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http://dx.doi.org/10.3795/KSME-A.2017.41.6.443

Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package  

Kwon, Oh Young (Dept. of Manufacturing System and Design Engineering, Seoul Nat'l Univ. of Science and Technology)
Jung, Hoon Sun (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. of Science and Technology)
Lee, Jung Hoon (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. of Science and Technology)
Choa, Sung-Hoon (Graduate School of NID Fusion Technology, Seoul Nat'l Univ. of Science and Technology)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.41, no.6, 2017 , pp. 443-453 More about this Journal
Abstract
In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.
Keywords
Flip Chip; Copper Pillar Bump; Thermal Compression Bonding; Warpage; Numerical Analysis;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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