• Title/Summary/Keyword: Thermo-mechanical Stress

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Thermal distortion analysis method for TMCP steel structures using shell element

  • Ha, Yun-sok;Rajesh, S.R.
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.1 no.2
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    • pp.95-100
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    • 2009
  • As ships become larger, thicker and higher tensile steel plate are used in shipyard. Though special chemical compositions are required for high-tensile steels, recently they are made by the TMCP (Thermo-Mechanical control process) methodology. The increased Yield / Tensile strength of TMCP steels compared to the normalized steel of same composition are induced by suppressing the formation of Ferrite and Pearlite in favor of strong and tough Bainite while being transformed from Austenite. But this Bainite phase could be vanished by another additional thermal cycle like welding and heating. As thermal deformations are deeply related by yield stress of material, the study for prediction of plate deformation by heating should niflect the principle of TMCP steels. The present study is related to the development of an algorithm which could calculate inherent strain. In this algorithm, not only the mechanical principles of thermal deformations, but also the initial portion of Bainite is considered when calculating inherent strain. Distortion analysis results by these values showed good agreements with experimental results for normalized steels and TMCP steels during welding and heating. This algorithm has also been used to create an inherent strain database of steels in Class rule.

The Effect of Forced Temperature Change Cycles on Physical and Mechanical Properties of Sand and Weathered Granite Soil (흙과 열유도 토목섬유 접촉면의 마찰저항 특성)

  • Shin, Seung-min;Sin, Chun-won;Yoo, Chung-Sik
    • Journal of the Korean Geosynthetics Society
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    • v.16 no.2
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    • pp.175-181
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    • 2017
  • This paper presents the results of an investigation into the effect of forced temperature change cycles on physical and mechanical properties of sand and weathered granite soil. The effect of forced temperature change cycles on the particle arrangement and the thermal conductivity was first investigated. A series of triaxial compression tests on the soils were also performed to look into the effect of temperature change cycles on the stress-strain-strength behavior.

Effect of Oxygen Content on Aging Properties of Ti-39Nb-6Zr alloy (Ti-39Nb-6Zr 합금의 산소함량에 따른 시효특성 변화)

  • Han, Chan Byeol;Lee, Dong-Geun
    • Journal of the Korean Society for Heat Treatment
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    • v.35 no.2
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    • pp.88-95
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    • 2022
  • Titanium alloy for bio-medical applications have been developed to reduce the toxicity of alloying elements and avoid the stress-shielding effect which is caused by relatively high elastic modulus compared to bone. Ti-39Nb-6Zr (TNZ40) alloy of elastic modulus exhibits around 40 GPa in the case of beta single phase. However, the strength of this alloy is lower than the other types of titanium alloys. Many research found that adding oxygen to beta-titanium alloys is beneficial for improving the strength through solid solution strengthening. In this study, TNZ40 ingots with addition of O were prepared by an arc remelting process (Ti-39Nb-6Zr-0.16O (wt.%), Ti-39Nb-6Zr-0.26O (wt.%)). Thermo-mechanical processing (i.e., heat treatment, cold swaging and aging heat treatment) has been performed under various conditions. Therefore, the aim of this study is to investigate the effect of oxygen content and ω phase formation on microstructure and mechanical properties.

Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging (Though-silicon-via를 사용한 3차원 적층 반도체 패키징에서의 열응력에 관한 연구)

  • Hwang, Sung-Hwan;Kim, Byoung-Joon;Jung, Sung-Yup;Lee, Ho-Young;Joo, Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.69-73
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    • 2010
  • Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.

Evaluation of Residual Stress for Thermal Damage of Railway Wheel Tread (차륜 답면의 열손상에 대한 잔류응력 평가)

  • Kwon, Seok-Jin;Seo, Jung-Won;Lee, Dong-Hyung;Ham, Young-Sam
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.5
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    • pp.537-542
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    • 2011
  • The thermo-mechanical interaction between brake block and wheel tread during braking has been found to cause thermal crack on the wheel tread. Due to thermal expansion of the rim material, the thermal cracks will protrude from the wheel tread and be more exposed to wear during the wheel/block contact than the rest of the tread surface. The wheel rim is in residual compression stress when is new. After service running, the region in the tread has reversed to tension. This condition can lead to the formation and growth of thermal cracks in the rim which can ultimately lead to premature failure of wheel. In the present paper, the thermal cracks of railway wheel, one of severe damages on the wheel tread, were evaluated to understand the safety of railway wheel in running condition. The residual stresses for damaged wheel which are applied to tread brake are investigated. Mainly X-ray diffusion method is used. Under the condition of concurrent loading of continuous rolling contact with rails and cyclic frictional heat from brake blocks, the reduction of residual stress is found to correlate well with the thermal crack initiation.

Surface and size dependent effects on static, buckling, and vibration of micro composite beam under thermo-magnetic fields based on strain gradient theory

