• 제목/요약/키워드: Thermal reliability

검색결과 1,063건 처리시간 0.027초

시험공간에 대한 냉방부하 실증실험 및 계산 (Verification Experiment and Calculation of Cooling Load for a Test Space)

  • 유호선;현석균;김용식;홍희기
    • 설비공학논문집
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    • 제15권8호
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    • pp.641-651
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    • 2003
  • In order to assess the reliability of a building energy simulation program (TRNSYS) from the standpoint of user, a set of verification experiment and calculation of cooling load for a test space is carried out. This work is a complement of the previous study that dealt with heating load for the same space. The test space is kept airtight to eliminate the source of uncertainties in modeling. A window-mounted, on/off controlled air-conditioner is used for cooling, whose performance has been established a priori. The calculation encompasses two models for evaluating cooling load in TRNSYS: energy rate control and temperature level control. Comparison of the total cooling loads obtained from different sets of experimental data enables to validate the measurements. The experimental result shows that the latent load is fairly large even in the absence of apparent air change in the space, which needs to be clarified. Each of hourly and daily accumulated sensible loads is compared between the experiment and two calculation models. Despite an inconsistency associated with solar irradiation, both of the models agree favorably with the experiment within a tolerance, illustrating their capability of properly predicting space thermal loads.

전기자동차 파워모듈용 질화규소 기판의 열기계적 특성 및 열응력 해석에 대한 연구 (A Study of Thermo-Mechanical Behavior and Its Simulation of Silicon Nitride Substrate on EV (Electronic Vehicle)'s Power Module)

  • 서원;정청하;고재웅;김구성
    • 반도체디스플레이기술학회지
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    • 제18권4호
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    • pp.149-153
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    • 2019
  • The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

고온 환경에서 적용 가능한 병진관절을 갖는 수직 다관절 로봇시스템 개발 및 내구성 분석에 관한 연구 (A Study on Design and Durability Analysis of Vertical Multi-Jointed Robot with Translational Joint to adapt in the High Temperature Environment)

  • 김두범;김희진;배호영;김상현;임오득;한성현;강정석;노성훈
    • 한국산업융합학회 논문집
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    • 제22권3호
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    • pp.337-351
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    • 2019
  • We Proposed a new technology to develop vertical type multi-joint robot system enable to adapt in high temperature environment. The main contents is a new approach to design a vertical type articulated robot with prismatic joint and analysis of thermal for process automation of casting and forging. The proposed robot is suitable to use handling working parts of casting and forging. for the manufacturing process of forging and casting. The reliability is illustrated that the proposed technique is more stable and robust than the conventional system. This study is concerned with an analytical methodology of kinematic computation for 7 DOF manipulators for optimization of forging manufacturing process.

카본 세라믹 복합재 디스크의 벤트 구조 최적화를 통한 냉각성능 향상에 관한 연구 (A Study on Improvement of Cooling Performance through Vent Structure Optimization of Carbon Ceramic Composite Disc)

  • 심재훈;신웅희;이중희;전갑배;김병철;곽정후;임동원;현은재;전태형;이재만
    • 자동차안전학회지
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    • 제11권1호
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    • pp.23-29
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    • 2019
  • Recently, use of composite materials has been increasing for body structures and chassis parts in the car industry because of weight reduction effect and excellent mechanical thermal characteristics. However, application of composite materials in brake system is very difficult because it is hard to obtain enough brake performance due to low heat storage capacity of the composite materials. In this paper, we will present new carbon ceramic composite disc with high flow characteristic. To obtain this characteristic, new vent structures were designed by using ARIZ method and substance-field model analysis. The flow effect of these vent structures on the brake performance was verified by pugh matrix and cooling test. The test results show improvement of cooling performance up to $30^{\circ}C$. Finally, These results will improve brake the reliability of the brake performance for the high performance vehicles and electric vehicles.

시각동기를 위한 FPGA 기반의 Inter-Regional Instrument Group-B 디코더 설계 (Design of Inter-Regional Instrument Group-B Decoder Based on FPGA for Time Synchronous)

  • 김용훈;양오
    • 반도체디스플레이기술학회지
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    • 제18권1호
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    • pp.59-64
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    • 2019
  • Recently, time synchronous has become important for satellite launch control facilities, multiple thermal power plants, and power system facilities. Information from time synchronous at each of these industrial sites requires time synchronization to control or monitor the system with correlation. In this paper, IRIG-B codes, which can be used for time synchronous, are used as specifications in IRIG standard 200-16. Signals from IRIG-B120 (Analog), IRIG-B000 (Digital), and one PPS are output from GPS receiver. Using the signal from IRIG-B120 (Analog), it passes through the signal from the analog amplifier and generates one PPS signal using the field-programmable gate array. The FPGA is used cyclone EPM570T100I5N. According to IEEE regulations, the error of one PPS is specified within 1us, but in this paper, the error is within 100ns. The output of the one PPS signal was then compared and tested against the one PPS signal on the GPS receiver to verify accuracy and reliability. In addition, the proposed time synchronous is simple to construct and structure, easy to implement, and provides high time precision compared to typical time synchronous. The output of the one PPS signals and IRIG-B000 signal will be used in many industry sectors.

