Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process
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Jeong, Yeon-Woo
(Dept. of Nano-mechatronics, Korea University of Science and Technology (UST))
Kim, Kyung-Shik (Dept. of Nano Mechanics, Nano-convergence Mechanical Systems Research Division, Korea Institute of Machinery & Materials (KIMM)) Lee, Chung-Woo (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST)) Lee, Jae-Hak (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST)) Kim, Jae-Hyun (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST)) Kim, Kwang-Seop (Dept. of Nano-mechatronics, Korea University of Science and Technology (UST)) |
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