• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.439-442
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• 2004

Timing delays due to VLSI circuit interconnects strongly depend on neighbor line switching patterns as well as input transition time. Considering both the input transition and input switching pattern, a new analytical timing delay model is developed by using the decoupling technique of transfer multi-coupled lines into an effective single line. The analytical timing delay model can determine the timing delay of multi-coupled lines accurately as well as rapidly. It is verified by using DSM-Technology ($0.1{\mu}m$ /low-k copper-based process) that the model has excellent agreement with the results of SPICE simulation.

• The Transactions of the Korea Information Processing Society
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• v.4 no.1
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• pp.298-310
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• 1997

Most of the available delay fault simulators for scan environments rely on the use of enhanced scan flip-flops and exclusively consider circuits composed of only discrete gates. In this research, a new path delay fault simulation algorithm using new logic values is devised to enlarge the scope to the VLSI circuits which consist of CMOS elements. Based on the proposed algorithm, a high speed path delay fault simulator for standard scan environments is developed. The experimental results show the new simulator is efficient and accurate.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.329-333
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• 1998

본 논문에서는, LSI 적층 기술을 이용한 실시간 처리 마이크로 비젼의 개발을 소개하고 있다. 새롭게 개발된 LSI 적층기술을 이용하여, 영상신호의 증폭, 변환, 연산처리등의 기본기능을 가지는 다수의 LSI 웨이퍼를 적층한다. 각 층간의 고밀도 수직배선을 통하여 대량의 영상정보를 동시에 전달하므로써, 대규모 동시 병렬처리를 가능하게 하며, 다수의 층에 걸쳐 파이프 라인 처리가 이루어진다. VLSI 설계시스템을 이용하여, 윤곽 검출기능을 가지는 테스트 칩을 설계(2 .mu.m CMOS design rule)하고, 시뮬레이션을 통하여 양호한 동작(처리시간 10 .mu.s)을 확인하고 있다. 시험제작을 위해서는, 새롭게 개발된 LSI 적층기술이 이용된다. 영상처리의 기본회로가 실려있는 웨이퍼의 기반을 30 .mu.m 의 두께까지 연마하고, 개발된 웨이퍼 aligner를 이용하여 수직배선이 형성된 상하 두 개의 웨이퍼를 미세조정하면서 접착한다. 이상의 제작과정을 반복하여 두께 1mm이하의 인공망막과 같은 마이크로 비젼을 제작한다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.12
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• pp.1970-1982
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• 1993

This paper describes an efficient array algorithm for parallel computation of vector-radix two-dimensional (2-D) fast discrete cosine transform (VR-FCT), and its VLSI implementation. By mapping the 2-D VR-FCT onto a 2-D array of processing elements (PEs), the butterfly structure of the VR-FCT can be efficiently importanted with high concurrency and local communication geometry. The proposed array algorithm features architectural modularity, regularity and locality, so that it is very suitable for VLSI realization. Also, no transposition memory is required, which is invitable in the conventional row-column decomposition approach. It has the time complexity of O(N+Nnzp-log2N) for (N*N) 2-D DCT, where Nnzd is the number of non-zero digits in canonic-signed digit(CSD) code, By adopting the CSD arithmetic in circuit desine, the number of addition is reduced by about 30%, as compared to the 2`s complement arithmetic. The computational accuracy analysis for finite wordlength processing is presented. From simulation result, it is estimated that (8*8) 2-D DCT (with Nnzp=4) can be computed in about 0.88 sec at 50 MHz clock frequency, resulting in the throughput rate of about 72 Mega pixels per second.

• Journal of the Korea Society for Simulation
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• v.23 no.3
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• pp.27-32
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• 2014

In this paper, We are going to propose the novel structure with improved behavior than the conventional vertical structure for VLSI CMOS circuits. For this, the proposed structure is the moat shape for STI. We want to analysis the characteristics of simulations about the electron concentration distribution, oxide layer shape of hot electron stress, potential flux and electric field flux, electric field fo themal damage and current-voltage characteristics in devices. Physically based models are the ambient and stress bias conditions of TCAD tool. As a analysis results, shallow trench structure were trended to be electric functions of passive as device dimensions shrink. The electrical characteristics influence of proposed STI structures on the transistor applications become stronger the potential difference electric field and saturation threshold voltage, are decreased the stress effects of active region. The fabricated device of based on analysis results data were the almost same characteristics of simulation results data.