바이오 센서 적용을 위한 수직형 이중게이트 InGaAs TFET의 게이트 열화 현상 분석 (Constant Voltage Stress (CVS) and Hot Carrier Injection (HCI) Degradations of Vertical Double-date InGaAs TFETs for Bio Sensor Applications)

  • 백지민;김대현
    • 센서학회지
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    • 제31권1호
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    • pp.41-44
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    • 2022
  • In this study, we have fabricated and characterized vertical double-gate (DG) InGaAs tunnel field-effect-transistors (TFETs) with Al2O3/HfO2 = 1/5 nm bi-layer gate dielectric by employing a top-down approach. The device exhibited excellent characteristics including a minimum subthreshold swing of 60 mV/decade, a maximum transconductance of 141 µS/㎛, and an on/off current ratio of over 103 at 20℃. Although the TFETs were fabricated using a dry etch-based top-down approach, the values of DIBL and hysteresis were as low as 40 mV/V and below 10 mV, respectively. By evaluating the effects of constant voltage and hot carrier injection stress on the vertical DG InGaAs TFET, we have identified the dominant charge trapping mechanism in TFETs.

Development of Semiconductor Packaging Technology using Dicing Die Attach Film

  • Keunhoi, Kim;Kyoung Min, Kim;Tae Hyun, Kim;Yeeun, Na
    • 센서학회지
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    • 제31권6호
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    • pp.361-365
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    • 2022
  • Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

KSTAR 저온 및 구조 계측 시스템 운전 결과 (Operation result of the Cryogenic and Mechanical Measurement System for KSTAR)

  • 김영옥;추용;요네가와;방은남;이태구;백설희;홍재식;이상일;박갑래;오영국
    • 한국초전도ㆍ저온공학회논문지
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    • 제11권3호
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    • pp.26-30
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    • 2009
  • Korea Superconducting Tokamak Advanced Research(KSTAR) device is composed of 30 superconducting magnets, magnet structure, vacuum vessel, cryostat, current feeder system, and etc. KSTAR device is operated in the cryogenic temperature and high magnetic field. We install about 800 sensors - temperature sensors, stain gages, displacement gages, hall sensors - to monitor the thermal, mechanical, electrical status of KSTAR during operation. As a tremendous numbers of sensors should be installed for monitoring the KSTAR device, the method of effective installation was developed. The sensor test was successfully carried out to check its reliability and its reproduction in the cryogenic temperature. The sensor signal is processed by PXI-based DAQ system and communicated with central control system via machine network and is shown by Operator Interface(OPI) display in the main control room. In order to safely operate the device, any violations of mechanical & superconductive characteristic of the device components were informed to its operation system & operator. If the monitored values exceed the pre-set values, the protective action should be taken against the possible damage. In this paper, the system composition, operation criteria, operation result were presented.

Enhance photoelectric efficiency of PV by optical-thermal management of nanofilm reflector

  • Liang, Huaxu;Wang, Baisheng;Su, Ronghua;Zhang, Ao;Wang, Fuqiang;Shuai, Yong
    • Advances in nano research
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    • 제13권5호
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    • pp.475-485
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    • 2022
  • Crystalline silicon photovoltaic cells have advantages of zero pollution, large scale and high reliability. A major challenge is that sunlight wavelength with photon energy lower than semiconductor band gap is converted into heat and increase its temperature and reduce its conversion efficiency. Traditional cooling PV method is using water flowing below the modules to cool down PV temperature. In this paper, the idea is proposed to reduce the temperature of the module and improve the energy conversion efficiency of the module through the modulation of the solar spectrum. A spectrally selective nanofilm reflector located directly on the surface of PV is designed, which can reflect sunlight wavelength with low photon energy, and even enhance absorption of sunlight wavelength with high photon energy. The results indicate that nanofilm reflector can reduce spectral reflectivity integral from 9.0% to 6.93% in 400~1100 nm wavelength range, and improve spectral reflectivity integral from 23.1% to 78.34% in long wavelength range. The nanofilm reflector can reduce temperature of PV by 4.51℃ and relatively improved energy conversion efficiency of PV by 1.25% when solar irradiance is 1000 W/m2. Furthermore, the nanofilm reflector is insensitive in sunlight's angle and polarization state, and be suitable for high irradiance environment.

An analytical solution for compaction grouting problem considering exothermic temperature effect of slurry

  • Chao Li;Yingke Liu;Man Yuan;Tengrui Yang
    • Geomechanics and Engineering
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    • 제35권6호
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    • pp.593-601
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    • 2023
  • In this paper, an analytical solution of large-strain cylindrical cavity expansion in compaction grouting problem under temperature field is given. Considering the stress increment caused by temperature, the analytical solution of cavity expansion under traditional isothermal conditions is improved by substituting the temperature stress increment into the cavity expansion analysis. Subsequently, combined with the first law of thermodynamics, the energy theory is also introduced into the cylindrical cavity expansion analysis, and the energy dissipation solution of cylindrical cavity expansion is derived. Finally, the validity and reliability of solution are proved by comparing the results of expansion pressure with those in published literatures. The results show that the dimensionless expansion pressure increases with the increase of temperature, and the thermal response increases with the increase of dilation angle. The higher the exothermic temperature of grouting slurry, the greater the plastic deformation energy of the surrounding soil, that is, the greater the influence on the surrounding soil deformation and the surrounding environment. The proposed solution not only enrich the theoretical system of cavity expansion, but also can be used as a theoretical tool for energy geotechnical engineering problems, such as CPT, nuclear waste disposal, energy pile and chemical grouting, etc.