Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Thermal Response Analysis of a Low Thermal Drift Three-axis Accelerometer for High Temperature Environments

  • Ishida Makoto (Department of Electrical and Electronic Engineering) ;
  • Lee Kyung Il (Venture Business Laboratory, Toyohashi University of Technology) ;
  • Takao Hidekuni (Department of Electrical and Electronic Engineering) ;
  • Sawada Kazuaki (Department of Electrical and Electronic Engineering) ;
  • Seo Hee Don (Department of Electrical and Electronic Engineering, Yeungnam University)
  • Published : 2004.08.01
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Abstract

In this paper, thermal response analysis of a temperature controlled three-axis accelerometer for high temperature environments with integrated micro-heaters and temperature sensors is investigated with finite element method (FEM) program, ANSYS and infrared thermal measurement systems. And availability to application fields from a viewpoint about short thermal response time is discussed. In this paper, the time of three-axis accelerometer for high temperatures becoming $300^{\circ}C$ by integrated micro-heaters and temperature sensors to reduce thermal drift characteristics was analyzed as a thermal response time of this device. The simulated thermal response time (time until SOI piezoresistors actually becomes $300^{\circ}C$) of three-axis accelerometer for high temperatures with ANSYS is about 0.6s, and measured result with infrared temperature measurement systems is about 0.64s. Experimental results using infrared thermal measurement systems agreed well with these theoretical results.

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