• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.331-334
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• 1997

The electrical and physical charateristics of aluminum oxide and Pt thin films on it, deposited by reactive sputtering and DC magnetron sputtering, respectively, were analysed with increasing annealing temperature(400~80$0^{\circ}C$) by four point probe, SEM and XRD. Under $600^{\circ}C$ of annealing temperature, aluminum oxide had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin films and the resistivity of Pt thin finns was improved. But these properties of aluminum oxide and Pt thin finns on it were degraded over $700^{\circ}C$ of annealing temperature because aluminum oxide was changed into metal aluminum and then reacted to Pt thin films deposited on it. The thermal characteristics of Pt micro heater were analysed with Pt-RTD integrated on the same substrate. In the analysis of properties of Pt micro heater. active area was smaller size, Pt micro heater had better thermal characteristics. Temperature of Pt micro heater fabricated on membrane was up to 34$0^{\circ}C$ with 1.2watts of the heating power due to reduction of the external thermal loss.

• 한국표면공학회지
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• 제54권2호
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• pp.90-95
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• 2021

Surface modification technique enabling the control of condensation provides various benefit in various engineering systems, such as heat transfer, desalination, power plants, and so on. In this study, lubricant oil-impregnation into Teflon-coated nanoporous anodic oxide layer of aluminum to enhance a de-wetting and mobility of water droplet on surface. Due to the surface treatment improving water-repellency, the condensation mode is changed to dropwise, thus the frequency of sliding condensed water droplet on surface is increased. For these reasons, the surface of oil-impregnated Teflon-coated nanoporous anodic aluminum oxide shows significantly enhanced condensation heat transfer compared to bare aluminum surface. In addition, the porosity of anodic aluminum oxide affected the mobility of water droplet even with oil-impregnation and Teflon-coating, indicating that the optimization of porous structure of anodic oxide is required for maximizing the condensation heat transfer.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.746-749
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• 2002

Aluminum oxide thin films were grown on a poly ethylene naphthalate (PEN) substrate at the temperature of 100$^{\circ}C$ using atomic layer deposition method. The film showed very flat morphology and good adhesion to the substrate. The visible spectrum showed higher transmittance in the range from 400 nm to 800 nm than that of PEN. The water vapor transmission value measured with MOCON for 230nm oxide-deposited PEN was 0.62g/$m^2$/day @ 38$^{\circ}C$, while that of PEN substrate was 1.4g/$m^2$/day @ 38$^{\circ}C$.

• 공업화학
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• 제17권4호
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• pp.335-342
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• 2006

금속 알루미늄의 낮은 환원전위는 전기화학적 산화반응을 통하여 알루미늄과 그 표면에 존재하는 산화막의 구조 및 성질의 변화를 일으킨다. 산성용액에서 알루미늄을 전기화학적으로 에칭하여 표면적을 확대시키고 중성의 용액에서 알루미늄 표면에 치밀한 유전체 산화막을 형성시켜 커패시터의 전극으로 이용하고 있다. 저온의 산성용액에서는 양극산화시 나노크기의 다공층 산화막이 형성되며, 나노구조체의 템플레이트로 사용되고 있다. 이와같은 알루미늄의 전기화학적 특성은 알루미늄을 새로운 기능성을 가진 재료로 변화시킴으로서 다양한 분야에서 응용될 것으로 기대된다.

• 한국표면공학회지
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• 제54권2호
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• pp.62-70
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• 2021

Al2024 aluminum alloy specimens were exposed to atmospheric conditions for maximum 24 months and analyzed by electron microscopes to characterize their corrosion behavior and oxide film characteristics. As the exposure time increased from 12 months to 24 months, the number of pitting sites per 1 mm² increased from ~100 to ~200. The uniform oxidation (or non-pitting) region of the 12-month exposure specimen showed 30~120 nm thick oxide layer, whereas the 24-month exposure specimen showed 170~200 nm thick oxide with the local oxygen penetration region up to 1 ㎛ deep. There was no local corrosion area observed in the 12-month exposure specimen except pitting. However, in the 24-month exposure specimen, local oxygen penetration region was observed beneath the uniform oxide layer and near the pitting cavity. Al2024 showed two times thicker uniform oxide layer but much shallower local oxygen penetration region than Al1050, which appears to be related to low Si concentration. Further research is needed on the effects of Mg segregation near the tip of the oxygen penetration region.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.65-69
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• 2002

An Al film deposited on the Kovar alloy substrate was anodically-bonded to the borosilicate glass, and the bond interfaces was closely investigated by transmission electron microscopy. Al oxide was found to form a layer ~l0 nm thick at the bond interface, and fibrous structure of the same oxide was found to grow epitaxially in the glass from the oxide layer. The fibrous structure grew with the bonding time. The mechanism of the formation of this fibrous structure is proposed on the basis of the migration of Al ions under the electric field. Penetration of Al into glass beyond the interfacial Al oxide was not detected. The comparison of the amount of excess oxygen ions generated in the alkali depletion layer with that incorporated in the Al oxide suggests that the growth of the alkali-ion depletion layer is controlled by the consumption of excess oxygen to form the interfacial Al oxide.

