limitations of the CNTFET manufacturing process is receiving increasing attention. SRAM is a major element constituting microprocessor and is regularly and repeatedly positioned in the cache memory; so, it has the advantage that CNTs can be more easily and densely deposited in SRAM than other circuit blocks. In order to take these advantages, this paper presents a circuit design method for SRAM cells considering CNT density and then evaluates its performance improvement using HSPICE simulation. As a result of simulation, it is found that when CNTFET is applied to SRAM, the gate width can be reduced by about 1.7 times and the read speed also can be improved by about 2 times when the CNT density was increased in the same gate width.

• Korean Journal of Materials Research
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• v.34 no.1
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• pp.27-33
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• 2024

Al₂O₃ has excellent sintering properties and is important in semiconductor manufacturing processes that require high-temperature resistance and chemical inertness in a plasma environment. In this study, a comprehensive analysis of the chemical characteristics, physical properties, crystal structure, and dispersion stability of three commercially available Al₂O₃ powders was conducted. The aim was to provide a technological foundation for selecting and utilizing appropriate Al₂O₃ powders in practical applications. All powders exhibited α-Al₂O₃ as the main phase, with the presence of beta-phase Na₂O-11Al₂O₃ as the secondary phase. The highest Na⁺ ion leaching was observed in the aqueous slurry state due to the presence of the secondary phase. Although the average particle size difference among the three powders was not significant, distinct differences in particle size distribution were observed. ALG-1SH showed a broad particle size distribution, P162 exhibited a bimodal distribution, and AES-11 displayed a uniform unimodal distribution. High-concentration Al₂O₃ slurries showed differences in viscosity due to ion release when no dispersant was added, affecting the electrical double-layer thickness. Polycarboxylate was found to effectively enhance the dispersion stability of all three powders. In the dispersion stability analysis, ALG-1SH exhibited the slowest sedimentation tendency, as evidenced by the low TSI value, while P162 showed faster precipitation, influenced by the particle size distribution.

• Korean Journal of Optics and Photonics
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• v.28 no.2
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• pp.75-82
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• 2017

We present a new type of receiver-transmitter optical system that can be adapted to the sensor head of a displacement-measuring interferometer. The interferometer is utilized to control positioning error and repetition accuracy of a wafer, down to the order of 1 nm, in a semiconductor manufacturing process. Currently, according to the tendency of scale-up of wafers, an interferometer is demanded to measure a wider range of displacement. To solve this technical problem, we suggest a new type of receiver-transmitter optical system consisting of a GRIN lens-Collimating lens-Afocal lens system, compared to conventional receiver-transmitter using a single collimating lens. By adapting this new technological optical structure, we can improve coupling efficiency up to about 100 times that of a single conventional collimating lens.

• The KSFM Journal of Fluid Machinery
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• v.19 no.4
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• pp.35-38
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• 2016

A PFA lined ball valve, which is machined with fluorinated resin PFA to its inner part for improving corrosion resistance, non-stickness, heat-resistance, has been widely used in semiconductor/LCD manufacturing processes with the high purity chemicals as working fluid. Due to the safety concerns, the experiments for measuring the flow coefficient of a PFA lined ball valve should be conducted with water at room temperature according to IEC standards. However, it is required to know the real flow coefficient with the real working fluid, because the flow coefficient is critical to correctly design valves in piping system. In this study, we calculated the flow coefficient of a PFA lined ball valve 40A with hydrochloric acid ($40^{\circ}C$ 36% HCl) as the working fluid using a commercial CFD package, ANSYS CFX v15. The computational results had a good agreement with the measured data and showed a little difference between water and hydrochloric acid as the working fluid of a PFA lined ball valve.