• 제목/요약/키워드: Uniform Stress

검색결과 706건 처리시간 0.027초

균일한 압축장에 대한 새로운 휨 형태의 파괴 매캐니즘 (New Flexural Failure Mechanisms for Uniform Compression Stress Fields)

  • 홍성걸
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 1997년도 가을 학술발표회 논문집
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    • pp.546-551
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    • 1997
  • New typology of failure mechanisms for uniform compression fields are presented based on the classical theory of plasticity, in particular th normality rule, and the limit theorem. The concrete is assumed as a rigid-perfectly plastic material obeying the modified Coulomb failure criteria with zero tension cut-off. The failure mechanisms are capable of explaining flexural types of crushing failure in uniaxial uniform compression stress fields which are called struts in truss models. The failure mechanisms consist of sliding failure along straight failure lines or hyperbolic failure curves and rigid body rotation. The failure mechanisms involving straight failure lines are explained by constant strain expansion in the first principal direction and rigid body rotation motion. The failure mechanisms presented are applied to the explanation of bond failure of bar combined with concrete crushing failure and flexural crushing failure of concrete.

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일정 압력에 의한 3차원 평면균열에서의 응력확대계수 계산 (Calculation of Stress Intensity Factor in Arbitrarily Shaped Plane Crack under Uniform Pressure Loading)

  • 안득만
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집A
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    • pp.117-122
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    • 2000
  • In this paper the stress intensity factor under uniform pressure in the arbitrarily-shaped plane crack configuration transformed elliptic crack by Mobius mapping are determined. Using Dyson's formula Boussinesq-Papkovich potentials for mode I deformation are constructed. In the example the stress intensity factors are approximately calculated by least square method.

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The Stress Dependence of Trap Density in Silicon Oxide

  • Kang, C. S.
    • 대한전자공학회논문지TE
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    • 제37권2호
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    • pp.17-24
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    • 2000
  • In this paper, the stress and transient currents associated with the on and off time of applied voltage were used to measure the density and distribution of high voltage stress induced traps in thin silicon oxide films. The transient currents were due to the discharging of traps generated by high stress voltage in the silicon oxides. The trap distributions were relatively uniform new both cathode and anode interface. The trap densities were dependent on the stress polarity. The stress generated trap distributions were relatively uniform the order of 1011~1021[states/eV/cm2] after a stress voltage. It appear that the stress and transient current that flowed when the stress voltage were applied to the oxide was caused by carriers tunneling through the silicon oxide by the high voltage stress generated traps.

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三次元數値모델을 使용한 東支那海의 定常均一風의 應力에 의한 海流의 算定 (Comoutation of Currents Driven by a Steady Uniform Wind Stress on the East China Sea using a Three-dimensional Numerical Model)

  • 최병호
    • 한국해양학회지
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    • 제19권1호
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    • pp.36-43
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    • 1984
  • 複雜한 沿岸地形 및 水深變化를 考慮한 黃海 및 東支那海의 三次元 水動力學的 羞恥모델을 開發하여 定常均一風의 應力에 의한 海流의 手織分布를 算定하였다. 北西風 및 南西風의 秒速 약 10m에 該當하는 海面應力 1.6dyne/$\textrm{cm}^2$에 의한 陸棚體系의 反應을 調査하기 위한 手織實驗에서 動的 循環形態를 提示하고 檢討하였다.

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변위 측정을 기본으로 한 구멍뚫기방법에 의한 잔류응력 측정 방법 (Determination of Residual Stress by the Hole Drilling Method Based on Displacement Measurement)

  • 신동일;주진원
    • 대한기계학회논문집A
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    • 제29권11호
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    • pp.1542-1550
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    • 2005
  • This paper presents the numerical procedure for calculating non-uniform residual stresses based on relieved displacements obtained from incremental hole drilling. The relationship between the in-plane displacement produced by introducing a blind hole and the corresponding residual stress is established. Finite element calculations are described to evaluate the relieved coefficients required for the determination of non-uniform residual stresses. Validity of the proposed method has been tested through three axisymmetric test examples and two three-dimensional examples. As a result of . simulation on the test examples, it is found that this numerical procedure is well adopted to measuring non-uniform residual stress in the full hole depth range of the hole diameter from the surface. The accuracy of the hole drilling method with displacement measurement is discussed, comparing tile method with strain measurement

