• Proceedings of the Korea Concrete Institute Conference
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• 1997.10a
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• pp.546-551
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• 1997

New typology of failure mechanisms for uniform compression fields are presented based on the classical theory of plasticity, in particular th normality rule, and the limit theorem. The concrete is assumed as a rigid-perfectly plastic material obeying the modified Coulomb failure criteria with zero tension cut-off. The failure mechanisms are capable of explaining flexural types of crushing failure in uniaxial uniform compression stress fields which are called struts in truss models. The failure mechanisms consist of sliding failure along straight failure lines or hyperbolic failure curves and rigid body rotation. The failure mechanisms involving straight failure lines are explained by constant strain expansion in the first principal direction and rigid body rotation motion. The failure mechanisms presented are applied to the explanation of bond failure of bar combined with concrete crushing failure and flexural crushing failure of concrete.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.117-122
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• 2000

In this paper the stress intensity factor under uniform pressure in the arbitrarily-shaped plane crack configuration transformed elliptic crack by Mobius mapping are determined. Using Dyson's formula Boussinesq-Papkovich potentials for mode I deformation are constructed. In the example the stress intensity factors are approximately calculated by least square method.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.2
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• pp.17-24
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• 2000

In this paper, the stress and transient currents associated with the on and off time of applied voltage were used to measure the density and distribution of high voltage stress induced traps in thin silicon oxide films. The transient currents were due to the discharging of traps generated by high stress voltage in the silicon oxides. The trap distributions were relatively uniform new both cathode and anode interface. The trap densities were dependent on the stress polarity. The stress generated trap distributions were relatively uniform the order of 1011~1021[states/eV/cm2] after a stress voltage. It appear that the stress and transient current that flowed when the stress voltage were applied to the oxide was caused by carriers tunneling through the silicon oxide by the high voltage stress generated traps.

• 한국해양학회지
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• v.19 no.1
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• pp.36-43
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• 1984

A three-dimensional hydrodynamical numerical model of the Yellow Sea and the East China Sea is formulated having irregular coastal boundaries and non-uniform depth distribution represntative of nature. The developed model is used to derive the currents driven by a steady uniform wind stress on the Yellow Sea and the East China Sea. Numerical experiments have been performed with the model to determine the response of the shelf to stationary wind stress fields suddenly imposed on the shelf for wind directions of NW and SW winds and wind stress of 1.6dyn/$\textrm{cm}^2$. The dynamical feature of the derived circulation are presented and discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.11 s.242
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• pp.1542-1550
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• 2005

This paper presents the numerical procedure for calculating non-uniform residual stresses based on relieved displacements obtained from incremental hole drilling. The relationship between the in-plane displacement produced by introducing a blind hole and the corresponding residual stress is established. Finite element calculations are described to evaluate the relieved coefficients required for the determination of non-uniform residual stresses. Validity of the proposed method has been tested through three axisymmetric test examples and two three-dimensional examples. As a result of . simulation on the test examples, it is found that this numerical procedure is well adopted to measuring non-uniform residual stress in the full hole depth range of the hole diameter from the surface. The accuracy of the hole drilling method with displacement measurement is discussed, comparing tile method with strain measurement

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.2
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• pp.268-277
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• 1998

The numerical procedure for calculating non-uniform residual stress fields by using relieved strain data from incremental hole drilling method is presented. Finite element calculations are described to evaluate the relieved coefficients required for the determination of residual stresses. From the results of simulations it is found that this numerical method is well adopted to measuring non-uniform residual stress in the hole depth range of 0.8 times of the hole diameter from the surface. In order to examine the practicability of this method, the hole drilling procedure for the four point bending test is performed. This method is applied to the measurement of residual stresses in the cold-rolled steel pipe. It is shown that the magnitude of residual stress in the pipe is not negligible when compared with yield stress and the residual stress should be duly considered in designing structures with this pipes.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1705-1712
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• 1994

Hilbert problems are derived to evaluate thermal stress intensity factors for a partially insulated crack subjected to vertically uniform heat flow in infinite bonded dissimilar materials. In case of fully insulated crack surface, the present solutions of thermal stress intensity factors are reduced into the same as the previous results. For the homogeneous material, mode II thermal stress intensity factor only exists. However, in the bonded dissimilar materials, both mode I and II thermal stress intensity factors are obtained. Specially, in this case, mode II thermal stress intensity factor is dominent. Also, thermal stress intensity factors are strongly influenced by the material properties. Thermal stress intensity factors decrease when the degree of insulation decreases.

• Journal of the Korean Society of Safety
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• v.12 no.4
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• pp.27-38
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• 1997

The effect of geometry factors on the combined mode stress intensity factor behaviors of a slant crack in a non-uniform thickness material was analysed by 2-dimensional theoretical analysis. The analysis is based on the Laurent's series expansions of complex potentials where the complex coefficients of the series are determined from the compatibility and the equilibrium conditions of the thickness interface and the stress free conditions of the crack surface. In numerical calculations the perturbation technique is employed. The expressions for the crack tip stress intensity factor are given in the form of power series of dimensionless crack length $\lamda$, and the function of crack slant angle $\alpha$ and thickness ratio $\beta$. The results of numerical calculations for each problems are represented as the correction factors F($\lamda$, $\alpha$, $\beta$). The results clearly show the following characteristics : The correction factors of the combined mode stress intensity factors for a non-uniform thickness material can be defined in the form of F($\lamda$, $\alpha$, $\beta$). The stress intensity factor values for a given crack length are decreased with increase of thickness ratio $\beta$.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.1
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• pp.201-208
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• 1991

In case that an interface crack exists in an infinite two-dimensional elastic bimaterial, the crack surface is insulated under traction free and the uniform heat flow vertical to the crack from infinite boundary is given. Temperature and stress potentials are obtained by using complex variable approach to solve Hilbert problems. The results are used to obtain thermal stress intensity factors. Only mode I thermal stress intensity factor occurs in case of the homogeneous material. Otherwise, mode I and II thermal stress intensity factor is much smaller than one of mode II.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.