• Proceedings of the KWS Conference
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• 2002.10a
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• pp.475-480
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• 2002

The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.23-36
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• 2019

Stretchable electronic systems have recently been gaining more and more attention because of their potential applications in various implements such as electronic skins and wearable/shape-deformable electronics. An essential factor of the stable stretchable device implementation is that all the elements constituting the system must have sufficient elasticity and exhibit stable performances even under repetitive stretching conditions. In this paper, we review the latest research results to secure the stable stretchability of electrodes among the various components of the system.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.39-45
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• 2020

The Cu/Cu2O/CuO photoelectrode has been successfully fabricated by Rapid Thermal Annealing technique. The structural characterization of fabricated photoelectrode was performed using X-Ray diffraction, while elemental composition of the prepared material has been checked with X-Ray Photoelectron Spectroscopy. The synthesis parameters are optimized on the basis of photoelectrochemical performance. The best photoelectrochemical performance has been observed for the Cu/Cu2O/CuO photoelectrode fabricated at 550 ℃ oxidation temperature and oxidation time of 50 seconds with highest photocurrent density of -3 mA/㎠ at -0.13 V vs. RHE.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.250-253
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• 2001

Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.29 no.3
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• pp.69-81
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• 1997

Up to now 5 Voith Sulzer paper machines with multi-layer headbox and Gapfor-mer are sucessfully running on papckaging papers. Linerboard, testliner and corugating medium is produced in the basis weight range from 105 to 275 $g/m^2$ at machine speeds up to 900 m/min. The nest one, starting up in Oct. ｀96 in Germany, will be the world＇s fastest paper machine for packaging papers. The 5.6 m wide machine is designed for a maximum operating speed of 1200 m/min. Approx. 220.000 tons of corrugating medium and testliner based on 100% waste paper in the basis weight range from 90 to 160 $g/m^2$ will be produced each year. An expansion stage planned for the future is intended to increase annual output to 280.000 tons. This machine will not only be the fastest one for packaging papers, it also comprises all described innovative key components which are available today in order to fulfill growing demands of the future with regard to quality and productivity. The concept of this advanced machine is shown in Fig. 9.

• Journal of the Korea Convergence Society
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• v.10 no.7
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• pp.115-120
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• 2019

This study is aimed at giving directions for the development of fresh food delivery packaging design in the domestic e-commerce market. First literature study of food consumption trend, cold chain system and zero waste campaign related to e-commerce food market. Second, packaging designs of e-commerce fresh food in domestic and foreign were analyzed and also the prospective studies were checked to find out the future direction of packaging designs. Studies show that the packaging design of delivery for fresh food should not only be kept freshness, also consider the usefulness, convenience and environmental protection from various angles.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.73-73
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.30-41
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• 2023

With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.