• 한국표면공학회지
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• 제55권6호
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• pp.376-382
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• 2022

Yb₂Si₂O₇ has a coefficient of thermal expansion similar to that of the base material of SiC and has excellent corrosion resistance in a high-temperature oxidizing atmosphere including water vapor, so it is being studied as one of the materials for environmental barrier coatings (EBCs). In this study, Yb₂Si₂O₇ powder granule is deposited using atmospheric plasma spraying (APS) with different Ar/He ratios. Phase formation and microstructural characteristics are investigated with the coated specimens. In the coating layer, the crystallinity decreased, and the amorphous content increased from an increase in the ratio of Ar. In addition, the various types of particles involved by local volatilization of Si according to the Ar/He ratios were identified.

• Archives of Metallurgy and Materials
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• 제66권4호
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• pp.1033-1036
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• 2021

Laser cladding is a method that can be applied to repair the crack and break on the mold and die surfaces, as well as generate new attributes on the surface to improve toughness, hardness, and corrosion resistance. It is used to extend the life of the mold. It also has the advantages of superior bonding strength and precision coating on a local area compared with the conventional thermal spraying technology. In this study, we investigated the effect of cladding on low carbon alloy steel using 18%Cr-2.5%Ni-Fe powder (Rockit404), which showed high hardness on the die surface. The process conditions were performed in an argon atmosphere using a diode laser source specialized for 900-1070 nm, and the output conditions were 5, 6, and 10 kW, respectively. After the cladding was completed, the surface coating layer's shape, the hardness according to the cross-section's thickness, and the microstructure were analyzed.

• 한국재료학회지
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• 제3권2호
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• pp.158-165
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• 1993

실리콘박막의 상부에 고상반응에 의해 형성된 TiS$i_2$ 박막의 응집 거동에 미치는 기판 실리콘의 영향을 조사했다. 폴리실리콘과 어몰퍼스실리콘을 증착상태 또는 어닐링한 상태엣 TiS$i_2$를 형성시키고 90$0^{\circ}C$열처리에 따른 TiS$i_2$의 면저항값의 변화를 조사하고 XRD, SEM 및 TEM에 의한 실리콘의 조직관찰을 행했다. TiS$i_2$응집은 어몰퍼스실리콘 위의 경우가 더욱 심했다. 폴리실리콘을 어닐링하면 TiS$i_2$의 응집은 억제되며 고온에서 어닐링할수록 그 효과가 현저했다. 이는 폴리실리콘의 입도 변화보다는 증착시 존재하는 결함들이 열처리에 의해 감소된 때문이다. 폴리실리콘의 경우는 어닐링 전후에 상관없이 (110)집합조직인 주상정 조직을 갖고 있다. 어몰퍼스실리콘을 결정화시킨 경우는 (111)집합조직를 갖는 등축정 조직을 나타내었다. 실리콘의 표면에너지가 낮은 (111)면이TiS$i_2$ 막의 하부 폴리실리콘에 많이 존재할수록 응집은 촉진된다.

• 한국결정성장학회지
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• 제31권1호
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• pp.37-42
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• 2021

화학적 조성이 TiZrN 박막의 구조적 특성 및 열적 특성에 미치는 영향을 조사하였다. 증착된 TixZr1-xN(x = 0.87, 0.82, 0.7, 0.6, 0.28) 박막에서 Zr 분율이 증가함에 따라 결정립 크기가 감소하고 주상 구조에서 입계상 구조로 점진적으로 변화하는 미세구조 변화가 관찰되었다. 또한 XRD 분석을 통해 Zr 분율이 0.4까지 증가할 때 TiN 상에서 TiZrN 상으로의 점진적인 결정상 전이가 일어났음을 확인하였다. 900℃ 온도에서의 열처리 이후 Ti0.82Zr0.18N과 Ti0.7Zr0.3N 박막은 rutile 상 TiO2와 TiZrO4 산화물이 공존하는 형태로 전환된 반면에 Ti0.6Zr0.4N 박막은 TiZrO4 산화물로 변화함을 확인하였다. 다섯 가지 조성의 TiZrN 박막 중에서 Ti0.6Zr0.4N 박막이 가장 우수한 고온 안정성을 나타내었고, Inconel 617 기판의 열산화에 의해 발생하는 Cr의 표면 확산을 억제하는 열산화 저항성 향상 효과가 가장 우수함을 확인하였다.

