• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.2
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• pp.95-102
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• 2011

A ground loop heat exchanger in a ground source heat pump system is an important unit that determines the thermal performance of a system and its initial cost. A proper design requires certain site specific parameters, most importantly the ground effective thermal conductivity, the borehole thermal resistance and the undisturbed ground temperature. This study was performed to investigate the effect of some parameters such as borehole lengths, various grouting materials and U tube configurations on ground effective thermal conductivity and borehole thermal resistance. In this study, thermal response tests were conducted using a testing device to 9 different ground loop heat exchangers. From the experimental results, the length of ground loop heat exchanger affects to the effective thermal conductivity. The results of this experiment shows that higher thermal conductivity of grouting materials leads to the increase effective thermal conductivity from 22 to 32%. Also, mounting spacers have increased by 14%.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.872-875
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• 2004

In this paper, thermal response analysis of a temperature controlled three-axis accelerometer for high temperature environments with integrated micro-heaters and temperature sensors is investigated with finite element method (FEM) program, ANSYS and infrared thermal measurement systems. And availability to application fields from a viewpoint about short thermal response time is discussed. In this paper, the time of three-axis accelerometer for high temperatures becoming $300^{\circ}C$ by integrated micro-heaters and temperature sensors to reduce thermal drift characteristics was analyzed as a thermal response time of this device. The simulated thermal response time (time until SOI piezoresistors actually becomes $300^{\circ}C$) of three-axis accelerometer for high temperatures with ANSYS is about 0.6s, and measured result with infrared temperature measurement systems is about 0.64s. Experimental results using infrared thermal measurement systems agreed well with these theoretical results.

• International Journal of Fluid Machinery and Systems
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• v.2 no.1
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• pp.55-60
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• 2009

The present study investigated temperature and thermal stress distributions in a film cooling system with normal injection cooling flow. 3D-numerical simulations using the FEM commercial code ANSYS were conducted to calculate distributions of temperature and thermal stresses. In the simulations, the surface boundary conditions used the surface heat transfer coefficients and adiabatic wall temperature which were converted from the Sherwood numbers and impermeable wall effectiveness obtained from previous mass transfer experiments. As a result, the temperature gradients, in contrast to the adiabatic wall temperature, were generated by conduction between the hot and cold regions in the film cooling system. The gradient magnitudes were about 10~20K in the y-axis (spanwise) direction and about 50~60K in the x-axis (streamwise) direction. The high thermal stresses resulting from this temperature distribution appeared in the side regions of holes. These locations were similar to those of thermal cracks in actual gas turbines. Thus, this thermal analysis can apply to a thermal design of film cooling holes to prevent or reduce thermal stresses.

• Journal of Power Electronics
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• v.14 no.6
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• pp.1345-1356
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• 2014

The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

• Journal of Biomedical Engineering Research
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• v.29 no.5
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• pp.343-347
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• 2008

Thermal conductivity, thermal diffusivity were measured in the atrium of a swine heart. Radiofrequency (RF) catheter ablation in an atrium has rapidly emerged at the treatment of symptomatic reentrant arrhythmia associated with accessory pathway or Atrioventricular (AV) node conduction. The thermal properties of an atrium are definitely necessary for these treatments because, in thermal treatments, conductivity and diffusivity are significant factors in the relationship between the applied RF power and the resulting atrium temperature rise. Thermal properties were measured using a self-heated thermistor probe. Thermistor probes were inserted into the tissue of interest and were used to supply heat within the tissue as well as to monitor the temperature rise in the tissue. The measurements were performed at temperatures of 25, 37, $50^{\circ}C$. Atrium thermal conductivity ranged from 5.17$\pm$0.12 mW/cm$^{\circ}C$ at $25^{\circ}C$ to 5.33$\pm$0.08 mW/cm$^{\circ}C$ at $37^{\circ}C$. Atrium thermal diffusivity ranged from 0.00132$\pm$0.00007$cm^2$/sec at $25^{\circ}C$ to 0.00138$\pm$0.00003 $cm^2$/sec at $50^{\circ}C$. This paper also present the thermal property comparison of both chambers of a heart (ventricle and atria).

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.25-31
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• 2017

This study investigates changes in the mechanical behaviors, especially hardness and indentation load-displacement curves, of thermal barrier coatings (TBCs) brought about by thermal shock. The TBCs on the Nickel-based bondcoat/superalloy was prepared with diameters of 25.4 mm and $600{\mu}m$ thickness. The results of thermal shock cycling test from $1100^{\circ}C$ of the highest temperature indicate that the thermal shock do not influence on the mechanical behavior, but a continuous decrease in porosity and increase in hardness were observed after 1200 thermal shock cycles; these changes are believed to be due to sintering of thermal barrier coating materials. The results that no degradation in the indentation load-displacement curves indicate that the coating shows good thermal shock resistance up to 1200 cycles at $1100^{\circ}C$ in air.

• Steel and Composite Structures
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• v.46 no.5
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• pp.649-658
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• 2023

Although some scholars have studied the thermal post-buckling of graphene platelets strengthened metal foams (GPLRMFs) plates, they have not considered the influence of initial geometrical imperfection. Inspired by this fact, the present paper studies the thermal post-buckling characteristics of GPLRMFs plates with initial geometrical imperfection. Three kinds of graphene platelets (GPLs) distribution patterns including three patterns have been considered. The governing equations are derived according to the first-order plate theory and solved with the help of the Galerkin method. According to the comparison with published paper, the accuracy and correctness of the present research are verified. In the end, the effects of material properties and initial geometrical imperfection on the thermal post-buckling response of the GPLRMFs plates are examined. It can be found that the presence of initial geometrical imperfection reduces the thermal post-buckling strength. In addition, the present study indicates that GPL-A pattern is best way to improve thermal post-buckling strength for GPLRMFs plates, and the presence of foams can improve the thermal post-buckling strength of GPLRMFs plates, the Foam- II and Foam- I patterns have the lowest and highest thermal post-buckling strength. Our research can provide guidance for the thermal stability analysis of GPLRMFs plates.

• Journal of Aerospace System Engineering
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• v.10 no.4
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• pp.26-34
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• 2016

In a number of industries, porous insulations have been frequently used, reducing thermal insulation space through excellent performance of the thermal insulation's characteristics. This paper suggests an effective thermal conductivity prediction model. Firstly, we perform a literature review of traditional effective thermal conductivity prediction models and compare each model with experimental heat transfer results. Furthermore, this research defines the effectiveness of thermal conductivity prediction models using experimental heat transfer results and the Zehner-Schlunder model. The newly defined effective thermal conductivity prediction model has been verified to better predict performance than other models. Finally, this research performs a transient heat transfer analysis of a thermal protection system with a porous insulation in a high speed vehicle using the finite element method and confirms the validity of the effective thermal conductivity prediction model.

• Journal of computational fluids engineering
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• v.19 no.4
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• pp.37-44
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• 2014

A detailed satellite panel thermal model composed of more than thousands nodes can not be directly integrated into a spacecraft thermal model due to its node size and the limitation of commercial satellite thermal analysis programs. For the integration of the panel into the satellite thermal model, a reduced thermal model having proper accuracy is required. A thermal model reduction method was developed and validated by using a geostationary satellite panel. The temperature differences of main components between the detailed and the reduced thermal model were less than $1^{\circ}C$ in steady state analysis. Also, the dynamic responses of the detailed and the reduced thermal model show very similar trends. Thus, the developed reduction method can be applicable to actual satellite thermal design and analysis with resonable accuracy and convenience.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.4
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.