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http://dx.doi.org/10.9725/kstle.2016.32.3.75

Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process  

Jeong, Yeon-Woo (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Kim, Kyung-Shik (Dept. of Nano Mechanics, Nano-convergence Mechanical Systems Research Division, Korea Institute of Machinery & Materials (KIMM))
Lee, Chung-Woo (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Lee, Jae-Hak (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Kim, Jae-Hyun (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Kim, Kwang-Seop (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Publication Information
Tribology and Lubricants / v.32, no.3, 2016 , pp. 75-81 More about this Journal
Abstract
Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm2, the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm2, however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.
Keywords
adhesion; bump shape stamp; transfer process; UV-curable polymer;
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1 Carlson, A., Bowen, A. M., Huang, Y., Nuzzo, R. G., Rogers, J. A., “Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication”, Advanced Materials, Vol. 24, No. 39, pp. 5284-5318, 2012.   DOI
2 Baca, A. J., Ahn, J. H., Sun, Y., Meitl, M. A., Menard, E., Kim, H. S., Choi, W. M., Kim, D. H., Huang, Y., Rogers, J. A., “Semiconductor Wires and Ribbons for High-Performance Flexible Electronics”, Angewandte Chemie International Edition, Vol. 47, No. 30, pp. 5524-5542, 2008.   DOI
3 Park, S. I., Xiong, Y., Kim, R. H., Elvikis, P., Meitl, M., Kim, D. H., Wu, J., Yoon, J., Yu, C. J., Liu, Z., Huang, Y., Hwang, K. C., Ferreira, P., Li, X., Choquette, K., Rogers, J. A., “Printed Assemblies of Inorganic Light-emitting Diodes for Deformable and Semitransparent Displays”, Science, Vol. 325, No. 5943, pp. 977-981, 2009.   DOI
4 Bae, S., Kim, H., Lee, Y., Xu, X., Park, J. S., Zheng, Y., Balakrishnan, J., Lei, T., Kim, H. R., Song, Y. I., Kim, Y. J., Kim, K. S., Özyilmaz, B., Ahn, J. H., Hong, B. H., Iijima, S., “Roll-to-roll Production of 30-inch Graphene Films for Transparent Electrodes”, Nature Nanotechnology, Vol. 5, No. 8, pp. 574-578, 2010.   DOI
5 Bartlett, M. D., Crosby, A. J., “Material Transfer Controlled by Elastomeric Layer Thickness”, Materials Horizons, Vol. 1, No. 5, pp. 507-512, 2014.   DOI
6 Jang, B., Kim, K. S., Kim, J. H., Choi, H. J., Park, H. S., Lee, H. J., “Rate-Dependent Adhesion Between a Spherical PDMS Stamp and Silicon Substrate for a Transfer-Assembly Process”, The Journal of Adhesion, Vol. 87, No. 7-8, pp. 744-754, 2011.   DOI
7 Meitl, M. A., Zhu, Z. T., Kumar, V., Lee, K. J., Feng, X., Huang, Y. Y., Adesida, I., Nuzzo, R. G., Rogers, J. A., “Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp”, Nature Materials, Vol. 5, No. 1, pp. 33-38, 2006.   DOI
8 Du, F., Duan, H. L., Xiong, C. Y., Wang, J. X., “Substrate Wettability Requirement for the Direct Transfer of Graphene”, Applied Physics Letter, Vol. 107, No. 14, pp. 143109, 2015.   DOI
9 Jeong, Y. W., Kim, K. S., Lee, Y. K., Lee, J. H., Kim, J. H., Lee, H. J., Kim, K. S., “Adhesion Characteristics of Polymer Bumps for Transfer Process”, Proc. Spring Conference of the Korean Society of Tribologists & Lubrication Engineers, pp. 157-158, 2015
10 Kim, S., Wu, J., Carlson, A., Jin, S. H., Kovalsky, A., Glass, P., Liu, Z., Ahmed, N., Elgan, S. L., Chen, W., Ferreira P. M., Sitti, M., Huang, Y., Rogers J. A., “Microstructured Elastomeric Surfaces with Reversible Adhesion and Examples of Their use in Deterministic Assembly by Transfer Printing”, Proceedings of the National Academy of Sciences, Vol. 107, No. 40, pp. 17095-17100, 2010.   DOI
11 Mathieson, I., Bradley, R. H., “Improved Adhesion to Polymers by UV/Ozone Surface Oxidation”, International Journal of Adhesion and Adhesives, Vol. 16, No. 1, pp. 29-31, 1996.   DOI
12 Jeong, Y. W., Kim, K. S., Lee, C. W., Lee, J. H., Kim, J. H., Kim, K. S., “Adhesion Characteristics of UV-curable Polymer Bump”, Proc. Autumn Conference of the Korean Society of Tribologists & Lubrication Engineers, pp. 127-128, 2015