• 센서학회지
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• 제26권6호
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• pp.438-444
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• 2017

In this paper, we focus on optimization of the in-situ phosphorous (P) doping of low-pressure chemical vapor deposited (LPCVD) poly Si resistors for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $600^{\circ}C$. The deposited poly Si films were annealed by rapid thermal anneal (RTA) process at the temperature range from 900 to $1000^{\circ}C$ for 90s in nitrogen ambient to relieve intrinsic stress and decrease the TCR in the poly Si layer and get the Ohmic contact. After the RTA process, a roughness of the thin film was slightly changed but the grain size and crystallinity of the thin film with the increase in anneal temperature. The film annealed at $1,000^{\circ}C$ showed the behavior of Schottky contact and had dislocations in the films. Ohmic contact and TCR of $334.4{\pm}8.2$ (ppm/K) within 4 inch wafer were obtained in the measuring temperature range of 25 to $600^{\circ}C$ for the optimized 200 nm thick-poly Si film with width/length of $20{\mu}m/1,800{\mu}m$. This shows the potential of in-situ P doped LPCVD poly Si as a resistor for pressure sensor in harsh environment applications.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.109-110
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• 2006

In bio applications, high temperature coefficient of resistance (TCR) at $30^{\circ}C{\sim}40^{\circ}C$ is especially important for a temperature sensor. In this work, single phase-vanadium dioxide ($VO_2$) thin films for temperature sensor were fabricated by reactive DC magnetron sputtering and post-annealing method. VOx thin films deposited by reactive sputtering in a controlled $Ar/O_2$ atmosphere can be transformed into single phase-$VO_2$ films by post-annealing in $N_2$ atmosphere. The grown $VO_2$ thin films have a moderate resistance at room temperature and very high TCR at room temperature and transition temperature, respectively 2.88%/K and 15.8%/K. A detailed structural characterization is performed by SEM, XRD and RBS. SEM morphology image indicates that grains of fabricated $VO_2$films are homogeneous and ball-like in shape. A fact that the films contain only single phase-$VO_2$ is obtained by XRD and RBS analysis. After deposition, the sensors were fabricated by micromachining technology. Silicon nitride membrane and black nickel were used for a thermal isolation structure and absorption layer. In the vicinity of room temperature, the TCR of sensors was enough high to apply for bio sensors.

• Current Photovoltaic Research
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• 제3권1호
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• pp.32-38
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• 2015

CIGS solar cell consisted of various films. In this research, we investigated electrode materials in $Cu(In,Ga)Se_2$ (CIGS) cells, including Al-doped ZnO (ZnO:Al), intrinsic ZnO (i-ZnO), and Al films. The sputtered ZnO:Al film with a sputtering power at 200W showed the lowest series resistance and highest cell efficiency. The electrical resistivity of the 200-W sputtered ZnO:Al film was $5.2{\times}10^{-4}{\Omega}{\cdot}cm$ by the rapid thermal annealing at $200^{\circ}C$ for 1 min. The electrical resistivity of i-ZnO was not measurable due to its high resistance. But the optical transmittance was highest with less oxygen supply and high efficiency cell was achieved with $O_2/(Ar+O_2)$ ratio was 1% due to the increase of short-circuit current. No significant change in the cell performance by inserting a Ni layer between Al and ZnO:Al films was observed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.3-4
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• 2006

In this paper, a nickel silicide technology with post-silicidation annealing effect for thin film SOI devices is investigated in detail. Although lower resistivity Ni silicide can be easily obtained at low forming temperature, poor thermal stability and changing of characteristic are serious problems during the post silicidation annealing like ILD (Inter Layer Dielectric) deposition or metallization. So these effects are observed as deposited Ni thickness differently on As doped SOI (Si film 30nm). Especially, the sheet resistance of Ni thickness deposited 20nm was lower than 30nm before the post silicidation annealing. But after the post silicidation annealing, the sheet resistance was changed. Therefore, in thin film SOI MOSFETs or Ni-FUSI technology that the Si film is less than 50nm, it is important to decide the thickness of deposited Ni in order to avoid forming high resistivity silicide.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.171-171
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• 2010