구멍뚫기방법을 이용한 깊이방향으로 변하는 잔류응력 측정방법 (Determination of non-uniform residual stress by the hole drilling method)

  • 주진원;박찬기
    • 대한기계학회논문집A
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    • 제22권2호
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    • pp.268-277
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    • 1998
  • The numerical procedure for calculating non-uniform residual stress fields by using relieved strain data from incremental hole drilling method is presented. Finite element calculations are described to evaluate the relieved coefficients required for the determination of residual stresses. From the results of simulations it is found that this numerical method is well adopted to measuring non-uniform residual stress in the hole depth range of 0.8 times of the hole diameter from the surface. In order to examine the practicability of this method, the hole drilling procedure for the four point bending test is performed. This method is applied to the measurement of residual stresses in the cold-rolled steel pipe. It is shown that the magnitude of residual stress in the pipe is not negligible when compared with yield stress and the residual stress should be duly considered in designing structures with this pipes.

부분 열유동이 있는 접합 경계면균열의 열응력세기계수 결정 (Thermal Stress Intensity Factors for Partially Insulated Interface Crack under Uniform Heat Flow)

  • 이강용;박상준
    • 대한기계학회논문집
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    • 제18권7호
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    • pp.1705-1712
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    • 1994
  • Hilbert problems are derived to evaluate thermal stress intensity factors for a partially insulated crack subjected to vertically uniform heat flow in infinite bonded dissimilar materials. In case of fully insulated crack surface, the present solutions of thermal stress intensity factors are reduced into the same as the previous results. For the homogeneous material, mode II thermal stress intensity factor only exists. However, in the bonded dissimilar materials, both mode I and II thermal stress intensity factors are obtained. Specially, in this case, mode II thermal stress intensity factor is dominent. Also, thermal stress intensity factors are strongly influenced by the material properties. Thermal stress intensity factors decrease when the degree of insulation decreases.

두께가 일정하지 않은 재료에서 경사진 균열의 성장거동에 관한 연구 (A Study on the Crack Growth Behavior of a Inclined Crack in a Non-Uniform Thickness Material)

  • 조명래;표창률;박종주;고명훈
    • 한국안전학회지
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    • 제12권4호
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    • pp.27-38
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    • 1997
  • The effect of geometry factors on the combined mode stress intensity factor behaviors of a slant crack in a non-uniform thickness material was analysed by 2-dimensional theoretical analysis. The analysis is based on the Laurent's series expansions of complex potentials where the complex coefficients of the series are determined from the compatibility and the equilibrium conditions of the thickness interface and the stress free conditions of the crack surface. In numerical calculations the perturbation technique is employed. The expressions for the crack tip stress intensity factor are given in the form of power series of dimensionless crack length $\lamda$, and the function of crack slant angle $\alpha$ and thickness ratio $\beta$. The results of numerical calculations for each problems are represented as the correction factors F($\lamda$, $\alpha$, $\beta$). The results clearly show the following characteristics : The correction factors of the combined mode stress intensity factors for a non-uniform thickness material can be defined in the form of F($\lamda$, $\alpha$, $\beta$). The stress intensity factor values for a given crack length are decreased with increase of thickness ratio $\beta$.

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수직 균일 열유동하에 있는 접합 경계면 균열의 열응력세기계수 결정 (Determination of Thermal Dtress Intensity Factors for the Interface Crack under Vertical Uniform Heat Flow)

  • 이강용;설창원
    • 대한기계학회논문집
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    • 제15권1호
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    • pp.201-208
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    • 1991
  • 본 연구에서는 균일 열유동이 접합면에 수직으로 흐르고 접합 경계면 균열의 열경계조건이 단열되어 있는 경우에 균질 및 접합재료 모두에 적용될 수 있는 열응세 기계수를 복소해석방법을 이용하여 구하고자 한다.

Relaxation of Singular Stress in Adhesively Bonded Joint at High Temperature

  • Lee, Sang Soon
    • 반도체디스플레이기술학회지
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    • 제17권1호
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    • pp.35-39
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    • 2018
  • This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.