• Title/Summary/Keyword: adhesion energy

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Surface Preparation and Activation Only by Abrasion and Its Effect on Adhesion Strength

  • Ali Gursel;Salih Yildiz
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.101-107
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    • 2022
  • Adhesive joints have many advantages such as weight savings, corrosion and fatigue resistance and now developed even withstand of high impact and dynamic loads. However, an adhesion has cumbersome and complicated surface preparation processes. The surface preparation step is critical in adhesive joint manufacturing in order to obtain the prescribed strength for adhesive joints. In this study, it was attempted to simplify and reduce the number of surface preparation steps, and abrasion and rapid adhesive application (ARAA) process is developed for an alternative solution. The abrasion processes are performed only for creating surface roughness in standard procedures (SP), although the abrasion processes cause surface activation itself. The results showed that there is no need the long procedures in laboratory or chemical agents for adhesion. After the abrasion process, the attracted and highly reactive fresh surface layer obtained, and its effect on bonding success is observed and analyzed in this research, in light of the essential physic and adhesion theories. Al 6061 aluminum adherends and epoxy-based adhesives were chosen for bonding processes, which is mostly used in light vehicle parts. The adherends were cleaned, treated and activated only with abrasion, and after the adhesive application the specimens were tested under quasi-static loading. The satisfied ARAA results were compared with that of the specimens fabricated by the standard procedure (SP) of adhesion processes of high impact loads.

ADHESION PHENOMENON AND ITS APPLICATION TO MANIPULATION FOR MICRO-ASSEBMLY

  • Takahashi, Kunio;Himeno, Hideo;Saito, Shigeki;Onzawa, Tadao
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.781-784
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    • 2002
  • Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. For the purpose of microassembly, theoretical understanding is required for the Adhesion phenomenon. Authors have developed a force measurement system in an ultra-high vacuum chamber of Auger electron spectroscopy. The force between arbitrary combination of materials can be measured at a pressure less than 100 nPa after and before Ar ion sputtering and chemical analysis for several atomic layers of the surface. The results are successfully interpreted with a theory of contact mechanics. Since surface energy is quite important in the interpretation, electronic theory is used to evaluate the surface energy. In the manipulation of small objects, the adhesional force is always attractive. Repulsive force is essential for the manipulation. It can be generated by Coulomb interaction. The voltage required for detachment is theoretically analyzed and the effect of boundary conditions on the detachment is obtained. The possibility and limitations of micro-manipulation using both the adhesion phenomenon and Coulomb interaction are theoretically clarified. Its applicability to nano-technology is found to be expected.

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The Effects of Functional Monomers on the Synthesis andPhysical Properties of Solution Type Quaternary Polymer Acrylic Pressure-Sensitive Adhesives (관능성 단량체 종류에 따른 4원 용액형 아크릴계 점착제의 합성과 물성에 관한 연구)

  • Kim, Nam-Seok;Kim, Sung-Hoon
    • Journal of the Korean Applied Science and Technology
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    • v.25 no.4
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    • pp.525-532
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    • 2008
  • To prepare a solution type acrylic pressure-sensitive adhesive, quarter polymers were synthesized from butyl acrylate(BA), 2-ethylhexylacrylate(2-EHA) as a base monomer, methyl methacrylate(MMA) as a comonomer, each of methacrylic acid(MAA), acrylic acid(AA) as a functional monomer. Acrylic solution type pressure-sensitive adhesives(PSA's) of isocyanate derivative crosslinking PSA's were prepared by crosslinking of BEMM, BEMA with toluene-2,4-diisocyanate. The structure of adhesive was identified by FT-IR. The viscosity was measured by using Brookfield DV-III and molecular weight was measured by using gel permeation chromatography. The physical properties of polyethylene film coated with BEMMT, BEMAT were measured as a function of the concentration. As the result, BEMMT(0.6, 0.8), BEMAT(0.6) showed peel adhesion of $160{\sim}180\;g_f$/25 mm width and shear adhesion of more than 24 hours, and tackiness of $4/32{\sim}6/32$ which was relevant to commercial usage.

Emulsification of Asphalt Modified with Styrene Butadiene Rubber (SBR) and Styrene Butadiene Styrene (SBS); 1) Phase Stability Behavior and 2) Physical Properties

  • Lee, Eun-Kyoung
    • Elastomers and Composites
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    • v.54 no.4
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    • pp.335-344
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    • 2019
  • In this work, styrene butadiene rubber (SBR) and styrene butadiene styrene (SBS) were used to modify asphalt, resulting in SBR- and SBS-modified asphalt, respectively. The two modified asphalts were emulsified with a nonionic emulsifier (Span 60) and cationic emulsifiers (ID, DDA) and their phase stabilization was investigated via particle size, Zeta potential, and flow behavior analysis. With increasing amount of the mixed emulsifier, the particle size decreased, leading to an increase in viscosity. The shear thinning behaviors and Zeta potential values ranging from 35-65 mV were determined and remained considerably stable. In addition, the adhesion strength and compression strength of the SBR-and SBS-modified asphalt emulsion were evaluated via surface free energy examination. The remarkable adhesion and compression strengths were estimated when 5 phr ID and 6 phr DDA were added to the emulsified asphalt modified with SBR and SBS. Therefore ID and DDA, the two cationic surfactants, played significant roles in improving the dispersion and interfacial adhesion strength, resulting in the improved adhesion and compression strength of the emulsified asphalts modified with SBR and SBS.

