Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2002.10a
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- Pages.475-480
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- 2002
WETTING PROPERTIES AND INTERFACIAL REACTIONS OF INDIUM SOLDER
- Kim, Dae-Gon (Advanced Materials and Process Research Center for IT, Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
- Lee, Chang-Youl (Advanced Materials and Process Research Center for IT, Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
- Hong, Tae-Whan (Advanced Materials and Process Research Center for IT, Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
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Jung, Seung-Boo
(Advanced Materials and Process Research Center for IT, Dept. of Advanced Materials Engineering, Sungkyunkwan University)
- Published : 2002.10.01
Abstract
The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu