• 한국기계가공학회지
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• 제19권1호
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• pp.100-107
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• 2020

As demand for high value-added products with hard materials increases, the line center is used for producing high value-added products in many industries such as aerospace, automobile fields. The line center is a key device for smart factory automation that can improve the production efficiency and the productivity. Therefore, the development of a mill-turn line center is necessary to produce high value-added products with complex shapes flexibly. In the mill-turn process, a milling process and a turning process are combined. In particular, the turning process needs to increase the rigidity of the spindle. The purpose of this study is to analyze the thermal-structural stability through thermo-structural coupled analysis for a mill-turn spindle with a curvic coupling. The maximum temperature and thermal stability of the spindle were analyzed by thermal distribution. In addition, the thermal deformation and thermal-structural stability of the spindle were analyzed through thermo-structural coupled analysis.

• Transactions on Electrical and Electronic Materials
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• 제9권2호
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• 한국기계가공학회지
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• 제18권12호
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• pp.45-51
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• 2019

As the separator becomes thinner, the role of thermal stability becomes more important in ensuring the high capacity of medium- and large-sized lithium-ion secondary batteries. In this study, we researched coating technology to improve the separator's thermal stability. We minimized the coating time by optimizing the design of a vertical two-stage coater that was thin, uniform, and capable of coating on both sides at the same time with a maximum 2㎛ thickness coating layer of fluorinated polymer (PVdF-HFP) on the bare polyethylene (PE) separator, which increased the thermal stability. In addition, during the coating process, a dual-jacket-roll method of drying was developed that increased the drying effectiveness without thermal damage to the separator. We also investigated the thermal stability of the separator manufactured from a coating machine, and studied the battery-applied performance by making a lithium-ion pouch battery.

• Structural Engineering and Mechanics
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• 제32권3호
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• pp.429-445
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• 2009

Thermal stability of quasi-isotropic composite and polymeric structures is considered one of the most important criteria in predicting life span of building structures. The outdoor applications of these structures have raised some legitimate concerns about their durability including moisture resistance and thermal stability. Exposure of such quasi-isotropic composite/polymeric structures to various and severe climatic conditions such as heat flux and frigid climate would change the material behavior and thermal viability and may lead to the degradation of material properties and building durability. This paper presents an analytical model for the generalized problem. This model accommodates the non-linearity and the non-homogeneity of the internal heat generated within the structure and the changes, modification to the material constants, and the structural size. The paper also investigates the effect of the incorporation of the temperature and/or material constant sensitive internal heat generation with four encountered climatic conditions on thermal stability of infinite cylindrical quasi-isotropic composite/polymeric structures. This can eventually result in the failure of such structures. Detailed critical analyses for four case studies which consider the population of the internal heat generation, cylindrical size, material constants, and four different climatic conditions are carried out. For each case of the proposed boundary conditions, the critical thermal stability parameter is determined. The results of this paper indicate that the thermal stability parameter is critically dependent on the cylinder size, material constants/selection, the convective heat transfer coefficient, subjected heat flux and other constants accrued from the structure environment.

• Journal of Welding and Joining
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• 제31권5호
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• Biotechnology and Bioprocess Engineering:BBE
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• 제3권1호
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• pp.32-34
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• 1998

Phytase from Aspergillus species is a very heat unstable enzyme which inactivates to a great extent during the thermal processing of animal feed formulation. Various protein stabilization additives were tested to improve its heat stability. Among them, a basic amino acid, L-arginine remarkably increased the thermal stability of phytase in an aqueous solution state.

• 한국안전학회지
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• 제22권4호
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• pp.43-50
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• 2007

Lack of understanding of the process chemistry and thermodynamics are the major reasons that can is lead to thermal runaway reaction in the chemical reaction process. The evaluation of reaction factors and thermal behavior in neutralization process of pigment plant are described in this paper. The experiments were performed in the C 80 calorimeter, and Thermal Screening Unit($TS^{u}$). The aim of the study was to evaluate the results of thermal stability in terms of safety reliability to be practical applications. It suggested that we be proposed safe operating conditions and securities for accident prevention through this study.

• 조명전기설비학회논문지
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• 제21권2호
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• pp.86-93
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• 2007

본 논문은 가용송전용량(ATC)를 계산하기 위한 두 가지 빠른 계산 기법을 제안한다. 이 방법들은 선로의 열적용량한계(Thermal ATC)와 전압 안정도한계(Voltage ATC)를 제약조건으로 ATC를 계산한다. 먼저 선로의 열적용량을 고려한 방법에서는 모선의 전력 변화에 대한 선로의 조류 감도인 PTDF와 n-1 상정사고를 고려한 LODF를 이용하였으며, 전압안정도를 고려한 방법에서는 2모선 등가 시스템을 이용하여 최대 전력을 구하는 방법을 이용하였다. 제안된 방법은 IEEE 30모선 계통에 적용하였으며 그 결과를 다른 방법과 비교하여 제안된 방법의 타당성을 입증하였다.

• Elastomers and Composites
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• 제58권2호
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• pp.70-80
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• 2023

The effect of phenylphosphonic acid (PPOA) on polyurethane (PU) thermal stability was studied through Fourier transform infrared spectroscopy and Thermogravimetric analysis. To synthesize PPOA-modified PUs (PPOA-PUs), polyether-type diols (Mw=62, 106, 190, 419, 605) were chemically modified with PPOA and then reacted with 4,4'-dicyclohexylmethane diisocyanate (H₁₂MDI) and 4,4-diphenylmethane diisocyanate (MDI). During thermal decomposition in air, the PPOA embedded in the PUs formed intumescent phosphocarbonaceous char. Below 400℃, PPOA-H₁₂MDI-PUs were more unstable, as PPOA decomposed at lower temperatures than phenyl groups and aliphatic ethers. Above 550℃, the thermal stability of PUs followed this order: PPOA-MDI-PUs > PPOA-H₁₂MDI-PUs > MDI-PUs > H₁₂MDI-PUs. At 700℃, unmodified PUs had no residue, while the PPOA-MDI-PU residue was 4.4~23.0 wt.% and the PPOA-H₁₂MDI-PU residue was 1.5~17.5 wt.%. The enhanced thermal stability of PPOA-MDI-PUs at high temperatures can be attributed to the synergetic effect of PPOA and phenyl groups on the formation of phosphocarbonaceous char.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.