• Journal of the Korea Society for Simulation
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• v.18 no.4
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• pp.59-66
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• 2009

This has been possible by integration techniques such as very large scale integration (VLSI) and wafer scale integration (WSI). Redundancy has been extensively used for manufacturing memory chips and to provide repair of these devices in the presence of faulty cells. If there are too many defects, the momory has to be rejected. But if there are a few defects, it will be more efficient and cost reducing for the company to use it by repairing. Therefore, laser-repair process is nedded for such a reason and redundancy analysis is needed to establish correct target of laser-repair process. The proposed CRA (Correlation Repair Algorithm) simulation, beyond the idea of the conventional redundancy analysis algorithm, aims at reducing the time spent in the process and strengthening cost competitiveness by performing redundancy analysis after simulating each case of defect.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.86-94
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• 1998

This paper proposes a new fast block-matching algorithm, named MFSS(Modified Four-Step Search) algorithm, which has better performance and is more adequate for hardware realization than the existing fast algorithms. The proposed algorithm is suitable for hardware realization since it has a unique regularity during the search procedure. It is shown from simulation results that its performance is close to that of FS(Full Search) algorithm. This paper also proposes a VLSI architecture and presents some design results of a motion estimator and compensator which adopted the MFSS algorithm. The important aspects considered in designing a motion estimator and compensator are hardware complexity of design results, and total delay needed to generate the motion compensated data after finding the motion vectors. Hardware complexity is minimized by using just nine PE(Process Element)'s, and total delay is minimized by sharing search memory of the motion estimator and compensator.

• Journal of Korea Multimedia Society
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• v.8 no.8
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• pp.1042-1050
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• 2005

This paper proposed a novel low-power video decoding scheme for mobile multimedia communication. In general, there are quite a large number of non-coded blocks in the encoded bitstream where all quantized DCT coefficients are truncated into zero. When the number of the non-coded blocks are known at the start of frame decoding, the amount of computation reduction can be precisely estimated for frame decoding. When the computation reduces, the operation speed and the corresponding supply voltage of VLSI circuits in the decoder also reduce, thus thus power consumption also reduces. In the proposed scheme, the number of the non-coded blocks is stored in the frame header of the encoded bitstream, and the decoder efficiently reduces the power consumption exploiting this information. Simulation results show that the proposed scheme reduces the power consumption to about 1/20.

• Journal of Korea Multimedia Society
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• v.9 no.5
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• pp.542-553
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• 2006

Because Y and C signals in a composite video signal are piled one on another in the same frequency, it is impossible to separate them completely. Therefore, it is necessary to develop efficient separation technique in order to minimize degradation of video quality. In this paper, we propose wavelet-based 3D comb filter algorithm and architecture for separating Y and C signals from a composite video signal. The proposed algorithm uses wavelet transform and thresholding of compared lines for acquiring the maximum video quality. Simulation results show that the proposed algorithm has better image quality and better PSNR than previous algorithms. For real application of the proposed algorithm, we developed a hardware architecture and the architecture was implemented by using VHDL. Finally, a VLSI layout of the proposed architecture was generated by using 0.25 micrometer CMOS process.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.11 no.1
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• pp.64-72
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• 2001

This paper is on a design of the high-speed cipher IC using IDEA algorithm. The chip is consists of six functional blocks. The principal blocks are encryption and decryption key generator, input data circuit, encryption processor, output data circuit, operation mode controller. In subkey generator, the design goal is rather decrease of its area than increase of its computation speed. On the other hand, the design of encryption processor is focused on rather increase of its computation speed than decrease of its area. Therefore, the pipeline architecture for repeated processing and the modular multiplier for improving computation speed are adopted. Specially, there are used the carry select adder and modified Booth algorithm to increase its computation speed at modular multiplier. To input the data by 8-bit, 16-bit, 32-bit according to the operation mode, it is designed so that buffer shifts by 8-bit, 16-bit, 32-bit. As a result of simulation by 0.25 $\mu\textrm{m}$ process, this IC has achieved the throughput of 1Gbps in addition to its small area, and used 12,000gates in implementing the algorithm.