• Journal of the Korean GEO-environmental Society
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• v.18 no.12
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• pp.37-45
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• 2017

Structural instability and damage are caused by frost heave during the winter when atmospheric temperature maintains below $0^{\circ}C$. Frost heave is the most representative engineering characteristics of frozen ground and there are various frost susceptibility criteria. Frost susceptibility criteria can be roughly divided into three categories. First, frost susceptibility is determined from particle size distribution, which is practically useful and many countries are adopting. In this paper, several particle size distributions (PSDs) are applied to the frost susceptibility criteria but PSD seems to be not enough to determine whether soils are frost susceptible. Second, it is judged from laboratory frost heave testing results. Laboratory frost heave tests were performed with newly developed thermal controlled triaxial cell and the reliability of frost susceptibility criteria is evaluated. New testing apparatus and method are suitable to meet the existing frost susceptibility criteria. Third, it is compositive frost susceptibility criteria envelope including the particle size distribution, soil classification, and frost heave test. The compositive frost susceptibility criteria envelope should be supplemented based on additional data on various soil types.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korean Solar Energy Society
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• v.34 no.2
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• pp.32-43
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• 2014

This study set out to identify the importance of each factor influencing facility selection with a survey among public medical facilities under the category of public buildings and apply the importance of economy, technology and environment with the weighting factor method, thus proposing optimal application plans. The research content of each section can be summarized as follows:1) Estimated energy consumption according to the energy simulation was 65,129MWh/yr, which was 18.7% higher than that according to the calculation equation. Of the energy consumption, more than 80% was used by heating and cooling facilities and construction facilities, and 20% was used by electronics such as medical equipments and in and outdoor lighting. 2) The results of a survey on the factors influencing the importance when selecting a new and renewable energy system reveal that the upper items had a priority in economy, environment, and technology in the descending order and that the lower item shad a priority in initial investments, maintenance and repair costs=energy costs, supply reliability, energy efficiency and $CO_2$ emissions in the descending order. 3) The application alternatives were analyzed in economy, technology, and environment. As a result, a geothermal system turned out to be the most excellent one a cross all the upper and lower comparison items. Of the other systems, a solar thermal system was superior in initial investments, maintenance and repair costs, and energy efficiency, where as a photovoltaic system was superior in energy costs, supply reliability, and $CO_2$ emissions. 4) As for the mixed application ratio among economy, technology, and environment, when the percentage of a geothermal system was approximately 80% or higher in anew and renewable energy system, it was the best and most optimal application plan.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.17-24
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• 2008

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.3
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• pp.243-254
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• 2014

It is essential to predict the coil temperature under over load and over speed conditions for reliability in high speed low torque surface mounted PM synchronous motors(SPM). In the present study, the losses and coil temperature are measured under rated condition and calculated under over speed and over load conditions in the three different motors with 35PN440, 25PN250 and 15HTH1000. The heat transfer modeling has been performed based on acquired losses and temperature. The difference of coil temperature between heat transfer modeling and experiment is less than 6.4% under no load, over speed and over load conditions. Subsequently, the coil temperature of the motor with 15HTH1000 is 84.4% of the coil temperature of the motor with 35PN440 when speed is 0.9 and load is 3.0. The output of motor with 15HTH1000 is 85.2% greater than the output of the motor with 35PN440 when the dimensionless coil temperature is 1.0.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.6
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• pp.255-260
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• 2023

As demanding the detection of explosive molecules, it is required to develop rapidly and precisely responsive sensors with ultra-high sensitivity. Since two-dimensional semiconductors have an atomically thin body nature where mobile carriers accumulate, the abrupt modulation carrier in the thin body channel can be expected. To investigate the effectiveness of WSe₂ semiconductor materials as a detection material for TNT (Trinitrotoluene) explosives, WSe₂ was synthesized using thermal chemical vapor deposition, and afterward, WSe₂ FETs (Field Effect Transistors) were fabricated using standard photo-lithograph processes. Raman Spectrum and FT-IR (Fourier-transform infrared) spectroscopy reveal that the adsorption of TNT molecules induces the structural transition of WSe₂ crystalline. The electrical properties before and after adsorption of TNT molecules on the WSe₂ surface were compared; as -50 V was applied as the back gate bias, 0.02 μA was recorded in the bare state, and the drain current increased to 0.41 μA with a dropping 0.6% (w/v) TNT while maintaining the p-type behavior. Afterward, the electrical characteristics were additionally evaluated by comparing the carrier mobility, hysteresis, and on/off ratio. Consequently, the present report provides the milestone for developing ultra-sensitive sensors with rapid response and high precision.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.