  • Mohammadimehr, Mehdi;Mehrabi, Mojtaba;Hadizadeh, Hasan;Hadizadeh, Hossein
    • Steel and Composite Structures
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    • v.26 no.4
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    • pp.513-531
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    • 2018
  • In this article, static, buckling and free vibration analyses of a sinusoidal micro composite beam reinforced by single-walled carbon nanotubes (SWCNTs) with considering temperature-dependent material properties embedded in an elastic medium in the presence of magnetic field under transverse uniform load are presented. This system is used at micro or sub micro scales to enhance the stiffness of micro composite structures such as bar, beam, plate and shell. In the present work, the size dependent effects based on surface stress effect and modified strain gradient theory (MSGT) are considered. The generalized rule of mixture is employed to predict temperature-dependent mechanical and thermal properties of micro composite beam. Then, the governing equations of motions are derived using Hamilton's principle and energy method. Numerical results are presented to investigate the influences of material length scale parameters, elastic foundation, composite fiber angle, magnetic intensity, temperature changes and carbon nanotubes volume fraction on the bending, buckling and free vibration behaviors of micro composite beam. There is a good agreement between the obtained results by this research and the literature results. The obtained results of this study demonstrate that the magnetic intensity, temperature changes, and two parameters elastic foundations have important effects on micro composite stiffness, while the magnetic field has greater effects on the bending, buckling and free vibration responses of micro composite beams. Moreover, it is shown that the effects of surface layers are important, and observed that the changes of carbon nanotubes volume fraction, beam length-to-thickness ratio and material length scale parameter have noticeable effects on the maximum deflection, critical buckling load and natural frequencies of micro composite beams.

Buckling and vibration analyses of MGSGT double-bonded micro composite sandwich SSDT plates reinforced by CNTs and BNNTs with isotropic foam & flexible transversely orthotropic cores

  • Mohammadimehr, M.;Nejad, E. Shabani;Mehrabi, M.
    • Structural Engineering and Mechanics
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    • v.65 no.4
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    • pp.491-504
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    • 2018
  • Because of sandwich structures with low weight and high stiffness have much usage in various industries such as civil and aerospace engineering, in this article, buckling and free vibration analyses of coupled micro composite sandwich plates are investigated based on sinusoidal shear deformation (SSDT) and most general strain gradient theories (MGSGT). It is assumed that the sandwich structure rested on an orthotropic elastic foundation and make of four composite face sheets with temperature-dependent material properties that they reinforced by carbon and boron nitride nanotubes and two flexible transversely orthotropic cores. Mathematical formulation is presented using Hamilton's principle and governing equations of motions are derived based on energy approach and applying variation method for simply supported edges under electro-magneto-thermo-mechanical, axial buckling and pre-stresses loadings. In order to predict the effects of various parameters such as material length scale parameter, length to width ratio, length to thickness ratio, thickness of face sheets to core thickness ratio, nanotubes volume fraction, pre-stress load and orthotropic elastic medium on the natural frequencies and critical buckling load of double-bonded micro composite sandwich plates. It is found that orthotropic elastic medium has a special role on the system stability and increasing Winkler and Pasternak constants lead to enhance the natural frequency and critical buckling load of micro plates, while decrease natural frequency and critical buckling load with increasing temperature changes. Also, it is showed that pre-stresses due to help the axial buckling load causes that delay the buckling phenomenon. Moreover, it is concluded that the sandwich structures with orthotropic cores have high stiffness, but because they are not economical, thus it is necessary the sandwich plates reinforce by carbon or boron nitride nanotubes specially, because these nanotubes have important thermal and mechanical properties in comparison of the other reinforcement.

Thermal and structural analysis of a cryogenic conduction cooling system for a HTS NMR magnet

  • In, Sehwan;Hong, Yong-Ju;Yeom, Hankil;Ko, Junseok;Kim, Hyobong;Park, Seong-Je
    • Progress in Superconductivity and Cryogenics
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    • v.18 no.1
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    • pp.59-63
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    • 2016
  • The superconducting NMR magnets have used cryogen such as liquid helium for their cooling. The conduction cooling method using cryocoolers, however, makes the cryogenic cooling system for NMR magnets more compact and user-friendly than the cryogen cooling method. This paper describes the thermal and structural analysis of a cryogenic conduction cooling system for a 400 MHz HTS NMR magnet, focusing on the magnet assembly. The highly thermo-conductive cooling plates between HTS double pancake coils are used to transfer the heat generated in coils, namely Joule heating at lap splice joints, to thermal link blocks and finally the cryocooler. The conduction cooling structure of the HTS magnet assembly preliminarily designed is verified by thermal and structural analysis. The orthotropic thermal properties of the HTS coil, thermal contact resistance and radiation heat load are considered in the thermal analysis. The thermal analysis confirms the uniform temperature distribution for the present thermal design of the NMR magnet within 0.2 K. The mechanical stress and the displacement by the electromagnetic force and the thermal contraction are checked to verify structural stability. The structural analysis indicates that the mechanical stress on each component of the magnet is less than its material yield strength and the displacement is acceptable in comparison with the magnet dimension.

Behavior of girth-welded buried steel pipes under external pressure (원주 용접된 압력 매설강관의 거동 분석)

  • Jeon, Juntai;Lee, Chinhyung;Chang, Kyongho
    • Journal of the Society of Disaster Information
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    • v.11 no.1
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    • pp.1-8
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    • 2015
  • This paper presents finite element (FE) analyses to clarify the effects of external pressure on the residual stresses in a girth-welded steel pipe. At first, FE simulation of the girth welding process is carried out to obtain the weld-induced residual stresses employing sequentially coupled three-dimensional (3-D) thermo-mechanical FE formulation. Then, 3-D elastic-plastic FE analyses incorporating the residual stresses and plastic strains obtained from the preceding FE simulation are performed to investigate the residual stress behavior in the girth-welded pipe under external pressure. The FE analysis results show that the hoop compressive stresses induced by the external pressure significantly alter the hoop residual stresses in the course of the mechanical loading.

Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package (수치해석을 이용한 구리기둥 범프 플립칩 패키지의 열압착 접합 공정 시 발생하는 휨 연구)

  • Kwon, Oh Young;Jung, Hoon Sun;Lee, Jung Hoon;Choa, Sung-Hoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.6
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    • pp.443-453
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    • 2017
  • In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.