• 대한전자공학회논문지SD
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• 제47권4호
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• pp.69-74
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• 2010

알루미늄 양극산화(aluminum anodization)의 선택적인 적용을 통하여 DRAM 소자를 위한 새로운 패키지 기판을 제작하였다. 에폭시 계열의 코어(core)와 구리의 적층 형태로 제작되는 일반적인 패키지 기판과는 달리 제안된 패키지 기판은 아래층 알루미늄(aluminum), 중간층 알루미나(alumina, $Al_2O_3$) 그리고 위층 구리(copper)로 구성된다. 알루미늄 기판에 양극산화 공정을 수행함으로써 두꺼운 알루미나를 얻을 수 있으며 이를 패키지 기판의 유전체로 사용할 수 있다. 알루미나층 위에 구리 패턴을 배치함으로써 새로운 2층 금속 구조의 패키지 기판을 완성하게 된다. 또한 알루미늄 양극산화를 선택적인 영역에만 적용하여 내부가 완전히 채워져 있는 비아(via) 구조를 구현할 수 있다. 패키지 설계 시에 비아 인 패드(via in pad) 구조를 적용하여 본딩 패드(bonding pad) 및 볼 패드(ball pad) 상에 비아를 배치하였다. 상기 비아 인 패드 배치 및 2층 금속 구조로 인해 패키지 기판의 배선 설계가 보다 수월해지고 설계 자유도가 향상된다. 새로운 패키지 기판의 주요 설계인자를 분석하고 최적화하기 위하여 테스트 패턴의 2차원 전자기장 시뮬레이션 및 S-파라미터 측정을 진행하였다. 이러한 설계인자를 바탕으로 모든 신호 배선은 우수한 신호 전송을 얻기 위해서 $50{\Omega}$의 특성 임피던스를 가지는 coplanar waveguide(CPW) 및 microstrip 기반의 전송선 구조로 설계되었다. 본 논문에서는 패키지 기판 구조, 설계 방식, 제작 공정 및 측정 등을 포함하여 양극산화 알루미늄 패키지 기판의 특성과 성능을 분석하였다.

• 한국전기전자재료학회논문지
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• 제31권5호
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• pp.273-277
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• 2018

This research introduces the sputtered IZO thin film transistor (TFT) with solution-processed $Al_2O_3$ diffusion layer. IZO is one of the most commonly used amorphous oxide semiconductor (AOS) TFT. However, most AOS TFTs have many defects that degrade performance. Especially oxygen vacancy in the active layer. In previous research, aluminum was used as a carrier suppressor by binding the oxygen vacancy and making a strong bond with oxygen atoms. In this paper, we use a solution-processed $Al_2O_3$ diffusion layer to fabricate stable IZO TFTs. A double-layer solution-processed $Al_2O_3$-sputtered IZO TFT showed better performance and stability, compared to normal sputtered IZO TFT.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.121.2-121.2
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• 2011

Aluminum-doped Zinc Oxide (AZO) is considered as an excellent candidate to replace Indium Tin Oxide (ITO), which is widely used as transparent conductive oxide (TCO) for electronic devices such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs) and organic solar cells (OSCs). In the present study, AZO thin film was applied to the transparent electrode of a channel-shaped flexible organic solar cell using a low-temperature selective-area atomic layer deposition (ALD) process. AZO thin films were deposited on Poly-Ethylene-Naphthalate (PEN) substrates with Di-Ethyl-Zinc (DEZ) and Tri-Methyl-Aluminum (TMA) as precursors and $H_2O$ as an oxidant for the atomic layer deposition at the deposition temperature of $130^{\circ}C$. The pulse time of TMA, DEZ and $H_2O$, and purge time were 0.1 second and 20 second, respectively. The electrical and optical properties of the AZO films were characterized as a function of film thickness. The 300 nm-thick AZO film grown on a PEN substrate exhibited sheet resistance of $87{\Omega}$/square and optical transmittance of 84.3% at a wavelength between 400 and 800 nm.

• 한국표면공학회지
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• 제51권1호
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• pp.11-20
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• 2018

Hydrophobic and Superhydrophobic surfaces are promising technology for the surface finishing of metallic materials due to its water-repellency. Realization of highly water-repellent surface on aluminum and its alloys provides various functionalities for real application fields. In order to realize the hydrophobic/superhydrophobic surfaces on aluminum and its alloys, various technologies have been demonstrated. Especially, traditional anodic oxidation for aluminum has been widely employed for the morphological texturing of surfaces, which is essential to enhance the hydrophobic efficiency. De-wetting superhydrophobic surface on aluminum provides various exceptional properties, such as anti-corrosion, anti-/de-icing, anti-biofouling, drag reduction, self-cleaning and liquid separation. Nevertheless, the durability and stability of superhydrophobic surfaces still remain challenges for their actual applications in engineering systems and industry. In this review, the theoretical/experimental studies and current technical limitations on the hydrophobic and superhydrophobic surface using anodic oxidation of aluminum have been summarized.