Effects of Wet Chemical Treatment and Thermal Cycle Conditions on the Interfacial Adhesion Energy of Cu/SiNx thin Film Interfaces |
Jeong, Minsu
(School of Materials Science and Engineering, Andong National University)
Kim, Jeong-Kyu (School of Materials Science and Engineering, Andong National University) Kang, Hee-Oh (National Nanofab Center) Hwang, Wook-Jung (National Nanofab Center) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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