GaN 기반 Light emitting diodes(LEDs)의 p-type doping layer는 일반적으로 hole을 발생시키는 acceptor로 Mg이 사용하되고 있다. 보통 Mg이 도핑된 p-type GaN은 >$1\;{\Omega}{\cdot}cm$의 저항이 존재하는데 그 이유는 Mg의 열적 이온화를 위한 activation 에너지가 높아서 상온에서 valence band의 hole concentration는 전체 억셉터 농도의 1%가 되지 않기 ��문이다. 본 논문에서는 높은 hole 농도를 얻기 위해서 metalorganic chemical-vapor deposition (MOCVD)를 장비를 사용하여 사파이어 기판의 misorientation-angle에 따른 p-type a-plane(11-20) GaN 특성을 분석하였다. misorientation-angle은 c축 방향으로 $+0.15^{\circ}$, $-0.15^{\circ}$, $-0.2^{\circ}$, $-0.4^{\circ}$ off된 r-plane(1-102) 사파이어 기판 을 사용하였다. p-type 도핑물질로 bis-magnesium (Cp2Mg) 소스를 사용하였고 성장 과정중 발생하는 hydrogen passivation으로 인한 Mg-H complexes현상을 해결하기위해 conventional furnace annealing (CFA)와 rapid thermal annealing (RTA)를 이용하여 열처리 공정을 진행하였다. 열처리 공정은 Air와 N2 분위기에서 $650^{\circ}C$에서 $900^{\circ}C$ 사이의 다양한 온도에서 수행하였고 Hall 측정을 위해 Ni을 전극 물질로 사용하였다. 상온에서 Accent HL5500IU Hall system을 사용하여 hole concentration, mobility, specific resistance을 측정하였다. 열처리 공정 후 Hall측정 결과 $+0.15^{\circ}$, $-0.15^{\circ}$, $-0.2^{\circ}$, $-0.4^{\circ}$ off된 각 샘플들은 온도, 시간, 분위기에 따라 hole concentration ($7.4{\times}10^{16}cm^{-3}{\sim}6{\times}10^{17}cm^{-3}$), mobility(${\mu}h=\;1.72\;cm^2/V-s\;{\sim}15.2\;cm^2/V-s$), specific resistance(4.971 ohm-cm ~8.924 ohm-cm) 가 변화됨을 확인 할 수 있었다. 또한 광학적 특성을 분석하기 위해 Photoluminescence (PL)을 측정하였다.

• 대한금속재료학회지
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• 제46권10호
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• pp.646-651
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• 2008

The electrolytic reduction of spent oxide fuel involves the liberation of oxygen in a molten LiCl electrolyte, which results in a chemically aggressive environment that is too corrosive for typical structural materials. It is essential to choose the optimum material for the process equipment handling molten salt. IN713LC is one of the candidate materials proposed for application in electrolytic reduction process. In this study, yttria-stabilized zirconia (YSZ) top coat was applied to a surface of IN713LC with an aluminized metallic bond coat by an optimized plasma spray process, and were investigated the corrosion behavior at $675^{\circ}C$ for 216 hours in the molten salt $LiCl-Li_2O$ under an oxidizing atmosphere. The as-coated and tested specimens were examined by OM, SEM/EDS and XRD, respectively. The bare superalloy reveals obvious weight loss, and the corrosion layer formed on the surface of the bare superalloy was spalled due to the rapid scale growth and thermal stress. The top coatings showed a much better hot-corrosion resistance in the presence of $LiCl-Li_2O$ molten salt when compared to those of the uncoated superalloy and the aluminized bond coatings. These coatings have been found to be beneficial for increasing to the hot-corrosion resistance of the structural materials for handling high temperature lithium molten salts.