Analysis on Adhesion Properties of Composite Electrodes for Lithium Secondary Batteries using SAICAS (SAICAS를 이용한 리튬이차전지용 복합전극 결착특성 분석)

  • Byun, Seoungwoo;Roh, Youngjoon;Jin, Dahee;Ryou, Myung-Hyun;Lee, Yong Min
    • Journal of the Korean Electrochemical Society
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    • v.21 no.2
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    • pp.28-38
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    • 2018
  • Although the adhesion properties of composite electrodes are important for securing long-term reliability and realizing high energy density of lithium secondary batteries, related research has not been carried out extensively due to the limitation of measurement technology. However, surface and interfacial cutting analysis system(SAICAS), which can measure the adhesion properties while cutting and peeling a coating layer of $1{\sim}1000{\mu}m$ thickness, has been developed and applied for analyzing the adhesion properties of composite electrodes for lithium secondary batteries. Thus, this review presents not only the principle and measurement method of SAICAS but also comparison results between SAICAS and conventional peel test. In addition, application examples of SAICAS are introduced in the study of electrode design optimization, new binder derivation study, and binder distribution in composite electrode. This suggests that SAICAS is an analytical method that can be easily applied to investigate the adhesion properties of composite electrodes for lithium secondary batteries.

Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process (전사공정을 위한 UV 경화성 범프형 스탬프의 점착특성 평가)

  • Jeong, Yeon-Woo;Kim, Kyung-Shik;Lee, Chung-Woo;Lee, Jae-Hak;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • v.32 no.3
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    • pp.75-81
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    • 2016
  • Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm2, the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm2, however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

Evaluation of Ice Adhesion Strength on the Oxidation of Transmission Line ACSR Cable (송전선로 ACSR 케이블의 산화에 따른 결빙 특성 평가)

  • Cho, Hui Jae;Kim, You Sub;Jung, Yong Chan;Lee, Soo Yeol
    • Korean Journal of Materials Research
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    • v.29 no.6
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    • pp.378-384
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    • 2019
  • Ice accumulation on Aluminum Conductor Steel Reinforced(ACSR) cable during winter is an important matter in terms of safety, economy, and efficient power supply. In this work, the ice adhesion strengths of ACSR cable oxidized during different periods(7 years oxidized and 15 years oxidized) are evaluated. At first, a plate type dry oxidation standard specimen, whose surface characteristics are similar to those of ACSR cable, is prepared. Dry oxidation standard specimens are heat-treated at $500^{\circ}C$ for 20, 60, and 120 minutes in order to obtain different degrees of oxidation. After the dry oxidation, surface properties are analyzed using contact angle analyzer, atomic force microscopy, spectrophotometer, and gloss meter. The ice adhesion strengths are measured using an ice pull-off tester. Correlations between the surface properties and the ice adhesion strength are obtained through a regression analysis indicating a Boltzmann equation. It is revealed that the ice adhesion strength of 15-year oxidized ACSR cable is approximately 8 times higher than that of ACSR-bare.

Effects of Wet Chemical Treatment and Thermal Cycle Conditions on the Interfacial Adhesion Energy of Cu/SiNx thin Film Interfaces (습식표면처리 및 열 사이클에 따른 Cu/SiNx 계면접착에너지 평가 및 분석)

  • Jeong, Minsu;Kim, Jeong-Kyu;Kang, Hee-Oh;Hwang, Wook-Jung;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.1
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    • pp.45-50
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    • 2014
  • Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

Molecular Dynamics Simulation of Adhesion Processes

  • Cho, Sung-San;Park, Seungho
    • Journal of Mechanical Science and Technology
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    • v.16 no.11
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    • pp.1440-1447
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    • 2002
  • Adhesion of a hemispherical tip to the flat surface in nano-structures is simulated using the molecular dynamics technique. The tip and plates are modeled with the Lennard-Jones molecules. The simulation focuses on the deformation of the tip. Detailed descriptions on the evolution of interaction force, the energy dissipation due to adhesion hysteresis, the forma- tion-growth-breakage of adhesive junction as well as the evolution of molecular distribution during the process are presented. The effects of the tip size, the maximum tip approach, the tip temperature, and the affinity between the tip and the mating plate are also discussed.

Vibro-Contact Analysis of AFM Tip on Polymer Surface (폴리머 표면측정을 위한 AFM 팁의 접촉-진동 해석)

  • Hong, Sang-Hyuk;Lee, Soo-Il
    • 한국신재생에너지학회:학술대회논문집
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    • 2005.06a
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    • pp.538-541
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    • 2005
  • In tapping mode atomic force microscopy(TM-AFM). the vibro-contact response of a resonating tip is used to measure the nanoscale topology and other properties of a sample surface. However, the nonlinear tip-surface interact ions can affect the tip response and destabilize the tapping mode control. Especially it is difficult to obtain a good scanned image of high adhesion surfaces such as polymers and biomoleculars using conventional tapping mode control. In this study, theoretical and experimental investigations are made on the nonlinear dynamics and control of TM-AFM. To analyze the complex dynamics and control of the tapping tip, the classical contact models are adopted due to the surface adhesion. Also we report the surface adhesion is an additional important parameter to determine the control stability of TM-AFM. In addition, we prove that it is more adequate to use Johnson-Kendall-Roberts (JKR) contact model to obtain a reasonable tapping response in AFM for the soft and high adhesion samples.

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