A Study of Thermo-Mechanical Behavior and Its Simulation of Silicon Nitride Substrate on EV (Electronic Vehicle)'s Power Module |
Seo, Won
(Electronic Packaging Research Center, Kangnam University)
Jung, Cheong-Ha (Electronic Packaging Research Center, Kangnam University) Ko, Jae-Woong (Korea Institute of Materials Science) Kim, Gu-Sung (Electronic Packaging Research Center, Kangnam University) |
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